Flexible Electronics: Self-aligned lithography for roll-to-roll manufacturing
University of Minnesota, Minnesota, United States
The technology is a self-aligning, scalable, additive, parallel, and high throughput process for flexible electronics manufacturing.
Primary Application Area: Electronics, Sensors & Communications
Technology Development Status: Prototype
Technology Readiness Level: TRL 3
FIGURES OF MERIT
Value Proposition: Current methods of fabricating flexible electronics include pick-and-place transfer of conventionally fabricated circuits from an initial rigid substrate on a flexible substrate. These processes may face limitations in cost and area scaling. The technology described here may have higher throughput (highly parallel and self-aligned) and is scalable.
Organization Type: Academic/Gov Lab
Showcase Booth #: 716
GOVT/EXTERNAL FUNDING SOURCES
Government Funding/Support to Date: Office of Naval Research, MURI Award (Multidisciplinary University Research Initiative), N00014-11-1-0690
Primary Sources of Funding: Federal Grant
Looking for: Development / License Partners