TechConnect Summit 2010

METHOD AND DEVICE FOR SELECTIVE ETCHING

Organization:GRAVIT, France, FR
I.P. Brief:Method and device for etching a first material selectively with respect to a second material, comprising a bath of a solution and a system for generating ultrasound at a frequency between 100 kHz and 3 MHz in the bath so as to produce cavitation bubbles.
Keywords:ultrasound, recycling, WEEE, metal, surface treatment
Primary Industry:Pollution & Recycling

Full IP Descriptions available on-site.


 
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