TechConnect Innovation Program

Flexible Electronics: Self-aligned lithography for roll-to-roll manufacturing

University of Minnesota, Minnesota, United States

TECHNOLOGY SUMMARY

The technology is a self-aligning, scalable, additive, parallel, and high throughput process for flexible electronics manufacturing.

Primary Application Area: Electronics, Sensors & Communications

Technology Development Status: Prototype

Technology Readiness Level: TRL 3

FIGURES OF MERIT

Value Proposition: Current methods of fabricating flexible electronics include pick-and-place transfer of conventionally fabricated circuits from an initial rigid substrate on a flexible substrate. These processes may face limitations in cost and area scaling. The technology described here may have higher throughput (highly parallel and self-aligned) and is scalable.

SHOWCASE SUMMARY

Organization Type: Academic/Gov Lab

National Innovation Awardee

Showcase Booth #: 716

Website: www.research.umn.edu/techcomm/

GOVT/EXTERNAL FUNDING SOURCES

Government Funding/Support to Date: Office of Naval Research, MURI Award (Multidisciplinary University Research Initiative), N00014-11-1-0690

Primary Sources of Funding: Federal Grant

Looking for: Development / License Partners