TBDB (Temporary Bonding and De-Bonding) for fabricating flexible AMOLED
EnSilTech Corporation, California, United States
In TBDB GO(Graphene Oxide)layer is deposited between glass and flexible PI films. During fabrication of AMOLED devices GO layer should be bonded to the PI films and glass substrate. After fabricating AMOLED devices, flexible PI films are lifted off mechanically from the glass substrate on which GO layer is deposited.
Primary Application Area: Instrumentation & Manufacturing
Technology Development Status: Prototype
Technology Readiness Level: TRL 4
FIGURES OF MERIT
Value Proposition: As mentioned earlier one AMOLED manufacturer in Korea estimated that 300M$ will be saved if EST’s TBDB technology replaces the current EPLaR technique on their mass production line for flexible display. EST has marketing strategies that she will provide both GO solutions and coating equipment to panel making companies.
Organization Type: Early-stage Startup (Seed)
Showcase Booth #: 904
GOVT/EXTERNAL FUNDING SOURCES
Government Funding/Support to Date:
Primary Sources of Funding: Angel, Friends, Family, Corporate Venture Capital
Looking for: Both Funding and Development Partners