TechConnect World 2018
Co-Located with Nanotech 2018 SBIR/STTR Spring Defense TechConnect
Nanotech 2018

Printed & Flexible Electronics

Printed and Flexible Electronics

Abstracts Due: January 19, 2018

Symposium Co-Chairs

Mandakini KanungoMandakini Kanungo
Research and Technology
Corning, Inc.

Yiliang WuYiliang Wu
Principal Scientist
TE Connectivity

Key Speakers

Woo Soo Kim3D printed flexible sensor systems
Woo Soo Kim
Associate Professor, School of Mechatronic Systems Engineering, Simon Fraser University

Jun YangA Digital Additive Manufacturing Approach to Make Printed Circuit Boards (PCBs) Abstract
Jun Yang
Professor, Director of WIN 4.0, The University of Western Ontario, Canada


Printed and flexible electronics technologies will have a far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event.

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.


Topics & Application Areas

  • Flexible Electronics Manufacturing
  • Printed Electronics Innovations & Applications
  • Biomedical Devices
  • Solar Applications, Photovoltaics
  • Packaging Applications
  • Other
2017 Sponsors & Partners
2017 Sponsors & Partners

TechConnect World 2018

Jointly produced by