MEMS & NEMS Devices & Applications

MEMS & NEMS Devices & Applications

Symposium Sessions

Monday May 13

11:00Reconfigurable Nanofabs for Nanoscale Printing of Electronics and Sensors
11:00Innovation Spotlights: Electronics & Energy
2:00Organic & Flexible Electronics I
2:00INTO-RAM ATHENA: Multi-organ Platform for Rapid Assessment of Medical Countermeasures - DTRA Special Session
2:00Innovation Spotlights: Defense & Energy
4:00Innovation Spotlights: Electronics, Security & Defense
Modeling & Simulation of Microsystems - Posters 4:00

Tuesday May 14

11:00MEMS & NEMS: Novel Applications & Devices I
Nanotech for Sensors & Sensors for Nanotech NNI Signature Initiative - Posters 1:30
MEMS & NEMS Devices & Applications - Posters 1:30
2:30Innovation Spotlights: Transportation & Energy
3:00Biosensors: Clinical/health Applications
3:30Compact Modeling & Device Modeling of Microsystems
3:30MEMS & NEMS: Novel Fabrication & Materials
3:30Micro & Nano Fluidics: Devices

Wednesday May 15

8:30MEMS & NEMS: Novel Applications & Devices II
11:00Nanotechnology for Sensors and Sensors for Nanotechnology I - NNI Signature Initiative
11:00Inkjet Design, Materials & Fabrication
2:00Nanotechnology for Sensors and Sensors for Nanotechnology II - NNI Signature Initiative
2:00Inkjet Applications

