The epoxy resin for ultra-low CTE (Coefficient of Thermal Expansion) composite up to 1ppm/℃
Korea Institute of Industrial Technology (KITECH), California, United States
We would like to introduce advanced epoxy resin technology. Not only our epoxy resin shows ultra-low CTE as low as ceramic, but also it has the high thermal resistance, good processibility, and high filler efficiency from the special interaction between epoxy and filler surface.
Primary Application Area: Materials & Chemical
Technology Development Status: Ready to Market
Technology Readiness Level: TRL 6
FIGURES OF MERIT
Value Proposition: Ultra-low CTE performance was achieved by the development of new epoxy resin, which can not be attained using the current epoxy technology. In addition to the ultra-low CTE, epoxy system provides excellent heat-resistance over 350℃, processibility, dielectric property, adhesion for the applications of semiconductor packagings, electronics, coatings and adhesives.
Organization Type: Academic/Gov Lab
Showcase Booth #: 110
GOVT/EXTERNAL FUNDING SOURCES
Government Funding/Support to Date:
Primary Sources of Funding: Corporate Partner, Other
Looking for: Both Funding and Development Partners