Hermetic Bonding in Single Device Medical Implants, Night Vision Goggles, Marine Sensors Via Wet Nanobonding™ at T< 200°C of Si/Sio2

K. Leaming, S.D. Whaley, N. Herbots, R.B. Bennett-Kennett, C.F. Watson, E.R.C. Morgan, R.J. Culbertson, R.L. Rhoades, S.N. Drews, J.D. Bradley, D.A. Sell, P. Rez, B.J. Wilkens, M.W. Mangus, H.M. Johnson
Arizona State University/SiO2 NanoTech, LLC, US

Keywords: wafer bonding, nanoscale, surface energy, nano manufacturing, nano bonding, Si/SiO2, low temperature, nanoscale, AFM, contact angle,


Wet NanoBonding™ is a low thermal budget processing technology using new molecular interphases to integrate hermetically silica-based sensors into single device electronics. Its applications targets single device integration of dissimilar materials where percolation of fluids can destroy sensors and electronics in a matter of days, for instance in permanent glucose sensors for diabetics. Wet NanoBonding™ can thus prevent percolation of bodily fluids in single device medical implants, of corrosive fluids such as sea water in marine sensors, or reduce defects in night vision goggles where silica lenses are bonded to IR sensing photocathodes. Wet NanoBonding technology uses a 3-step process. The Herbots-Atluri (HA) process allows bonding interphases to be nucleated via an initial extended two-dimensional reacting molecular sheets adsorbed on the surfaces of the materials pair that are to be bonded. Direct contact occurs at the nanoscale, due to the extended atomic terraces. The Nanobonding anneal occurs at T≤ 180°C in H2O/O2 ambient, leading to bonding interphases over large interface domains via unique molecular and surface geometries. Atomistic modeling correlation to test results confirmed by Ion Beam Analysis of changes in hydroaffinity, Tapping Mode Atomic Force Microscopy, and Three Liquid Contact Angle Analysis.