MEMS & NEMS Devices & Applications

MEMS & NEMS Devices & Applications

Symposium Chair

William (Cy) WilsonAerospace Applications for Surface Acoustic Wave Devices
William (Cy) Wilson
Electronics Engineer, NASA Langley Research Center

Confirmed Invited Speakers

Jason ClarkWeb-based MEMS Design, Modeling, and Simulation
Jason Clark
Adjunct Assistant Professor, Purdue University
William (Cy) WilsonAerospace Applications for Surface Acoustic Wave Devices
William (Cy) Wilson
Electronics Engineer, NASA Langley Research Center
Paul SunalPaul Sunal
Senior MEMS Engineer
MEMS and Nanotechnology Exchange / CNRI
Gary BernsteinNanomagnetic Logic - From Concept to Prototype
Gary Bernstein
University of Notre Dame

Symposium Sessions

Tuesday June 17

1:30Innovation Spotlights: Energy: Shell & United Technologies
Modeling & Simulation of Microsystems - Posters 1:30

Wednesday June 18

8:30MEMS & NEMS: Devices & Applications I
10:30MEMS & NEMS: Devices & Applications II
2:00MEMS & NEMS: Devices & Applications III
MEMS & NEMS - Posters 4:00

Symposium Program

Tuesday June 17

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1:30Innovation Spotlights: Energy: Shell & United TechnologiesNational Harbor 3
Session chair: University of Waterloo, CA
1:30Shell GameChanger - Strategic Innovation Interests
M. Marino, Shell GameChanger, US
1:45United Technologies - Strategic Innovation Interests
C. Walker, United Technologies, US
2:00Solar Thermochemical Reactor – Efficient Production of Fuels from Sunlight
L. Besemann, University of Minnesota, US
2:07Metabolic Engineering of Anaerobic Fungal Pathways for the Production of Biofuels and Antimicrobial Compounds
D. Lozofsky, UCSB Office of Technology & Industry Alliances, US
2:14Manufacture of aluminum nanoparticles for increasing energy density in fuels
A. Adkins, University of Central Florida, US
2:21Novel CIGS/CdS Thin Film Solar Cells Using Selenium Precursor
R. Nagaiah, University of Central Florida, US
J. Ornstein, SynShark LLC, US
2:35MoMeCCA - Moist membranes for the Cultivation and Collection of Algae
T. Vail, Northern Arizona University, US
2:42Shell, United Technologies Q&A
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Modeling & Simulation of Microsystems - Posters 1:30Expo Hall C
-A Computational Study on Detection of Ultra Small Volumes of Liquid and Solid Media in Microcavities Using Surface Acoustic Wave Devices
S.U. Senveli, O. Tigli, University of Miami, US
-Simple and Accurate Formula for the Electrostatically Actuated Curled Beam Problem
M. Younis, SUNY Binghamton, US
-Transmit and Receive of a cMUT Cell: Modeling and Experiments
S.P. Mao, X. Rottenberg, V. Rochus, P. Helin, A. Verbist, S. Severi, B. Nauwelaers, H.A.C. Tilmans, IMEC, BE
-TCAD Thermal Analysis of Gate Workfunction Engineered Recessed Channel MOSFET
G. Arora, M. Monika, R. Chaujar, Delhi Technological University, IN
-Impact of Parametric Variations on Heat Conductivity of Gate Electrode Work Function Engineered Recessed Channel MOSFET
M. Monika, G. Arora, R. Chaujar, Delhi Technological University, IN
-Thermal Behavior of Novel Transparent Gate Recessed Channel (TGRC) MOSFET: TCAD Analysis
A. Kumara, R. Chaujarb, M. Monikac, Delhi Technological University, IN
-Resonance Induced by a Time Varying Electric Field
J. Nimmo, I. Filikhin, B. Vlahovic, North Carolina Central University, US

