TechConnect Innovation Program

Three Dimensional Block-Copolymer Films Formed By Electrohydrodynamic Jet printing and Self- Assembly

University of Chicago, IL, United States

TECHNOLOGY SUMMARY

A multi-institutional team of engineers has developed a new approach to the fabrication of nanostructures for the semiconductor and magnetic storage industries. This approach combines top-down advanced ink-jet printing technology with a bottom-up approach that involves self-assembling block copolymers, a type of material that can spontaneously form ultrafine structures

Primary Application Area: Electronics, Sensors & Communications

Technology Development Status: Prototype

Technology Readiness Level: TRL 3

FIGURES OF MERIT

Value Proposition: Enhances the capabilities of DSA, a likely next-generation semiconductoring manufacturing process.

SHOWCASE SUMMARY

Organization Type: Academic/Gov Lab

Showcase Booth #: 637

Website: tech.uchicago.edu

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date:

Primary Sources of Funding: University

Looking for: Both Funding and Development Partners