Symposium Program

Monday May 13

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11:00Reconfigurable Nanofabs for Nanoscale Printing of Electronics and SensorsPotomac 3
Session chair: Ahmed Busnaina, Northeastern University, US
11:00Nanofabrication Using Polymer Based Materials (invited presentation)
J. Mead, C. Barry, J. Whitten, R. Nagarajan, University of Massachusetts Lowell, US (bio)
11:25Advanced Nanomaterials-based Manufacturing Platform for Printed Sensors, Electronics, Energy and Material Applications (invited presentation)
A. Busnaina, Northeastern University, US (bio)
11:50CANCELED - State-of-the-Art Organic Semiconductors for Printed Electronics (invited presentation)
G.P. Miller, University of New Hampshire, US (bio)
12:15Single-wall and Specialty Multi-wall Carbon Nanotubes for Electronics & Composites Applications (invited presentation)
D.J. Arthur, SouthWest NanoTechnologies (SWeNT), US (bio)
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11:00Innovation Spotlights: Electronics & EnergyPotomac 1
Session chair: Keith Ritala, KERTECH & Associates, Reviewers: Panasonic, Bosch, Applied Ventures, Omron
11:00Panasonic - Strategic Innovation Interests
I. Nydick, Panasonic Ventures, US (bio)
11:15Bosch - Strategic Innovation Interests
E. Daniels, Robert Bosch LLC, US (bio)
11:30Omron - Strategic Innovation Interests
D. Uchida, Omron, JP (bio)
11:45Applied Ventures - Strategic Innovation Interests
A. Kamannavar, Applied Ventures, US (bio)
12:10Scalable Nanopatterning using Roll-based Jet and FlashTM Imprint Lithography
P. Hofemann, Molecular Imprints Inc., US
12:17Microsystems Enabled Photovoltaics (MEPV)
G. Nielson, Sandia National Laboratories, US
12:24Circuits in Plastic Technology
M. Neeli, Griffith University, AU
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2:00Organic & Flexible Electronics IAzalea 1
Session chair: Anupama B. Kaul, National Science Foundation, US
2:00National Science Foundation’s Organic and Flexible Electronics Programs in the Engineering Directorate (invited presentation)
A.B. Kaul, National Science Foundation, US (bio)
2:25Flexible thin films based on nanostructured polymeric composites as ultra sensitive piezoresistive materials and their applications
E. Laukhina, R. Pfattner, L.R. Ferreras, M. Mas-Torrent, V. Laukhin, C. Rovira, J. Veciana, Institut Ciencia de Materials de Barcelona (CSIC)/CIBER-BBN, ES
2:45Effects of Inter-molecular and Electrode Interfaces on Photovoltaic Processes in Organic Solar Cells (invited presentation)
B. Hu, University of Tennessee, US (bio)
3:10Ultra-stretchable, Flexible, and Self-Healing Electronics Using a Micromoldable Metal
J.-H. So, M.R. Khan, C. Eaker, M. Mohammed, M.D. Dickey, NC State University, US
3:30An Integrated Approach Toward High Performance Materials and Contacts for Organic Solar Cells (invited presentation)
D.C. Olson, National Renewable Energy Laboratory (NREL), US (bio)
3:55High-Efficiency and Stretchable Polymer Light Emitting Diodes (invited presentation)
Q. Pei, UCLA, US (bio)
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2:00INTO-RAM ATHENA: Multi-organ Platform for Rapid Assessment of Medical Countermeasures - DTRA Special SessionAzalea 2
Session chair: William C. Florence, DTRA - JSTO & Rashi Iyer, Defense Systems & Analysis, Los Alamos National Laboratory, US
2:00Engineering In Vitro Human Organ Platforms (invited presentation)
J. Wikswo, Vanderbilt University, US (bio)
2:50SYN-TOX: A Microfluidic Co-culture Platform for Drug Toxicity Assays (invited presentation)
K. Pant, CFDRC, US (bio)
3:15Use of Hollow Fibers in 3D-Liver Cultures (invited presentation)
M. Luebberstedt, Charité - Universitätsmedizin Berlin, DE (bio)
3:40In vitro Lung Organ Development for Rapid and High-throughput Bioassessment (invited presentation)
R. Iyer, Los Alamos National Laboratory, US
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2:00Innovation Spotlights: Defense & EnergyPotomac 2
Session chair: Ron Beech, Angstron Materials, Reviewers: Boeing, Capewell, Navy
2:00Boeing - Strategic Innovation Interests
T. Metoyer, Boeing, US (bio)
2:15Capewell - Strategic Innovation Interests
I. Boerenko, Capewell, US (bio)
2:30Navy - Strategic Innovation Interests
C. Tindal, U.S. Navy, US (bio)
3:00Solar Fuel Corporation: Converting Sun, Water and CO2 to hydrogen or syngas
K. Bowles, Solar Fuel Corporation, US
3:07NSPECT Portable Imaging Neutron and Gamma-Ray Spectrometer (NSPECT)
T. Carrier, University of New Hampshire Office for Research Partnerships and Commercialization, US
3:14Therm-E-Log - Visual,Temperature Exposure History Logger
U. Sampathkumaran, InnoSense LLC, US
3:21Conductive Composites
G. Hansen, Conductive Composites Company, US
3:28Optical True-Time-Delay (TTD) Devices for Phased Array Systems
P. Morton, Morton Photonics Inc, US
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4:00Innovation Spotlights: Electronics, Security & DefensePotomac 1
Session chair: Thomas Gillespie, In-Q-Tel, US
4:00OCR type Direct Bonding for Touch Screen Panel
S. O, GMT Co. Ltd., US
4:07A Multi-Function Glove for Harsh Environments
D. Lerch, Institute for Disabilities Research and Training, US
4:14Surface Acoustic Wave Sensor Network utilizing a Unique Orthogonal Frequency Coding Method to Individually Identify Sensors in a Multi-sensory Network
A. Adkins, University of Central Florida, US
4:21Angular Slice True 3D Display (AS3D)
P. Jones, Third Dimension Technologies, LLC, US
4:28Magnetic cooling in semiconductors
M. Weber, McGill University, CA
4:35Precise Sensor Nanomaterial
D. Benedict, Louisiana State University, US
4:42The Molecular Property Spectrometer (MPS™): Chip-based chem-sensing and protein screening
J. Adams, NevadaNano, US
4:49BZN Pyrochlore Thin Films
D. Fecko, Penn State Materials Research Institute, US
4:56Peel-and-Stick Process: Fabrication process for thin film electronics on universal substrates.
C.H. Lee, Stanford University, US
5:03Proactive Cybersecurity
S. Hariri, AVIRTEK, US
5:10IDentia - Extensible Cloud Security Solution for the Enterprise
N. Duan, D-Tech, LLC, US
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Modeling & Simulation of Microsystems - Posters 4:00Expo Hall A
-Methodology and tool support for micro- and nano product engineering for SMEs
K. Hahn, D. Ortloff, M. Mielke, R. Brueck, University Siegen, DE
-A novel simulation methodology for full chip-package thermo-mechanical reliability investigations
B. Karunamurthy, T. Ostermann and M. Bhattacharya, KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, AT
-A simulation study on the property of micro-arrayed negative refractive index material for the energy transfer
G. Boopalan, C.K. Subramaniam, VIT University, IN
-Electronic properties in two dimensional quantum rings consisting of two nanoelements
A.S. Sahakyan, R.M. Movsesyan, A.N. Kocharian, California State University Los Angeles, US
-Thermal Coupling in Technologies Based on Tri-gate Transistors
M. Janicki, P. Zajac, M. Szermer, A. Napieralski, Lodz University of Technology, PL
-Optimized Topology of an ASIC for Thermal Analysis of Multi-Core Processors
M. Szermer, L. Kotynia, P. Zajac, M. Janicki, A. Napieralski, Lodz University of Technology, PL
-Current-mode Processing Possibilities in HV SoI Integrated Systems
M. Jankowski, A. Napieralski, Lodz University of Technology, PL
-Integration of memristors with MEMS in different circuit configurations
S. Almeida, D. Zubia, University of Texas at El Paso, US
-The Effects of Dwell_time of Monopolar Waveform on Droplet Formation through the Analysis of Fluid Propagation Direction
C.-H. Wu, W.-S. Hwang, National Cheng Kung University, TW
-Modeling and Simulation of Hot Imprint Process of Microstructure into Polycarbonate
R. Gaidys, B. Narijauskaite, A. Palevicius, G. Janusas, R. Sakalys, Kaunas University of Technology, LT
-Work Function Fluctuation Induced by Random Orientation, Shape, and Size of Metal Grain in 16-nm-Gate High-k/ Metal Gate Bulk FinFET Devices
Y.-Y. Chen, S.-C. Hsu, C.-Y. Chen, W.-T. Huang, C.-M. Yang, L.-W. Chen and Y. Li, National Chiao Tung University, TW

Tuesday May 14

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11:00MEMS & NEMS: Novel Applications & Devices IBaltimore 4
Session chair: Cy Wilson, NASA Langley Research Center, US
11:00Bi-Directional Electrostatic Actuators Based on Al2O3-Sio2 Electrets
P. Pai, F.K. Chowdhury, M. Tabib-Azar, University of Utah, US
11:20Film Bulk Acoustic Wave Resonator (FBAR) Filter for Ku-band Transceiver
N. Izza, M. Nor, K. Shah, J. Singh, Z. Sauli, La Trobe University, AU
11:40A Novel Integrated Optomechanical Transducer and Its Application in Atomic Force Microscopy
J. Zou, H. Miao, T. Michels, V. Aksyuk, National Institute of Standards and Technology, US
12:00Field-Assisted MEMS Pull-In Voltage Compensation Using ALD Electrets
F.K. Chowdhury, M. Tabib-Azar, University of Utah, US
12:20Micromachined Ultrasound Integrated Circuit
A. Hajati, D. Latev, Fujifilm Dimatix Inc, US
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Nanotech for Sensors & Sensors for Nanotech NNI Signature Initiative - Posters 1:30Expo Hall A
-Micro/Nano Patterned Integrated Electrochemical Sensors for Implantable Applications
M. Mujeeb-U-Rahman, D. Adalian, M. Sencan, A. Scherer, California Institute of Technology, US
-Nanomaterials-Enabled Photonic and Chemiresistive Sensing of Chemicals and Biochemicals
C.J. Choi, K.D. Benkstein, P.H. Rogers, C.B. Montgomery and S. Semancik, National Institute of Standards and Technology, US
-Ambient Carbon Monoxide and Nitric Oxide Sensors Based on Nanosized Metallic Oxides
A.D. Adeyemo, P.K. Dutta, The Ohio State University, US
-Immunosensor Using Nanoparticle-based Signal Enhancement for Bacterial Pathogen Detection
Y. Wang, E.C. Alocilja, Michigan State University, US
-Optimization of Dextrin Capped Magnetic Gold Nanoparticles
K. Chandler, H. Miller, E. Alocilja, Michigan State University, US
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MEMS & NEMS Devices & Applications - Posters 1:30Expo Hall A
-Carbon nanotube based polymeric thermoelectrics and stretchable sensory conductors
P. Riha, P. Slobodian, Academy of Sciences of the Czech Republic, CZ
-Time-Resolved Luminescence Measurements on Up-Conversion Phosphors for Electron Beam Sterilization Monitoring
M. Reitzig, T. Härtling, M. Winkler, P.E. Powers, S. Derenko, O. Röder, J. Opitz, Fraunhofer Institute for Nondestructive Testing IZFP, Dresden Branch, DE
-A personal sampler for direct mass determination of nano-particles using a resonant cantilever sensor
T. Salthammer, S. Merzsch, E. Peiner, I. Kirsch, E. Uhde, A. Waag, H.S. Wasisto, Fraunhofer WKI, DE
-Tungsten for CMOS-MEMS Pirani and Ionization Vacuum Gauges
J. Wang, Z. Tang, Dalian University of Technology, CN
-Fabrication and characterization of a highly doped poly-SiGe NEMS ohmic switches
M. Ramezani, S. Severi, B. Du Bois, T. Asafa, X. Rottenberg, V. Rochus, H.A. Tilmans, K. De Meyer, A. Witvrouw, IMEC, BE
-In-Situ Assessment of Wafer-Level Hermeticity by Micromembrane Technique
C.M. Yang, H. Jung, J.H. Park, E.M. Park, H.Y. Kim, K.R. Lee, National Nano FabCenter, KP
-Experimental study on sheet resistivity and thickness measurement in Copper Electroplating
A. Sharma, S. Kumar Khandelwal, D. Bansal, K. Rangra, D. Kumar, Central Electronics Engineering Research Institute (CEERI- CSIR), IN
-Comparative Study of Various Release Methods for Gold Surface Micromachining
A. Sharma, M. Kaur, P. Jhanwar, D. Bansal. P. Kumar, D. Kumar, S. Singh, K.J. Rangra, Central Electronics Engineering Research Institute (CEERI- CSIR), IN
-Transient Analysis on Nonlinear Model of Electrostatically Actuated Nanomechanical Switch
I.K. Kim, D.H. Han and S.I. Lee, University of Seoul, KR
-3-axis Capacitive Low-Gravity MEMS Accelerometer with Zero Cross-Axis Sensitivity in a Commercial Process
A. Merdassi, V.P. Chodavarapu, McGill University, CA
-Ciliated micropillar array for nanoscale lipid vesicle isolation
Z. Wang, D. Fine, H. Wu, J. Schmulen, Y. Hu, B. Godin, J. Zhang, X. Liu, the University of Texas at Austin, US
-Deterministic Failure Predictor for Mechanical and Electro-mechanical Systems
J. Heibel, JHC Inc, US
-Determination of different metals using new microsensors diamond doped with boron (BDD) in wastewater
A. Sbartai, P. Namour, A. Errachid, J. Krejči, R. Šejnohová, L. Renaud, M-L. Hamlaoui, A-S. Loir, F. Garrelie, C. Donnet, H. Soder, E. Audouard, J. Granier, N. Jaffrezic-Renaul, Universite de Lyon, FR
-Nanomaterial-enabled gas sensing platform
P. Moloney, Lockheed Martin, US
-Design and Analysis of Vibration Based Energy Harvester for Precision Agriculture
H. Aris, D. Fitrio, J. Singh, La Trobe University, AU
-New Powerful Method Based on Electrical Harmonic Distortion Analysis for Electromechanical Characterizations of MEMS Devices
A. Bounouh, D. Bélières, LNE, FR
-Cost-efficient Aspheric Micro-lenses Manufacturing For High Resolution Imaging Applications
F. Gaillard, V. Reboud, M. Brun, S. Landis, CEA-LETI-Minatec, FR
-Nanolayer Interconnect Structures Ageing by Beam Resonance Method
G. Janczyk, T. Bieniek, Instytut Technologii Elektronowej, PL
-Single resonator GaN/Si SAW based temperature sensor
A. Muller, G. Konstantinidis, A. Dinescu, A. Stefanescu, A. Cismaru, V. Buiculescu, I. Giangu, G. Stavrinidis, A. Stavrinidis, IMT Bucharest, RO
-Effect of angular rate on nanoparticle-doped liquid crystal
W.-P. Shih, P.-C. Huang, National Taiwan University, TW
-Interdigitated Comb Fins for Capacitive Sensing in a MEMS Directional Microphone
W. Cui, State University of New York at Binghamton, US
-Fabrication of electrical microfluidic chip for electroporation of mammalian cells
M. Shahini, F.V. Wijngaarden, J.T.W. Yeow, University of Waterloo, CA
-On the investigation of an interdigitated, high capacitance ratio shunt RF-MEMS switch for X- band applications
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2:30Innovation Spotlights: Transportation & EnergyPotomac 2
Session chair: Thomas Martinuzzo, Univalor, CA, Reviewers: Honda, bp, Hyundai, Pioneer Natural Resources
2:30Honda - Strategic Innovation Interests
C. Fau, Honda R&D America, US (bio)
2:45Hyundai - Strategic Innovation Interests
J. Suh, Hyundai Ventues, US (bio)
3:00bp - Strategic Innovation Interests
I. Dairanieh, bp, US (bio)
3:15Pioneer - Strategic Innovation Interests
T. Halbouty, Pioneer Natural Resources, US (bio)
3:45Automated Winter Road Surface Condition Monitoring System
L. Loerchner, University of Waterloo - WatCo, CA
3:52Direct catalytic liquefaction of low-volatile hydrocarbons to clean liquid fuels
P. Ganguli, Energy Catalysis, Inc., US
3:59Nano-Structured Nobel Metal Catalysts for Hydrocarbon Reforming
K. Klos, URS for the National Energy Technology Laboratory, US
4:06Embedded ARINC 653 Hypervisor for High Assurance of Safety and Security
P. Skentzos, DornerWorks, US
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3:00Biosensors: Clinical/health ApplicationsAnnapolis 1-2
Session chair: Srinivas Iyer, Bioscience Division, Los Alamos National Laboratory, US
3:00Plasmonic nanodome array fabricated on plastic as a dual-mode surface plasmon resonance and surface-enhanced Raman scattering sensor
C.J. Choi, S. Semancik, National Institute of Standards and Technology, US
3:20Amplified On-Chip Fluorescent and Colorimetric Detection of DNA and RNA Hybridization by Surface-Initiated Enzymatic Polymerization
V. Tjong, H. Yu, A. Hucknall, A. Chilkoti, Duke University, US
3:40Gold Nanoparticle Chemiresistors as a Generic Platform for Sensing
E. Chow, B. Raguse, L. Wieczorek, J.S. Cooper, L.J. Hubble, M.S. Webster, K.-H. Müller, CSIRO, AU
4:00Polymeric Nanomagnets for releasable capture of tumor cells
A. Singh, M.M. Amiji, Northeastern University, US
4:20Isolation and Detection of Cancer Related DNA Nanoparticulate Biomarkers Directly from CLL Patient Blood “Rapid Sample to Sequence Diagnostics”
M.J. Heller, J. Marciniak, A. Sonnenberg, University of California, San Diego, US
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3:30Compact Modeling & Device Modeling of MicrosystemsPotomac 6
Session chair: Cy Wilson, NASA Langley Research Center, US
3:30Simulation of Back-Electrode Effects on Lags and Current Collapse in Field-Plate AlGaN/GaN HEMTs
K. Horio, H. Onodera, T. Fukai, Shibaura Institute of Technology, JP
3:50Current-Controlled Switches for HV SoI Processes – Structure, Application and Integration in Functional Blocks
M. Jankowski, A. Napieralski, Lodz University of Technology, PL
4:10An Efficient and Accurate Schematic Transistor Model of FinFET Parasitic Elements
N. Lu, T.B. Hook, J.B. Johnson, C. Wermer, C. Putnam, R.A. Wachnik, IBM, US
4:30A Surface-Potential-Based Compact Model of AlGaN/GaN HEMTs Power Transistors
P. Martin, R. Hahe, L. Lucci, CEA-Leti, FR
4:50GIDL Current and Pass-Gate Body Potential Modeling in 22nm HKMG PD-SOI CMOS
L. Luo, J.P. Walko, J.M. Johnson, S. Springer, IBM, US
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3:30MEMS & NEMS: Novel Fabrication & MaterialsBaltimore 4
Session chair: Chris Menzel, Dimatix, Inc., US
3:30Dual Helix Dielectrophoretic Cell Separator Fabricated Using the Direct-Write Spindle Deposition Technique
N. Guérin, M. Lévesque, D. Therriault, École Polytechnique de Montréal, CA
3:50Fabrication of complex three-dimensional multilevel silicon micro- and nano-structures
S. Azimi, National University of Singapore, SG
4:30Hydrogel-based multi-stimuli responsive cilia
P.J. Glazer, J. Leuven, H. An, S.G. Lemay, E. Mendes, Delft University of Technology, NL
4:50Contact resistance modeling for NEMS ohmic relays using highly doped SiGe contact material
M. Ramezani, A.H. Tamaddon, S. Severi, K. Vanstreels, K. De Meyer, A. Witvrouw, IMEC, BE
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3:30Micro & Nano Fluidics: DevicesChesapeake D
Session chair: Edward P. Furlani, University at Buffalo (SUNY), US
3:30From Microfluidics for Biotechnology to Biomicrofluidics (invited presentation)
J. Berthier, CEA-Leti, FR (bio)
3:50Lab-on-a-Chip Technologies Enabled by Acousto-Opto-Fluidics (invited presentation)
T.J. Huang, The Pennsylvania State University, US (bio)
4:10Experimental investigation of the possibility of transporting a droplet over a hydrophilic spot in digital microfluidics
E. Samiei, M. Hoorfar, University of British Columbia, CA
4:30A Microfluidic Platform for Parallel Synchronization of Multiple Droplets by Ladder-Like Fluidic Network
H. Lee, L. Xu, K.W. Oh, SUNY at Buffalo, US (bio)
4:50A Low-Voltage Droplet Manipulation via Tunable Wetting on a Polypyrrole (DBS) Surface
W. Xu, Y. Tian, H. Bisaria, P. Ahn, X. Li, Y.-T. Tsai, C.-H. Choi, E.-H. Yang, Stevens Institute of Technology, US
5:10A Portable Lab-on-a-chip Instrument based on Microchip Electrophoresis with Dual Top-Bottom Capacitive Coupled Contactless Conductivity Detector in Replaceable Cell Cartridge
K. Ansari, J.Y.S. Ying, P.C. Hauser, N.F. de Rooij, I. Rodriguez, IMRE, SG

Wednesday May 15

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8:30MEMS & NEMS: Novel Applications & Devices IIBaltimore 5
Session chair: Chris Menzel, Dimatix, Inc., US
8:30DC-to-RF MEMS Converter
L. Chen, P. Pai, M. Tabib-Azar, University of Utah, US
8:50Non-contact biaxial nanoprobe utilized for surface measurements of MEMS
B. Goj, L. Dressler, M. Hoffmann, Ilmenau University of Technology, DE
9:10Temperature and Strain Coefficient of Velocity for Langasite SAW Devices
W.C. Wilson, G.M. Atkinson, NASA Langley Research Center, US
9:30Nanoceramic MEMS Sensors for Universal Embedded Chemical Sensing
C.J. Kostelecky, C. Sneider, R. Wind, D.J. Deininger, Synkera Technologies Inc., US
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11:00Nanotechnology for Sensors and Sensors for Nanotechnology I - NNI Signature InitiativeWoodrow Wilson B
Session chair: Dorothy F. Farrell, National Cancer Institute, US
11:00A Life-Cycle Approach to Relevant and Reliable Development of Nanotechnology for Sensors and Sensors for Nanotechnology (invited presentation)
M.D. Hoover, National Institute for Occupational Safety and Health, US (bio)
11:25Electrical Response of DNA and Proteins at Nanoscale by Using Novel Nanoneedle Biosensor
R. Esfandyarpour, Stanford University, US
11:45Nanowire-Nanocluster Hybrid Sensor Technology for Environmental, Industrial, and Security Monitoring
A. Motayed, University of Maryland, College Park, US
12:05Handheld biosensor based on nano-assembly for rapid detection of biodefense and infectious pathogens (invited presentation)
E.C. Alocilja, Y. Wang, Michigan State University, US (bio)
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11:00Inkjet Design, Materials & FabricationBaltimore 5
Session chair: Chris Menzel, Dimatix, Inc., US
11:00Inkjet Technology For Printed Electronics and 3D Fabrication (invited presentation)
V. Cahill, D Taylor, VCE Solutions, US (bio)
11:25Gravimetric calibration for optical measurements of droplets-in-flight
R.M. Verkouteren, C.J. Zeissler, J.R. Verkouteren, National Institute of Standards and Technology, US
11:45Effect of Pressure Variation on Inkjet-Printed Line Pattern with Various Step Sizes of Ejected Droplets
J-K Wang, W-S Hwang, M-H Tsai, Y-F Liu, National Cheng-Kung University, TW
12:05Ultrasonic Milling and Dispersing Technology for Inkjet Nano-Particles
K. Hielscher, Hielscher Ultrasonics, DE
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2:00Nanotechnology for Sensors and Sensors for Nanotechnology II - NNI Signature InitiativeWoodrow Wilson B
Session chair: Hongda Chen, NIFA, US
2:00Single Nanoparticle Sensing using Whispering-Gallery Microresonators and Microlasers (invited presentation)
L. Yang, Washington University, US (bio)
2:25Wireless Graphene-Based Quantum Capacitance Sensors for Continuous Glucose Monitoring
E.J. Olson, D.A. Deen, M.A. Ebrish, A. Basu, Y.C. Kudva, P. Mukherjee, S.J. Koester, University of Minnesota, US
2:45Nanostructured Biomimetic Pyruvate Dehydrogenase Complex (PDC) Sensors Selectively Detect Single Brain Cancer Cell and Have the Ability to Mimic the “ATP LID”
E.T. Chen, J. Thornton, C. Ngatchou, S-H. Duh, P.T. Kissinger, Advanced Biomimetic Sensors, Inc., US
3:05Stand-Off Sers Detection Using Nanoparticles (invited presentation)
C.A. Batt, C. Bardliving, A. Phifer, P. Barahona, Cornell University, US (bio)
3:30Development of a Nanosensor: Journey from a Lab Bench to an FDA Clearance and Beyond (invited presentation)
S. Marla, Nanosphere, US (bio)
3:55An Overview of the Nanotechnology for Sensors and Sensors for Nanotechnology: Improving and Protecting Health, Safety, and the Environment Nanotechnology Signature Initiative (invited presentation)
D. Farrell, National Cancer Institute, US (bio)
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2:00Inkjet ApplicationsBaltimore 5
Session chair: Chris Menzel, Dimatix, Inc., US
2:00Bioprinting Technology for Regenerative Medicine Applications (invited presentation)
J. Yoo, Wake Forest Institute for Regenerative Medicine, US (bio)
2:25Bio-ink for inkjet printing of living cells
C.J. Ferris, K.J. Gilmore, S. Beirne, D. McCallum, G.G. Wallace, M. in het Panhuis, ARC Centre of Excellence for Electromaterials Science (ACES), AU
2:45Ink-jet Printed CdS Thin Film Transistors Fabricated In-situ by Micro-reaction
J.C. Ramos, D. Kabir, J.I. Mejia, C.A. Martinez, M.A. Quevedo-Lopez, University of Texas at Dallas, US
3:05Inkjet printing of 200 nm monodisperse carbon nanoparticles: from smart ink formulation to thin film sensor properties
R. Vié, S. Berthon-Fabry, S. Blayac, E. Drahi, S. Jacomet, EMSE, FR
3:25A Study of Molten Lead-Free Solder Deposited by Inkjet Printing for Interconnections of Thin-Film Solar Cell Modules
W-M Chen, C-H Wang, W-S Hwang, National Cheng-Kung University, TW
3:45Impact of Ink Synthesis on Processing and Properties of Inkjet-Printed Silicon Thin Films
E. Drahi, A. Gupta, S. Blayac, L. Lombez, M. Jubault, P. Benaben, Ecole Nationale Supérieure des Mines de Saint Etienne, FR
4:05Ink-jet printing of functional ceramic coatings and patterns starting from aqueous inks
J. Feys, M. Arin, K. de Keukeleere, J. de Roo, G. Pollefeyt, P. Lommens, I. Van Driessche, Ghent University, BE

This special symposia focuses specifically on emerging applications and advanced fabrication, materials, devices for MEMS and Sensors. Participating corporations are looking to the MEMS community for business and technology developement opportunities for their strategic needs. F-1000 corporate end-users participating include: Lockheed Martin, Honda, GM, GE, Samsung, Dow, BASF, bp, Siemens, Kodak, Proctor & Gamble, Applied Materials, Fuji Electric, Toray, Merck, Chevron, Omron, Panasonic, and many more. Submit your technical abstract today and join the leading innovators in providing new microtech solutions to the world's top corporate technology integrators.

Topics & Application Areas

  • Novel Materials for MEMS
  • Novel MEMS Fabrication & Processes
  • Acoustic Devices
  • Optical MEMS
  • Thermal Devices
  • Actuating Devices
  • Novel MEMS Devices
  • RF MEMS, Resonators & Oscillators
  • Sensing Systems & Networks
  • Mechanical & Physical Sensors
  • Chemical & Gas Sensors
  • Other Micro Sensors
  • Other

Technical Abstract Submission

Please first review the information for authors as well as the abstract preparation guidelines.


Journal Submissions

Sensors & Transducers

On-line Journal ‘Sensors & Transducers’

Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.

For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.


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TechConnect Acceleration Partners:

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