TechConnect Innovation Program

Inorganic (GaN – InGaN) microLED arrays for light projection or Head Up Displays and Head Mounted Displays

CEA Tech, Rhône-alpes, France

TECHNOLOGY SUMMARY

A pixilation technology of GaN-InGaN epiwafers compatible with all substrate materials was developed to produce 10µm-pitch or less microdiodes with a reduced number of process steps. It enables new generation of arrays with higher density and higher fill factor

Primary Application Area: Electronics, Sensors & Communications

Technology Development Status: Prototype

Technology Readiness Level: TRL 4

FIGURES OF MERIT

Value Proposition: Currently available microdisplays for both head mounted displays and compact HUD applications suffer from fundamental technology limitations that prevent the design of very low weight, compact and low energy consumption products. This technology is the first demonstration of a high density micro-LED array scalable to a standard microelectronic large scale process. The concept is protected by patents.

SHOWCASE SUMMARY

Organization Type: Academic/Gov Lab

Global Innovation Awardee

Showcase Booth #: 728

Website: http://www.cea.fr/english-portal/cea-tech

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date:

Primary Sources of Funding: Federal Grant

Looking for: Both Funding and Development Partners