Nanotech 2011

MEMS & NEMS Fabrication, Devices & Applications

MEMS & NEMS Fabrication, Devices & Applications

Symposium Chair

Elena I. GauraElena I. Gaura
Director of Cogent Computing Applied Research Centre
Coventry University, United Kingdom
Matthew LaudonMatthew Laudon
Nano Science and Technology Institute

Symposium Sessions

Tuesday June 14

8:30 Opening TechConnect World Keynotes - Innovation Impact - Nanotech, Cleantech, Microtech, Biotech 2011
10:30 Microtech for Quality of Life and Medical Applications - MIG Special Symposia
10:30 Inkjet Design, Materials & Fabrication 1
1:30 Inkjet Design, Materials & Fabrication 2
1:30 Microtech for Quality of Life and Medical Applications - MIG Special Symposia
2:30 MEMS in QoL Medical Devices and why the world is ready for Silicon-implantable Devices - MIG Special Symposia
1:30 Advanced Packaging & Interfaces for MEMS & NEMS
3:10 TechConnect IP Partnering: Sensors & Microsystems
4:00 Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707
4:15 MEMS Networking Reception - Sponsored by NSTI & MEMS Industry Group
4:00 Innovation Showcase & Poster Session - Reception (4:00 - 6:00)
 MEMS & NEMS Fabrication, Devices & Applications

Wednesday June 15

8:30 Novel MEMS & NEMS Devices: Design & Fabrication
10:30 Biofluidic Devices
1:30 Integrated NEMS & MEMS Sensors: Application & Fabrication
1:30 TechConnect IP Partnering: Biotech & Medical
3:00 TechConnect IP Partnering: Pharmaceuticals
3:00 TechConnect IP Partnering: Semiconductors, Sensors & Microsystems
1:30 US-China Nanotech Connect
3:30 US-China Nanotech Connect - Networking Reception - Booth 930 Expo Hall C (3:30 - 4:00)
4:00 Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707
4:00 Innovation Showcase & Poster Session - Reception (4:00 - 6:00)
 MEMS & NEMS Fabrication, Devices & Applications

Thursday June 16

8:30 MEMS-Based Systems Solutions and Integration Approaches
10:30 Device Design and Simulation 1
10:30 Nano and Micro Technologies for Oil & Gas
10:30 MEMS-Based Systems Solutions and Integration Approaches
10:30 TechConnect Corporate Partnering: Venture Partnering
1:00 TechConnect Ventures: Biotech & Medical
1:30 Micro & Nano Reliability
1:30 MEMS-Based Systems Solutions and Integration Approaches
2:30 TechConnect Ventures: Semiconductors, Sensors & Microsystems
3:00 MEMS-Based Systems Solutions and Integration Approaches
4:30 Technical and Business Collaboration Opportunities: MEMS-Based Systems Solutions and Integration Approaches
5:00 TechConnect Closing Networking, Partnering & Investment Reception (3rd Floor, Boylston Hallway)

Symposium Program

Tuesday June 14

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8:30Opening TechConnect World Keynotes - Innovation Impact - Nanotech, Cleantech, Microtech, Biotech 2011Ball Room A
Session chair: Matthew Laudon, NSTI/CTSI, US
8:30Welcome and Opening
M. Laudon, TechConnect World Co-Chair, US
8:40Cross Sector Perspective on Nanotech to Cleantech Innovation
T. Earles, Lockheed Martin & Former OSTP, US
9:10No Small Matter: Scaling the Business of Materials Science
T. Taber, CTO, Eastman Kodak Company, US
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10:30Microtech for Quality of Life and Medical Applications - MIG Special SymposiaRoom 209
Session chair: Karen Lightman, MEMS Industry Group, US
10:30Introduction to Quality of Life and Medical Applications - MIG Special Symposia
K. Lightman, MEMS Industry Group, US
10:45Medical Implant Devices, MEMS and Quality of Life: Lessons from Cardiovascular Devices: Stents, VADs and the Total Artificial Heart (invited presentation)
M. Slepian, Syncardia Systems, US
11:15Quality of Life Through Intelligent Monitoring (invited presentation)
M. DiPerri, Freescale Semiconductor Inc., US
11:35BioMEMS Technology for Artificial Organs (invited presentation)
J. Borenstein, Charles Stark Draper Laboratory, US
11:55MEMS in Healthcare - The Only Limit Is Imagination (invited presentation)
T. O'Dwyer, Analog Devices, US
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10:30Inkjet Design, Materials & Fabrication 1Room 204
Session chair: Chris Menzel, Dimatix, US
10:30Challenges of Modeling Inkjet Systems (invited presentation)
E.P. Furlani, University of Buffalo, US
10:55Life And Death Of A Weakly Viscoelastic Jet (invited presentation) Fluid Mechanics And Rheometry
V. Sharma, MIT, US
11:20New developments in inkjet of deposits carried out under localised extraction or helium
V. Conedera, F. Mesnilgrente, P. Fadel, N. Fabre, LAAS-CNRS, FR
11:40Advancements in Ink-Jet Deposition of Carbon Nanotube Materials for Printed Electronics
S. Turner, Brewer Science, US
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1:30Inkjet Design, Materials & Fabrication 2Room 204
Session chair: Chris Menzel, Dimatix, US
1:30Expanding Capabilities of a Machine Vision System for Analysis of Drops-in-flight
Y. Kipman, P. Mehta, S-W. Wang, ImageXpert Inc., US
1:50Imbibition dynamics of nano-particulate ink-jet drops on micro-porous media
W.-K. Hsiao, S.D. Hoath, G.D. Martin, I.M. Hutchings, S. Jones, N. Chilton, University of Cambridge, UK
2:10Advancement of Printed Electronics, Energetics, Materials, & Sensors (PEEMS) for Military Utilization
J.L. Zunino III, G. Di Benedetto, D.P. Schmidt, R.E. Cornell, A.M. Petrock, B.E. Fuchs, U.S. Army ARDEC, US
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1:30Microtech for Quality of Life and Medical Applications - MIG Special SymposiaRoom 209
Session chair: Karen Lightman, MEMS Industry Group, US
1:30Modeling Objective Quality of Life using Smartphone Sensors (invited presentation)
A. Madan, ginger.io, US
1:50Total Artificial Heart Utilizes MEMS Technology (invited presentation)
D. Sandfox, Omron Electronic Components LLC, US
2:10Networking
-, Break, US
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2:30MEMS in QoL Medical Devices and why the world is ready for Silicon-implantable Devices - MIG Special SymposiaRoom 209
Session chair: Karen Lightman, MEMS Industry Group, US
-Advanced MEMS/NEMS Processing for Improved Drug Delivery
R. Goodall, Nano Medical Systems, Inc., US
-Convergence of MEMS, Microfluidics, and Semiconductor Processing in Life SciencesR. Brossart_Sr., SVTC Technologies, US
-S. Wilcenski, MEMSCAP, Inc., US
-J. Borenstein, Charles Stark Draper Laboratory, US
3:30MEMS in QoL Medical Devices - Closing Keynote
B. Wirth, GE Sensing, US
4:00Conclusion and Wrap-up
K. Lightman, MEMS Industry Group, US
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1:30Advanced Packaging & Interfaces for MEMS & NEMSRoom 111
Session chair: Cy Wilson, NASA, US
1:30Design, Fabrication and Characterization of Inverse Adiabatic Fiber-To-Chip Couplers
M. Araghchini, A. Khilo, C.W. Holzwarth, M.S. Dahlem, H.I. Smith, E.P. Ippen, F.X. Kärtner, Massachusetts Institute of Technology, US
1:50Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging
F. Gao, Z. Gu, S. Shina, G. Morose, P. Eliason, R. Farrell, University of Massachusetts Lowell, US
2:10Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste
A. Hirose, T. Itou, T. Ogura, Osaka University, JP
2:30Lead Frame Package of MEMS Devices using Wafer-level, Air-gap Structures
N. Fritz, R. Saha, S.A. Bidstrup Allen, P.A. Kohl, Georgia Institute of Technology, US
2:50Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications
K-L Suk, K.W. Paik, KAIST, KR
3:10Compliant interconnect technology for power modules in automotive applications
P. Nenzi, University of Rome la Sapienza, IT
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3:10TechConnect IP Partnering: Sensors & MicrosystemsRoom 303
Session chair: Tom O’Donnell, Product Genesis
3:10Computational Method for Improved Forewarning of Critical Events
D. Sims, Oak Ridge National Laboratory, US
3:20LABRADOR(Lightweight Analyzer for Buried Remains And Decomposition Odor Recognition)
R. Speck, Oak Ridge National Laboratory, US
3:30Light-directed, in situ synthesis of RNA microarrays
M. Beaulieu, McGill University, CA
3:40Method Of Applying A Lubricant To A Micromechanical Device
CW Su, National University of Singapore, SG
3:50Novel Measuring Technologies and Series of Universal Sensors and Transducers Interfaces (USTI) ICs on its basis
S. Yurish, Technology Assistance BCNA 2010, S.L., ES
4:00A software to develop low cost and highly efficient self-adaptive grippers
T. Martinuzzo, Univalor, CA
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4:00Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707Expo Hall
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4:15MEMS Networking Reception - Sponsored by NSTI & MEMS Industry GroupRoom 209
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4:00Innovation Showcase & Poster Session - Reception (4:00 - 6:00)Expo Hall
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MEMS & NEMS Fabrication, Devices & ApplicationsExpo Hall
-Fracture-induced polymeric grating structures
C.C. Lin, F. Yang, J.W. Chin, L. Sung, S. Lee, National Tsing Hua Univesity, TW
-Comparaison between PDMS and PMMA for MEMS applications
H. Bourbaba, C. Benachaiba, M. Bouanini, University of Bechar, DZ
-High-aspect-ratio deep Si etching of micro/nano scale features with SF6 /H2/ O2 plasma, in a low plasma density reactive ion etching system
Z. Sanaee, M. Poudineh, M. Mehran, S. Mohajerzadeh, University of Tehran, IR
-Modularity in the Design and Volume Production of Microfluidic Devices
J. Podczerviensky, L. Levine, ALine, Inc., US
-Liquid State Polydimethylsiloxane Wrinkle Fabrication for passive micro fluidic channel mixer
S.H. Lee, Y. Yoon, J. Lee, J. Jeon, J-B Lee, M.J. Kim, University of Texas at Dallas, US
-An Improved Micro Injection Molding Technique for Grating Devices
H.S. Li, W.H. Hsieh, L.K.C. Au, K.C. Liu, National Chung Cheng University, TW
-Fabrication of Nano-structures of NiTi Shape Memory Films and Investigations on Size dependence of their Mechanical Properties
S.K. Sharma, S. Mohan, Indian Institute of Science, Bangalore, IN
-Multi-purpose tool for checking the microfabrication products
G. De Pasquale, A. Somà, Politecnico di Torino, IT
-Fabrication and analysis of MEMS test structures for residual stress measurement
A. Sharma, M. Kaur, D. Bansal, D. Kumar, K. Rangra, Central Electronics Engineering Research Institute (CEERI/ CSIR), IN
-Energy-saving Nanotechnology of water heating for heating of inhabited and industrial premises
G. Dubinin, E. Voloschuk, Scientific and Technical Centre “AVATARA”, UA
-SC Cavities Fast Tuning System Based on Piezoelectric Actuators
K. Przygoda, T. Pozniak, A. Napieralski, P. Sekalski, M. Grecki, Technical University of Lodz, PL
-DESIGN and FABRICATION of a METALLIC MEMS GRIPPER USING ELECTRO-THERMAL V-SHAPE and MODIFIED U-SHAPE ACTUATORS
J.J. Khazaai, H. Qu, M. Shillor, L. Smith, Oakland University, US
-A Pressure Sensor Array with Sensing Ranges Tunable by Driving Frequency
Y.-T. Lai, Y.-J. Yang, National Taiwan University, TW
-Control of MEMS-Technology Axial Topology MicroServos
S.E. Lyshevski, Rochester Institute of Technology, US
-u-Helix 3D-antenna technology
P. Nenzi, Sapienza - Università di Roma, IT

Wednesday June 15

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8:30Novel MEMS & NEMS Devices: Design & FabricationRoom 203
Session chair: Cy Wilson, NASA, US
8:30Sensor Fusion Solution with MEMS Sensors
J. Esfandyari, STMicroelectronics, US
8:50Programmable MEMS-Based Silicon Timing Solutions Change the Game
M. Lutz, SiTime Corp, US
9:10Space Applications for Wireless Sensors
W.C. Wilson, G.M. Atkinson, NASA Langley Research Center, US
9:30AC and DC Applications of Three-Dimensional Nano-electro-mechanical-systems
A.B. Kaul, A.R. Khan, K.G. Megerian, L. Bagge, L. Epp, Jet Propulsion Laboratory, US
9:50Design of a g-force meter on Si wafer, based on motor driven by photons
J. Valenzuela, S. Mil’shtein, University of Massachusetts, US
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10:30Biofluidic DevicesRoom 103
Session chair: Daniel Attinger, Columbia University and Edward P. Furlani, University at Buffalo (SUNY)
10:30Control in Microfluidic Assay and Synthesis Systems (invited presentation)
M.A. Burns, University of Michigan, US
11:00Sensors and Microfluidics (invited presentation)
R. Potyrailo, GE Global Research, US
11:30The Physics of Pressure Powered Micro-Flow Focusing Device for the Encapsulation of Live Cells
J. Berthier, P. Dalle, F. Rivera, R. Renaudot, S. Morales, P-Y. Benhamou, P. Caillat, CEA-Leti, FR
11:50Use of Silica Nanosprings in an Enzyme-Based Continuous Flow Reactor
D.C. Hyatt, T. Cantrell, M. Yahvah, M. Grant Norton, D.N. McIlroy, G. Corti, GoNano Technologies, Inc., US
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1:30Integrated NEMS & MEMS Sensors: Application & FabricationRoom 209
Session chair: Cy Wilson, NASA, US
1:30Tin oxide nanowire sensors for highly sensitive detection of toxic gases
A. Koeck, E. Brunet, C. Griessler, T. Maier, G. Mutinati, S. Steinhauer, AIT Austrian Institute of Technology GmbH, AT
1:50Nanospring Mats for Detection of Explosives
V. Dobrokhotov, Western Kentucky University, US
2:10Novel Low Temperature Fabrication Method for Label-Free Electronic Sensing of Biomolecules in Nanofluidic Channels with Integrated Electrodes
T. Wynne, X.T. Huang, S. Pennathur, University of California, Santa Barbara, US
2:30Magnetic nanoparticles as components of magnetoresistance sensors: the gGMR-sensor
A. Weddemann, I. Ennen, A. Regtmeier, A. Hütten, M. Zahn, Massachusetts Institute of Technology, US
2:50Parallel Fabrication of Single-Walled Carbon Nanotube based Piezoresistive Pressure Sensors
B.R. Burg, T. Helbling, C. Hierold, D. Poulikakos, ETH Zurich, CH
3:10Design and Fabrication of a Multi-Axis MEMS Force Sensor with Integrated Carbon Nanotube Based Piezoresistors
M.A. Cullinan, R.M. Panas, M.L. Culpepper, Massachusetts Institute of Technology, US
3:30Current research at CSHR: towards ElectroMioGraphy (EMG) sensor network
M. Pzaleari, Istituto Italiano di Tecnologia, IT
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1:30TechConnect IP Partnering: Biotech & MedicalRoom 303
Session chair: Lynn Foster, BPT Pharma, US
1:30Cellular Gradient Polymer Composites
P. Bourban, Ecole Polytechnique Fédérale de Lausanne (EPFL), CH
1:40Magnetic nanoparticles for drug targeting
M. Kempe, Lund University, SE
1:50Novel biomarker signature as a predictor of breast cancer outcome
O. Novac, McGill University, CA
2:00Portfolio of Scaffolds and Biomaterials for Multiple Orthopaedic and Medical Applications
S. Hartford, University of Notre Dame, US
2:10Microfluidic Lab-on-Chip Platform for Point of Care Testing
P. Koonjul, VALEO MANAGEMENT, CA
2:20New Technology for Micro- and Nanonization & Encapsulation of Molecular Compounds of Interest
J. Reverter, ICN - INSTITUT CATALA DE NANOTECNOLOGIA, ES
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3:00TechConnect IP Partnering: PharmaceuticalsRoom 303
Session chair: Belen Martinez, CaramelTech, MX
3:00New Strategies For Secure, Non-Invasive Transitional for Brain Cancer Treatment
C. Michel, SOCPRA, CA
3:10Treatment of Influenza Virus-Mediated Lung Injury: Blocking the A1-Adenosine Receptor
I. Davis, The Ohio State University, US
3:20High-Throughput Label-Free Nanoparticle Detection And Size Assay
F. Caporale, University of California Santa Barbara, US
3:30Radionuclide-Loaded Liposome
C. Burke, UT Health Science Center at San Antonio, US
3:40Cerium oxide nanoparticles for treatment and prevention of Alzheimer’s disease, Parkinson’s disease, and disorders associated with free radical production and/or mitochondrial dysfunction.
B. Rzigalinski, Virginia Coll. of Osteopathic Medicine, US
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3:00TechConnect IP Partnering: Semiconductors, Sensors & MicrosystemsRoom 305
Session chair: Ryan Williams, Fraunhofer, US
3:00High-speed feedback controller
P. Lamoureux, Valeo Management, CA
3:10Organic/Inorganic Hybrid Optical Amplifier with Wavelength Conversion
L. Loerchner, University of Waterloo, CA
3:20Inertial Sensors Based on Magnetic Levitation
F. Barrot, CSEM SA, CH
3:30Low cost production of single crystal-like films
S. Lux, ETH Zurich - ETH transfer, CH
3:40Tunable High Sensitivity or Low Cost Gas Detectors
D. Nugent, University of Minnesota, US
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1:30US-China Nanotech ConnectExpo Hall Theater
1:30Introducing Suzhou Industry Park- a Vibrant and Progressive High-tech Hub in China
D. Zhang, Technology and Development Bureau, Suzhou Industrial Park (SIP), CN
1:45Overview of Suzhou Nano-manufacturing Capabilities
L. Liu, NanoGlobe, CN
2:00Printed electronics R&D in China and collaboration opportunities
Z. Cui, Suzhou Institute of Nanotech and Nanobionics (SINANO), CN
2:15Intradermal Drug Delivery Devices Based on Proprietary Functional Micro Array (FMA) Technology
B. Xu, Suzhou Natong Bionanotechnology Ltd. (Nanomed), CN
2:30Experience Sharing: Growing Venture Businesses in China
N. An, New England Chinese Information and Networking Association, CN
2:45Technology Partnership and Business Development Opportunities in Nanopolis Suzhou Q&A
L. Liu, NanoGlobe, CN
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3:30US-China Nanotech Connect - Networking Reception - Booth 930 Expo Hall C (3:30 - 4:00)Expo Hall Theater
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4:00Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707Expo Hall
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4:00Innovation Showcase & Poster Session - Reception (4:00 - 6:00)Expo Hall
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MEMS & NEMS Fabrication, Devices & ApplicationsExpo Hall
-Electrical performance comparison of Symmetric Toggle Switch for SiO2 and HfO2 dielectric layers
K. Maninder, Central Electronics Engineering Research Institute, IN
-Gravimeter on a Chip: An Theoretical Study
F. Li, J.V. Clark, Purdue University, US
-Quantum Electromechanichal oscillations and Current Enhancement by Compression of Buckled Carbon Nanotube Bundle
L.T. Singh, Indian Institute of Science, IN
-A simple and low cost method for fabrication of nanochannels using water soluble nanowires
A. Joshi, Agharkar Research Institute, IN
-A Novel Silicon-based Wideband Nano Switch for RF Applications
Y.X. Yang, R. Ramer, University of New South Wales (UNSW), AU
-Meander based RF MEMS capacitive switch for Mobile Front End Terminal Antenna support
P. Chawla, R. Khanna, KITM, Kurukshetra University Kurukshetra, IN
-Design and Analysis of FBAR switches for RF Front-End Mobile Terminal
P. Chawla, R. Khanna, KITM, Kurukshetra University Kurukshetra, IN
-Weak Magnetic Fields Sensing Using Soft Ferrite Nanoparticles and MEMS
S.E. Lyshevski, Rochester Institute of Technology, US
-Low-cost Thin-film Transistor-based Microcantilever for Measuring Deflection
P-Y Lin, Y-J Cheng, S. Kuan and L-S. Huang, National Tainwan University, TW
-Design and Characterization of a Fully Differential Mems Accelerometer Fabricated Using METALMUMPS Technology
P. Qu, Oakland University, US
-Calibrating the AFM with Self-Calibratable MEMS: An Theoretical Study
F. Li, J.V. Clark, Purdue University, US
-COMB FINGER CAPACITIVE MICRO WIND SENOR
Z. Zhao, Y. Han, L. Du, Z. Fang, X. Wang, Institute of Electronics,CAS, CN

Thursday June 16

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8:30MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
8:30Welcome and Introduction
R. Grace, Roger Grace Associates, US
8:45Think Beyond the Chip: Challenges of Smart System Integration and the Critical Role of the European Platform for Smart Systems (Keynote)
S. Coffa, ST Microelectronics, IT
9:30MEMS-Based System Solutions: Review and Overview with a Focus on Current and Emerging High Volume Applications (invited presentation)
R. Grace, Roger Grace Associates, US
9:50Power Optimization of heterogeneous and MEMS based systems: “Consume more to consume less” (invited presentation)
C. Van Hoof, IMEC, BE
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10:30Device Design and Simulation 1Room 205
10:30Design of Microassembly through Process Modeling in Virtual Reality
A.N. Das, H.E. Stephanou, University of Texas at Arlington, US
10:50Simulation of Field-Plate Effects on Surface-State-Related Lag and Current Slump in GaAs FETs
T. Tanaka, K. Itagaki, A. Nakajima, K. Horio, Shibaura Institute of Technology, JP
11:10Performance Study of Nitride-Based Gunn Diodes
G. Aloise, S. Vitanov, V. Palankovski, Advanced Material and Device Analysis Group, AT
11:30The role of Electromechanical coupling in AlGaN/AlN/GaN HEMTs
B. Padmanabhan, D. Vasileska, S.M. Goodnick, Arizona State University, US
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10:30Nano and Micro Technologies for Oil & GasRoom 303
Session chair: Chris Menzel, Dimatix, US
10:30Microfluidics and Microsensors for Downhole Oilfield Applications
C. Harrison, M. Sullivan, R. Schroeder, E. Smythe, P. Dryden, Schlumberger-Doll Research, US
10:50Design and Application of Novel Nano Drilling Fluids to Mitigate Circulation Loss Problems during Oil Well Drilling Operations
V. Mostafavi, M.Z. Ferdous, G. Hareland, M. Husein, University of Calgary, CA
11:10The Separation of Hydrocarbons from Sand Using Ionic Liquids
P. Painter, B. Miller, A. Lupinsky, P. Williams, Penn State University, US
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10:30MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
10:30MEMS sensors enable high-performance devices and unique system-level applications (invited presentation)
A. Oja, VTT Technical Research Centre of Finland, FI
10:50Integration Approaches of Combining Micro and Nano Technologies (invited presentation)
A. Rouzaud, Ph. Robert, J.-Ph. Polizzi, N. Sillon, Léti, FR
11:10Integration Challenges for High Performance Inertial Sensors (invited presentation)
R. Scannell, Analog Devices, Inc., US
11:30Optofluidics: exciting integration of two microsystem technology platforms (invited presentation)
A. Leinse, J. Walker, LioniX BV, US
11:50Integration Strategies for Magnetic Microsystems (invited presentation)
D. Harris, Advanced MicroSensors, Inc., US
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10:30TechConnect Corporate Partnering: Venture PartneringRoom 306
Session chair: Dina Lozofsky, University of California Santa Barbara, US
10:30BASF Corporate Partnering
P. Mukherjee, BASF Venture Capital America, US
10:50Panasonic TechConnect Partnering
I. Nydick, Panasonic, US
11:10Cabot TechConnect Partnering
T. Kodas, Cabot Corporation, US
11:30Honda TechConnect Partnering
N. Sugimoto, Honda, US
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1:00TechConnect Ventures: Biotech & MedicalRoom 303
Session chair: Belen Martinez-Lopez, CaramelTech
1:00Cellanyx Diagnostics
C. Ashok, Cellanyx Diagnostics, US
1:10Quegen Biotech Co.
J.D. Lee, Quegen Biotech Co., US
1:20BIO-FD&C Co., Ltd.
S.H. Moh, BIO-FD&C Co., Ltd., KR
1:30Sharklet Technologies, Inc.
M. Spiecker, Sharklet Technologies, Inc., US
1:40NanoMedical Systems, Inc.
R. Goodall, NanoMedical Systems, Inc., US
1:50Cosmas Therapeutics Development Inc.
M. Atkin, Cosmas Therapeutics Development Inc., CA
2:00WaveGuide Corporation
L. Fritzemeier, WaveGuide Corporation, US
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1:30Micro & Nano ReliabilityRoom 205
Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE
1:30Three-dimensional Deformation Analysis of MEMS/NEMS by means of X-ray Computer-Tomography
J. Hammacher, M. Dost, W. Faust, L. Scheiter, R. Erb, B. Michel, Fraunhofer ENAS, DE
1:50Comparative Analysis of Threshold Voltage Variations in Presence of Random Channel Dopants and a Single Random Interface Trap for 45 nm N-MOSFET as Predicted by Ensemble Monte Carlo Simulation and Existing Analytical Model Expressions
N. Ashraf, D. Vasileska, Arizona State University, US
2:10Reliability Analysis of Low Temperature Low Pressure Ag-Sinter Die Attach
R. Mrossko, H. Oppermann, B. Wunderle, T. Winkler, B. Michel, Berliner Nanotest und Design GmbH, DE
2:30Fracture mechanical test methods for interface crack evaluation of electronic packages
J. Keller, I. Maus, H. Pape, B. Wunderle, B. Michel, AMIC Angewandte Micro-Messtechnik GmbH, DE
2:50Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials
M. Abo Ras, Berliner Nanotest and Design GmbH, DE
3:10Correlation of Microstructure and Tribological Properties of Dry Sliding Nanocrystalline Diamond Coatings
M. Wiora, N. Sadrifar, K. Brühne, P. Gluche, H.-J. Fecht, Ulm University, DE
3:30Ultrathin Parylene-C Gate Dielectrics for Flexible Carbon Nanotube Field Effect Transistors
M. Mohebbi, S. Selvarasah, X. Li, B. Beauvais, M.R. Dokmeci, Northeastern University, US
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1:30MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
1:40Monitoring and Assessing the Structural Integrity of Infrastructure Systems using Next-Generation Sensor Technologies (invited presentation)
J.P. Lynch, University of Michigan, US
2:00Pixtronix DMS™ MEMS Technology for Broad Spectrum of Display System Applications (invited presentation)
R. Payne, J. Gandhi, T. Brosnihan, L. Steyn, J. Wu, J. DeRoo, S. Lewis, G. Fike, M. Halfman, N. Hagood, Pixtronix, Inc., US
2:20Wafer level packaging solutions for hermetic sealing, temperature control and vibration isolation (invited presentation)
J. Mitchell, S. Lee, K. Najafi, ePack, Inc., US
2:40Making a MEMs Mass Flow Controller for Portable Analytics (invited presentation)
R. Meisinger, B. Kinkade, Leister Technologies LLC, US
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2:30TechConnect Ventures: Semiconductors, Sensors & MicrosystemsRoom 303
Session chair: Bill Byun, 7Capital, US
2:30Linear Signal, LLC
G. Mockett, Linear Signal, LLC, US
2:40mc10
G. Callsen, mc10, US
2:50Nanofab3D Inc.
D. Diesk, Nanofab3D Inc., US
3:00Arkansas Power Electronics International, Inc.
T. McNutt, Arkansas Power Electronics International, Inc., US
3:10nanoLambda
B. Choi, nanoLambda, US
3:20VERSATILIS LLC
G. Powch, VERSATILIS LLC, US
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3:00MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
3:00Design for Reliability in MEMS-Based Systems (invited presentation)
A. Hartzell, Lilliputian Systems Inc., US
3:20Co-design of Heterogeneous Microsystems (invited presentation)
M.A. Maher, SoftMEMS LLC, US
3:40Improving Performance of Micro Structure and MEMS Designs by using Optical Measurement (invited presentation)
E.M. Lawrence, Polytec Inc., US
4:00Motivations for a common MEMS test methodology (invited presentation)
D. Feuerstein, SemiProbe, Inc., US
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4:30Technical and Business Collaboration Opportunities: MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
-High Value Sensor Systems – a Commercial View
G. Pease, Hewlett Packard, US
-Overview of ATK Micro-Technologies for Aerospace Applications
N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US
-System Solutions Using MEMS Sensors for Inertial Navigation and Wireless Sensor ApplicationsM. Grimmer, MEMSIC, Inc., US
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5:00TechConnect Closing Networking, Partnering & Investment Reception (3rd Floor, Boylston Hallway)Boylston Hallway

