TechConnect World 2018
Co-Located with Nanotech 2018 SBIR/STTR Spring Defense TechConnect
Nanotech 2018
 

Advanced Materials for Engineering Applications

Advanced Materials for Engineering Applications

First Call Abstracts Due: December 08, 2017

Symposium Chair

Brent M SegalBrent M Segal
Director of Research Science and Chief Technologist
Lockheed Martin

The TechConnect World Advanced Engineering Materials symposium will feature materials that are ready for commercial application. We will also spotlight new research and development: innovative and disruptive technologies, materials, and approaches that could provide game-changing increases in performance in future engineering applications. Please submit an abstract and plan to join innovators from industry, academic and government laboratories around the world at this important event.

Submit Your Abstract

Please first review the information for authors — abstract submission guidelines.

 

Topics & Application Areas

  • Advanced Engineering Materials
  • Next Generation Alloys & Ceramics
  • Polymer Composites
  • Bio-Based Materials
  • Advanced Coatings Technologies
  • Soft Matter & Colloids
  • Modeling & Informatics
  • Other
 
2017 Sponsors & Partners
2017 Sponsors & Partners

TechConnect World 2018

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