TechConnect Innovation Program

"Quilt Packaging" Microchip Interconnect Technology

Indiana Integrated Circuits, LLC, IN, United States

TECHNOLOGY SUMMARY

Quilt Packaging (QP) is a direct edge-interconnect technology that enables on-chip like performance between chips made from different processes or materials. QP has demonstrated sub-micron alignment accuracy and demonstrated chip-to-chip insertion loss of less than 1dB across the entire bandwidth from DC to 220 GHz.

Primary Application Area: Electronics, Sensors & Communications

Technology Development Status: Proven Manufacturability

Technology Readiness Level: TRL 4

FIGURES OF MERIT

Value Proposition: The value proposition of Quilt Packaging is that it enables different chips to be integrated into one unit that performs as if were a single chip to begin with. This means significant cost, power & latency reductions while simultaneously enabling game-changing system performance.

SHOWCASE SUMMARY

Organization Type: Mid-stage Startup (A or B)

National Innovation Awardee

Showcase Booth #: 20M - 20T

Website: indianaic.com

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date: Indiana Integrated Circuits, LLC has successfully executed Phase I SBIR programs for Air Force and NASA, as well as an R&D program funded by another US Government Agency. Applications explored included GaAs-based large format arrays, InP-Si heterogeneous integration for microwave systems, and satellite imaging applications.

Primary Sources of Funding: Angel, Friends, Family, Corporate Partner

Looking for: Both Funding and Development Partners