TechConnect World 2017
National SBIR/STTR Conference National Innovation Summit & Showcase Nanotech 2016
Nanotech 2017
 

Printed & Flexible Electronics

Printed and Flexible Electronics

Submit Poster Abstract - due March 31

Please first review the information for authors — abstract submission guidelines.

Symposium Chair

Mandakini KanungoMandakini Kanungo
Research and Technology
Corning, Inc.

Key Speakers

Gokce GulsoyPrinted Electronics: Towards more advanced functional coatings
Gokce Gulsoy
Senior Scientist, TE Connectivity

Michael RennAerosol Jet Printing of Flexible and Stretchable Hybrid Electronics
Michael Renn
CTO and Director of Advanced Applications Lab, Optomec, Inc.

Andy BehrBeyond Flexible - Next Generation Materials Enable Conformable Electronics
Andy Behr
Product and Business Development Manager, Panasonic Electronic Materials Division

Lee J RichterMaterials measurements for flexible and printed electronics
Lee J Richter
Physicist, Surface and Microanalysis Science Division, National Institute of Standards and Technology

Anupama B KaulSolution-based Synthesis of 2D Layered Materials for Flexible and Printed Electronics Applications
Anupama B Kaul
AT&T Distinguished Professor, The University of Texas at El Paso

Larry JudovitsElectroactive Fluorinated Polymers
Larry Judovits
Principal Scientist, Arkema, Inc.


Symposium Sessions

Tuesday May 16

10:30Electronics Innovation Spotlights: Panasonic, LG, Energizer
1:30Materials for Flexible Electronics

Wednesday May 17

8:30Flexible Electronics Manufacturing
10:30Printed Electronics Innovations & Applications
1:30Inkjet Design, Materials & Fabrication
Advanced, Printed & Flexible Electronics: Posters

Symposium Program

Tuesday May 16

10:30Electronics Innovation Spotlights: Panasonic, LG, Energizer
1:30Materials for Flexible Electronics
1:30Beyond Flexible - Next Generation Materials Enable Conformable Electronics (invited presentation)
A. Behr, Panasonic, US
1:55Solution-based Synthesis of 2D Layered Materials for Flexible and Printed Electronics Applications (invited presentation)
A.B. Kaul, University of Texas at El Paso, US
2:20Materials measurements for flexible and printed electronics (invited presentation)
L. Richter, NIST, US
2:45Direct imprinting of liquid silicon
T. Masuda, T. Shimoda, Japan Advanced Institute of Science and Technology, JP
3:05Design of nanopatterned metallic films for flexible transparent conductor
W. Wu, N.G. Tassi, DuPont, US
3:25New Paradigms on Materials Synthesis and Additive Manufacturing of Flexible Electronics for Energy Applications
M.A. Torres Arango, K.A. Sierros, West Virginia University, US
3:45Silk biocomposites as flexible and biodegradable electrochemical sensors
R.K. Pal, V.K. Yadavalli, Virginia Commonwealth University, US
4:05Green strategies for the development of printable polymer based piezoresistive sensors
J. Oliveira, Universidade do Minho, PT

