TechConnect Innovation Program

Ready to Market

Modula S Inc., ID, United States

TECHNOLOGY SUMMARY

Modula S is an ultra-efficient building system making the construction of tall urban “NetZero” buildings, practical, fast and affordable. Our R-60 ultra-efficient thermal envelope technology reduces the need for heating or cooling. The Modula S structural system reinforces concrete without the use of rebar making urban housing affordable.

Primary Application Area: Energy & Efficiency

Technology Development Status: Ready to Market

Technology Readiness Level:

FIGURES OF MERIT

Value Proposition:

SHOWCASE SUMMARY

Organization Type: Early-stage Startup (Seed)

Showcase Booth #: 325

Website: www.modula-s.com

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date: