Modeling & Simulation of Microsystems

Modeling & Simulation of Microsystems

Symposium Sessions

Monday May 13

4:00Innovation Spotlights: Electronics, Security & Defense
Modeling & Simulation of Microsystems - Posters 4:00

Tuesday May 14

3:30Compact Modeling & Device Modeling of Microsystems

Symposium Program

Monday May 13

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4:00Innovation Spotlights: Electronics, Security & DefensePotomac 1
Session chair: Thomas Gillespie, In-Q-Tel, US
4:00OCR type Direct Bonding for Touch Screen Panel
S. O, GMT Co. Ltd., US
4:07A Multi-Function Glove for Harsh Environments
D. Lerch, Institute for Disabilities Research and Training, US
4:14Surface Acoustic Wave Sensor Network utilizing a Unique Orthogonal Frequency Coding Method to Individually Identify Sensors in a Multi-sensory Network
A. Adkins, University of Central Florida, US
4:21Angular Slice True 3D Display (AS3D)
P. Jones, Third Dimension Technologies, LLC, US
4:28Magnetic cooling in semiconductors
M. Weber, McGill University, CA
4:35Precise Sensor Nanomaterial
D. Benedict, Louisiana State University, US
4:42The Molecular Property Spectrometer (MPS™): Chip-based chem-sensing and protein screening
J. Adams, NevadaNano, US
4:49BZN Pyrochlore Thin Films
D. Fecko, Penn State Materials Research Institute, US
4:56Peel-and-Stick Process: Fabrication process for thin film electronics on universal substrates.
C.H. Lee, Stanford University, US
5:03Proactive Cybersecurity
S. Hariri, AVIRTEK, US
5:10IDentia - Extensible Cloud Security Solution for the Enterprise
N. Duan, D-Tech, LLC, US
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Modeling & Simulation of Microsystems - Posters 4:00Expo Hall A
-Methodology and tool support for micro- and nano product engineering for SMEs
K. Hahn, D. Ortloff, M. Mielke, R. Brueck, University Siegen, DE
-A novel simulation methodology for full chip-package thermo-mechanical reliability investigations
B. Karunamurthy, T. Ostermann and M. Bhattacharya, KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, AT
-A simulation study on the property of micro-arrayed negative refractive index material for the energy transfer
G. Boopalan, C.K. Subramaniam, VIT University, IN
-Electronic properties in two dimensional quantum rings consisting of two nanoelements
A.S. Sahakyan, R.M. Movsesyan, A.N. Kocharian, California State University Los Angeles, US
-Thermal Coupling in Technologies Based on Tri-gate Transistors
M. Janicki, P. Zajac, M. Szermer, A. Napieralski, Lodz University of Technology, PL
-Optimized Topology of an ASIC for Thermal Analysis of Multi-Core Processors
M. Szermer, L. Kotynia, P. Zajac, M. Janicki, A. Napieralski, Lodz University of Technology, PL
-Current-mode Processing Possibilities in HV SoI Integrated Systems
M. Jankowski, A. Napieralski, Lodz University of Technology, PL
-Integration of memristors with MEMS in different circuit configurations
S. Almeida, D. Zubia, University of Texas at El Paso, US
-The Effects of Dwell_time of Monopolar Waveform on Droplet Formation through the Analysis of Fluid Propagation Direction
C.-H. Wu, W.-S. Hwang, National Cheng Kung University, TW
-Modeling and Simulation of Hot Imprint Process of Microstructure into Polycarbonate
R. Gaidys, B. Narijauskaite, A. Palevicius, G. Janusas, R. Sakalys, Kaunas University of Technology, LT
-Work Function Fluctuation Induced by Random Orientation, Shape, and Size of Metal Grain in 16-nm-Gate High-k/ Metal Gate Bulk FinFET Devices
Y.-Y. Chen, S.-C. Hsu, C.-Y. Chen, W.-T. Huang, C.-M. Yang, L.-W. Chen and Y. Li, National Chiao Tung University, TW

Tuesday May 14

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3:30Compact Modeling & Device Modeling of MicrosystemsPotomac 6
Session chair: Cy Wilson, NASA Langley Research Center, US
3:30Simulation of Back-Electrode Effects on Lags and Current Collapse in Field-Plate AlGaN/GaN HEMTs
K. Horio, H. Onodera, T. Fukai, Shibaura Institute of Technology, JP
3:50Current-Controlled Switches for HV SoI Processes – Structure, Application and Integration in Functional Blocks
M. Jankowski, A. Napieralski, Lodz University of Technology, PL
4:10An Efficient and Accurate Schematic Transistor Model of FinFET Parasitic Elements
N. Lu, T.B. Hook, J.B. Johnson, C. Wermer, C. Putnam, R.A. Wachnik, IBM, US
4:30A Surface-Potential-Based Compact Model of AlGaN/GaN HEMTs Power Transistors
P. Martin, R. Hahe, L. Lucci, CEA-Leti, FR
4:50GIDL Current and Pass-Gate Body Potential Modeling in 22nm HKMG PD-SOI CMOS
L. Luo, J.P. Walko, J.M. Johnson, S. Springer, IBM, US

MSM is the premier technical forum for presenting the latest research and development in design, modeling and simulation methods, tools and applications in the MEMS, microelectronic, semiconductor, sensor, materials and biotechnology fields.

In an effort to dramatically shorten development time and reduce prototyping costs, simulation activities have experienced phenomenal growth, generating a large number of point solutions, as well as integrated tools.

The goal of MSM is to bring together researchers, designers, programmers and vendors involved in microsystem developments. The event provides a forum for microsystem simulation specialists, allowing them to be exposed to the state of the art modeling techniques currently implemented in academic or industrial research, encouraging a free exchange of ideas and generating synergies between adjacent specialties.

Topics & Application Areas

  • Novel Computational & Numerical Methods
  • MEMS Device Modeling
  • Process Modeling
  • Device & Circuit Simulation
  • System & Optimization
  • Fluidic Device Simulation
  • Industrial case studies
  • Other

Technical Abstract Submission

Please first review the information for authors as well as the abstract preparation guidelines.

 

Journal Submissions

Sensors & Transducers

On-line Journal ‘Sensors & Transducers’

Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.

For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.

 

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