TechConnect Innovation Program

3D Semiconductor Interposers

Triton Microtechnologies, AZ, United States

TECHNOLOGY SUMMARY

Triton Microtechnologies designs and manufactures glass interposers which are tiny glass structures having thousands of nano-scale holes. The holes are then precisely filled with a variety of conductive material so as to allow electrical conduction through the glass. Precision equipment is required to drill and fill the holes.

Primary Application Area: Electronics, Sensors & Communications

Technology Development Status: Ready to Market

Technology Readiness Level: TRL 6

FIGURES OF MERIT

Value Proposition: Our value proposition is to eliminate 2 dimensional printed wiring board semiconductor methodologies and replace them with 3 dimensional semiconductors using Triton’s glass interposer technologies. We will add metallization patterning to rival printed wiring board interconnections and add other features such as antenna patterning to deliver a complete solution.

SHOWCASE SUMMARY

Organization Type: Corporation

National Innovation Awardee

Showcase Booth #: 57T

Website: www.tritonmicrotech.com

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date:

Primary Sources of Funding: Corporate Venture Capital

Looking for: Both Funding and Development Partners