Wednesday May 17

8:30Flexible Electronics Manufacturing
8:30Aerosol Jet Printing of Flexible and Stretchable Hybrid Electronics (invited presentation)
M. Renn, Optomec, Inc., US
8:55Manufacturing of Polymeric Substrates and Materials for Roll to Roll Flexible Printed Materials and Additive Processes
J. Mead, C. Barry, A. Akyurtlu, M. Herndon, University of Massachusetts Lowell, US
9:15Fabrication of 3D curved elastomeric structures and their applications to flexible wearable devices
S.H. Park, H.B. Lee, N.K. Lee, Korea Institute of Industrial Technology, KR
9:35Introduction of a simple metal transfer method for fabricating flexible electrodes
D. Koh, A. Wang, P. Schneider, B. Bosinski, K.W. Oh, University at Buffalo, US
9:55Low power gas sensor array on flexible acetate substrate
S. Benedict, P.K. Basu, N. Bhat, Indian Institute of Science, IN
10:15The Electrochemical Printing Technique (EPT) for Flexible Electronics
I. Kadija, ECSI Fibrotools, US
10:30Printed Electronics Innovations & Applications
10:30Printed Electronics: Towards more advanced functional coatings (invited presentation)
G. Gulsoy, TE Connectivity, US
10:55Electroactive Fluorinated Polymers (invited presentation)
L. Judovits, Arkema, Inc., US
11:20Fully Printed LEDs with Halide Perovskite/Polymer Composite Emitters
Z. Yu, Florida State University, US
11:40Metal Nanowires for Printed Electronics
B. Wiley, Duke Unviersity, US
12:00Aerosol Jet Printed Functional Nanoinks with High Reliability and Reconfigurability
X. Lan, E. Nguyen, A. Malingowski, V. Gambin, J. Tice, Northrop Grumman Aerospace Systems, US
12:20Printable and High Performance MnO2-based Energy Storage Devices
J. Qian, S.P. Lau, The Hong Kong Polytechnic University, HK
1:30Inkjet Design, Materials & Fabrication
1:30Printing smart and functional polymers for sensor and actuator applications (invited presentation)
S. Lanceros, BC Materials, ES
1:55Inkjet Printing of High Index Zirconia Nanocomposite Materials
M.D. Healy, P. Guschl, X. Wang, M. Weinstein, Pixelligent Technologies LLC, US
2:15One-dimensional simulation of drop breakup in inkjet
H. Jiang, H. Tan, Washington State University Vancouver, US
2:35Ink Design and Printability
B. Derby, Y. Liu, University of Manchester, UK
2:55Printed, Self-Powered, Wireless Sensor Platform for Future Smart Buildings (invited presentation)
P. Joshi, Oak Ridge National Laboratory, US
3:20Development of a Gold Nanoparticle Conductive Ink with a Relatively Low Sintering Temperature
S. Hamacher, B. Bachmann, A. Yakushenko, Forschungszentrum Jülich, DE
3:40Inkjet printing of carbon nanospheres
M. Orrill, D. Abele, N. Banek, M. Wagner, S. LeBlanc, The George Washington University, US
Advanced, Printed & Flexible Electronics: PostersPotomac Registration Hall
Simulation and Analytical Model to study the impact of Gate Misalignment in p-n-i-n Tunnel FET
U. Upasana, S. Gupta, R. Narang, M. Saxena, M. Gupta, University of Delhi, IN
Characteristic Fluctuation of Gate-All-Around Silicon Nanowire MOSFETs Induced by Random Discrete Dopants from Source/Drain Extensions
W-L. Sung and Y. Li, National Chiao Tung University, TW
Three Operation Modes of 6T-SRAM Using 5nm-Node Multi-Vt FD-SOI MOSFETs
J-Y. Chen, S-H. Chen, M-H. Chiang, National Cheng Kung University, TW
Excellent bipolar resistive switching behavior in WN thin film for non-volatile ReRAM device
R. Prakash, D. Kaur, Indian Institute of Technology Roorkee, Roorkee, Uttarakhand, India, IN
CarrICool – the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase
G. Janczyk, T. Bieniek, Instytut Technologii Elektronowej, PL
Hydrogen Sensors Based on Noble Metal catalytic dots on RF Sputtered Nanocrystalline ZnO Thin film
L. Rajan, C. Periasamy, V. Sahula, Malaviya National Institute of Technology, IN
Amorphous Si nanoparticles and nano-ink for printed and flexible electronics
B. Jang, B. Jang, Korea institute of energy research, KR
Novel Polymer Substrates for Printed Electronics by Continuous Extrusion
A. Panwar, J. Mead, C. Barry, C. Lepont, R. Vaghani, J. Desrochers, A. Akyirtlu, A. Dericioglu, SE. Hajisaeid, M. Haghzadeh, M. Herndon, D. Rockosi, University of Massachusetts Lowell, US
Enhancement of Field-Effect Mobility by controlling the surface potential of PVP Insulator in Pentacene-based Thin Film Transistors
Y. Jang, K-Y Kim, J. Jo, KIMM, KR
Phosphor-in-Glass Color Converter Based On A Low-Melting Precursor Glass For Long-Lifetime Warm W-LEDs Application
X. Xiang, B. Wang, H. Lin, Y. Wang, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences, CN

Flexible electronics is an emerging technology with far reaching impact in a number of areas including flat-panel displays, OLEDs, sensors, batteries and distributed macroelectronic systems and architectures. Printed smart devices incorporating organic and printed circuits, sensors and energy sources will enable new approaches in logistics and consumer packaging. New flexible displays with exceptionally low energy consumption will be used anywhere and anytime.

The synergy between materials, device and manufacturing technologies will be the primary driver in pushing printed and flexible large-area electronics and optoelectronics into large-scale applications and will revolutionize the manufacturing process for electronic devices.

Submit your abstract and participate in this exciting international event.

Topics & Application Areas

  • Materials for Flexible Electronics
  • Flexible Electronics Manufacturing
  • Printed Electronics Innovations & Applications
  • Biomedical Devices
  • Solar Applications, Photovoltaics
  • Packaging Applications
  • Other

Sponsor & Exhibitor Opportunities

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Platinum Sponsors
Korusip
Lockheed Martin
NSTXL

Silver Sponsors
Fujifilm
TechOpp

Corporate Acceleration Partners
Aerojet
Arkema
Boeing
Church & Dwight
Corning
Cummins
Eastman Chemical
Evonik
Henkel
Huntsman
Ingersoll_Rand
LG
Lockheed Martin
LOreal
Magna
Michelman
Owens Corning
Panasonic
Praxair
Sabic
SAINT-GOBAIN
Shell
Sherwin Williams
UTC

Technology Development Partners
 
Argonne
Business Sweden
ceatech
Clemson University
Innovate Hawaii
InvestInSkane
Iowa State University
korusip
KYUNGPOOK National University
NASA
New Jersey Innovation Institute
PolyU
SungKyunKwan University
UCI
University Of Melbourne
University Of Minnesota
University Of Vermont
UCSB
Vermont Department Economic Development
Vermont Technology Council

Supporting Partners
ACCT
American Elements
Angel Capital Associates
AOCS
Arrowhead Center
Asia Nano Forum
AURP
AUTM
Coatings
Diplomacy Matters
Explore Nano
FCHEA
FLC
Graphene Council
InterNano
Journal of Nanobiotechnology
LES
NVCA
NCURA
NECEC
SBIR
SBDC
Taylor Francis CRC
Texas Nanotech Initiative
Texas Tech University ORC.gif
UIDP

TechConnect World 2017

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