TechConnect Innovation Program

The epoxy resin for ultra-low CTE (Coefficient of Thermal Expansion) composite up to 1ppm/℃

Korea Institute of Industrial Technology (KITECH), California, United States

TECHNOLOGY SUMMARY

We would like to introduce advanced epoxy resin technology. Not only our epoxy resin shows ultra-low CTE as low as ceramic, but also it has the high thermal resistance, good processibility, and high filler efficiency from the special interaction between epoxy and filler surface.

Primary Application Area: Materials & Chemical

Technology Development Status: Ready to Market

Technology Readiness Level: TRL 6

FIGURES OF MERIT

Value Proposition: Ultra-low CTE performance was achieved by the development of new epoxy resin, which can not be attained using the current epoxy technology. In addition to the ultra-low CTE, epoxy system provides excellent heat-resistance over 350℃, processibility, dielectric property, adhesion for the applications of semiconductor packagings, electronics, coatings and adhesives.

SHOWCASE SUMMARY

Organization Type: Academic/Gov Lab

National Innovation Awardee

Showcase Booth #: 110

Website: www.kitech.re.kr

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date:

Primary Sources of Funding: Corporate Partner, Other

Looking for: Both Funding and Development Partners