Wednesday June 18

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8:30MEMS & NEMS: Devices & Applications IPotomac 3
Session chair: Cy Wilson, NASA. Langley Research Center, US (bio)
8:30Nanomagnet Logic - From Concept to Prototype (invited presentation)
G.H. Bernstein, K. Butler, P. Li, F. Shah, M. Siddiq, G. Csaba, X.S. Hu, M. Niemier, W. Porod, University of Notre Dame, US (bio)
8:55Local Synthesis of CuO Nanowires on CMOS Microhotplates for Gas Sensing Applications
S. Steinhauer, T. Maier, G.C. Mutinati, K. Rohracher, J. Siegert, F. Schrank, A. Koeck, Materials Center Leoben Forschung GmbH, AT
9:15Precision Micro-Optical Elements for Manufacturing of Gas Sensors using IR-Absorption
H.-J. Quenzer, J. Janes, V. Stenchly, S. Schwarzelbach, B. Wagner, R. Dudde, Fraunhofer Inst. Silicon Technology, DE
9:35CMOS-Compatible Thermally Actuated MEMS Viscosity Sensor with Aluminum on Silicon Membrane
I. Puchades, L.F. Fuller, S.E. Lyshevski, Rochester Institute of Technology, US
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10:30MEMS & NEMS: Devices & Applications IIPotomac 3
Session chair: Cy Wilson, NASA. Langley Research Center, US (bio)
10:30Web-based MEMS Design, Modeling, and Simulation (invited presentation)
J.V. Clark, Purdue University, US
10:55Enhancing Light-Induced Thermal Actuation with Gold Nanoplates
T.M. Lucas, K.T. James, J. Beharic, E.V. Moiseeva, R.S. Keynton, M.G. O’Toole, C.K. Harnett, University of Louisville, US
11:15Virtual pivot point MEMS rotary comb actuator with externally mounted mirror for optical applications
T.M.F. Amin, M.Q. Huda, J. Tulip, W. Jäger, University of Alberta, CA
11:35Nanotechnology-Enabled Microthrusters:Nanoenergetic Materials and MEMS Paradigm
I. Puchades, M. Hobosyan, L.F. Fuller, F. Liu, S. Thakur, K.S. Martirosyan, S.E. Lyshevski, Rochester Institute of Technology, US
11:55Charge Pumping for High-force, Large-displacement MEMS
IR. Harvey, B. Baker, A. Hogan, K. Ford, University of Utah Nanofab, US
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2:00MEMS & NEMS: Devices & Applications IIIPotomac 3
Session chair: Cy Wilson, NASA. Langley Research Center, US (bio)
2:00Aerospace Applications for Surface Acoustic Wave Devices (invited presentation)
W. Wilson, NASA Langley Research Center, US (bio)
2:25AFM/SNOM Cantilever Probe Serial Fabrication Process with Controlled Tip Nanoaperture
A. Tsigara, B. Belier, F. Maillard, P. Falgayrettes, E. Nativel, R. Kribich, P. Gall-Borrut, Universite Paris Sud, FR
2:45Optimization of a Poly-SiGe MEMS Xylophone Bar Magnetometer based on its equivalent circuit
V. Rochus, M. Farghaly, X. Rottenberg, H.A.C. Tilmans, imec, BE
3:05Hermetic room temperature glass welding technology
H. Lunden, T. Kumpulainen, A. Määttänen, J. Vihinen, Primoceler Ltd, FI
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MEMS & NEMS - Posters 4:00Potomac Registration Hall
-Design and Characterization of a MEMS Thermal Actuator and a Locking Switch for Telecommunication Applications
D. Dellaert, J. Doutreloigne, Ghent University, BE
-Strain gradients in poly-SiGe nanocantilevers: experimental and finite element modeling studies
T.B. Asafa, Ladoke Akintola University of Technology, NG
-Flexible Microsensor for Shape Detection
J. Beharic, T.M. Lucas, Y.M. Senousy, C.K. Harnett, University of Louisville, US
-The use of interdigitated microelectrode structures for the detection of exposure to simulated airborne environmental dust
R.L. Townsend, S.A. Rocks, R.A. Dorey, S. Tearle, University of Surrey, UK

This special symposia focuses specifically on emerging applications and advanced fabrication, materials, devices for MEMS and Sensors. Participating corporations are looking to the MEMS community for business and technology developement opportunities for their strategic needs. F-1000 corporate end-users participating include: Lockheed Martin, Honda, GM, GE, Samsung, Dow, BASF, bp, Siemens, Kodak, Proctor & Gamble, Applied Materials, Fuji Electric, Toray, Merck, Chevron, Omron, Panasonic, and many more. Submit your technical abstract today and join the leading innovators in providing new microtech solutions to the world's top corporate technology integrators.

Topics & Application Areas

  • Novel Materials for MEMS
  • Novel MEMS Fabrication & Processes
  • Acoustic Devices
  • Optical MEMS
  • Thermal Devices
  • Actuating Devices
  • Novel MEMS Devices
  • RF MEMS, Resonators & Oscillators
  • Sensing Systems & Networks
  • Mechanical & Physical Sensors
  • Chemical & Gas Sensors
  • Other Micro Sensors
  • WCM - Compact Modeling
  • Other

Journal Submissions

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.


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