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Roll transfer process of single crystal silicon (SCS) film for thin film transistor fabrication

H.J. Choi, J.H. Kim, B.K. Jang, H.J. Ng, J.H. Ahn, H.J. Lee, D.P. Kim
Korea instituted of machinery and materials (KIMM), KR

Keywords: transfer printing, single crystal silicon (SCS) film transistor


Nano transfer printing process or transfer assembly is a technique for transferring various devices and patterns from a dummy substrate to a receiver substrate using a conformal stamp. This is particularly useful in fabrication of flexible devices with high performance, such as thin-film transistors, optical sensors, thin-film solar cells, light emitting diode (LED) and hybrid devices. In this study, we propose a roll-based transfer process to greatly increase the productivity of transfer process compared with that of conventional plate-to-plate transfer process. To demonstrate the usefulness and impact of the roll transfer technique, single crystal silicon (SCS) films of 200 nm and 2.3 ㎛ thick are transferred onto a polyimide (PI) substrate using the proposed roll transfer technique. Even when the transferred area reaches about 2 inch scale, there is no observable damage during the transfer process. The transferred SCS film on PI substrate can be processed to produce flexible backplane thin film transistor (TFT) for flexible display with ultra-high performance. Some of critical issues of roll transfer process are also highlighted, and anchor design of SCS patterns, control of contact pressure, alignment, production throughput, scale-up strategy and yield are discussed.
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