TechConnect Innovation Program

TBDB (Temporary Bonding and De-Bonding) for fabricating flexible AMOLED

EnSilTech Corporation, California, United States

TECHNOLOGY SUMMARY

In TBDB GO(Graphene Oxide)layer is deposited between glass and flexible PI films. During fabrication of AMOLED devices GO layer should be bonded to the PI films and glass substrate. After fabricating AMOLED devices, flexible PI films are lifted off mechanically from the glass substrate on which GO layer is deposited.

Primary Application Area: Instrumentation & Manufacturing

Technology Development Status: Prototype

Technology Readiness Level: TRL 4

FIGURES OF MERIT

Value Proposition: As mentioned earlier one AMOLED manufacturer in Korea estimated that 300M$ will be saved if EST’s TBDB technology replaces the current EPLaR technique on their mass production line for flexible display. EST has marketing strategies that she will provide both GO solutions and coating equipment to panel making companies.

SHOWCASE SUMMARY

Organization Type: Early-stage Startup (Seed)

Showcase Booth #: 904

Website: www.ensiltech.com

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date:

Primary Sources of Funding: Angel, Friends, Family, Corporate Venture Capital

Looking for: Both Funding and Development Partners