3D Semiconductor Interposers
Triton Microtechnologies, AZ, United States
Triton Microtechnologies designs and manufactures glass interposers which are tiny glass structures having thousands of nano-scale holes. The holes are then precisely filled with a variety of conductive material so as to allow electrical conduction through the glass. Precision equipment is required to drill and fill the holes.
Primary Application Area: Electronics, Sensors & Communications
Technology Development Status: Ready to Market
Technology Readiness Level: TRL 6
FIGURES OF MERIT
Value Proposition: Our value proposition is to eliminate 2 dimensional printed wiring board semiconductor methodologies and replace them with 3 dimensional semiconductors using Triton’s glass interposer technologies. We will add metallization patterning to rival printed wiring board interconnections and add other features such as antenna patterning to deliver a complete solution.
Organization Type: Corporation
Showcase Booth #: 57T
GOVT/EXTERNAL FUNDING SOURCES
Government Funding/Support to Date:
Primary Sources of Funding: Corporate Venture Capital
Looking for: Both Funding and Development Partners