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Ahmed A. Busnaina

Ahmed A. Busnaina

The NSF Nanoscale Science and Engineering Center for High-rate Nanomanufacturing, William Lincoln Smith Professor and Director The NSF Nanoscale Science and Engineering Center for High-rate Nanomanufacturing Northeastern University, Boston, MA

Ahmed A. Busnaina, Ph.D. is the William Lincoln Smith Chair Professor and Director of National Science Foundation’s Nanoscale Science and Engineering Center (NSEC) for High-rate Nanomanufacturing and the NSF Center for Nano and Microcontamination Control at Northeastern University, Boston, MA. Dr. Busnaina is internationally recognized for his work on nano and micro scale defects mitigation and removal in semiconductor fabrication. He specializes in directed assembly of nanoelements (such as nanotubes and nanoparticles) and in the nanomanufacturing of micro and nanoscale devices. Research support exceeded 44 million dollars. He authored more than 420 papers in jour¬nals, proceedings and conferences. He organized more than 80 conferences, workshops, symposia and programs for many professional societies, chaired and organized more than 150 sessions and panels. He is an associate editor of the Journal of Nanoparticle Research. He also serves on many advisory boards including Samsung Electronics; Chemical Industry Nanomaterials Roadmap, International Technology Roadmap for Semiconductors, Journal of Particulate Science and Technology, Journal of Environmental Sciences, Semiconductor International, Journal of Advanced Applications in Contamination Control. He is a fellow of the American Society of Mechanical Engineers, and the Adhesion Society, a Fulbright Senior Scholar and listed in Who's Who in the World, in America, in science and engineering, etc.). He was awarded the 2006 Nanotech Briefs National Nano50 Award, Innovator category, the 2006 Outstanding Faculty, SØren Buus Outstanding Research Award, Northeastern University 2006, the 2005 Aspiration Award, Northeastern University.

Chairing the symposium on Manufacturing at the Nanoscale; Overcoming Barriers to Commercialization


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