Special Symposium

This special symposia focuses specifically on emerging applications and advanced fabrication, materials, devices for MEMS and Sensors. Participating corporations are looking to the MEMS community for business and technology developement opportunities for their strategic needs. F-1000 corporate end-users participating include: Lockheed Martin, Honda, GM, GE, Samsung, Dow, BASF, bp, Siemens, Kodak, Proctor & Gamble, Applied Materials, Fuji Electric, Toray, Merck, Chevron, Omron, Panasonic, and many more. Submit your technical abstract today and join the leading innovators in providing new microtech solutions to the world's top corporate technology integrators.

Topics & Application Areas

  • Novel Materials for MEMS
  • Novel MEMS Fabrication & Processes
  • Acoustic Devices
  • Optical MEMS
  • Thermal Devices
  • Actuating Devices
  • Novel MEMS Devices
  • Novel NEMS Devices
  • RF MEMS, Resonators & Oscillators
  • Sensing Systems & Networks
  • Mechanical & Physical Sensors
  • Chemical & Gas Sensors
  • Other Micro Sensors
  • Other

Journal Submissions

Sensors & Transducers

On-line Journal ‘Sensors & Transducers’

Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.

For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.

Experimental Nanoscience

Journal of Experimental Nanoscience

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.

For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.

Molecular Simulation

Molecular Simulation

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of Molecular Simulation. The journal covers all aspects of research related to, or of importance to, molecular modelling and simulation (including informatics, theoretical and experimental work).

For consideration into this Special Issue of Molecular Simulations, please select the “Submit to Molecular Simulation” button during the on-line submission procedure.

 

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