TechConnect Innovation Program

Gapless and Seamless Wafer-Scale Detector System for High Resolution Imaging

Fermi National Accelerator Laboratory, IL, United States

TECHNOLOGY SUMMARY

The technology is a pixelated detector system whose basic module size well exceeds that of any currently available device. Its size is equal to that of a full sensor wafer, and the device is completely seamless with no dead zones.

Primary Application Area: Electronics, Sensors & Communications

Technology Development Status: Prototype

Technology Readiness Level: TRL 4

FIGURES OF MERIT

Value Proposition: Ultra high resolution imaging technology using wafer scale pixeelated detector system with no dead zone ensures that critical information is captured cleanly and with a fine degree of detail.

SHOWCASE SUMMARY

Organization Type: Academic/Gov Lab

Showcase Booth #: 627

Website: www.fnal.gov

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date: Research and development is funded by the U.S. Department of Energy, Office of Science, Office of High Energy Phyaics.

Primary Sources of Funding: Federal Grant

Looking for: Both Funding and Development Partners