TechConnect Innovation Program

Conductive Additives for Coating Solutions

PolyDrop, Washington, United States

TECHNOLOGY SUMMARY

PolyDrop’s first generation technology utilizes self-assembly to form large fiber networks of conjugated polymers that expand over much larger distances than single polymer chains. These networks can be simply incorporated into commercial coatings to make them electrically conductive for use in applications to static charge dissipation for CFRC.

Primary Application Area: Aerospace & Defense

Technology Development Status: Prototype

Technology Readiness Level: TRL 9

FIGURES OF MERIT

Value Proposition: PolyDrop markets conductive additives for use in commercial paints, primers, and coatings at much lower particle loading than existing technologies.

Coatings containing PolyDrop’s additives will have:
* Longer useful lifetime,
* Improved adhesion,
* Simple integration into production line

SHOWCASE SUMMARY

Organization Type: Early-stage Startup (Seed)

National Innovation Awardee

Showcase Booth #: 944

Website: www.polydrop.net

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date: Phase I NSF STTR awarded in December 2013.

Primary Sources of Funding: University, Other

Looking for: Both Funding and Development Partners