Applied Research & Photonics (ARP)

470 Friendship Road, Suite 10
Harrisburg, PA

Showcase presenter


Terahertz sub-surface scanner for wafer inspection

Technology Area: Instrumentation & Manufacturing

Commercial Maturity: Prototype

Abstract: The chip manufacturers face a daunting challenge of keeping the “rejects” down in the wafer fabrication process. To reduce wafer fab rejects, ARP has introduced a non-destructive sub-surface scanner with a resolution of 1 nm.