Nanotech 2011

New Electrodeposition Process for Complex 3D Nanostructures

D. Dlesk, M.-F. Yu
Nanofab3D Inc., US

Keywords: direct-writing, electrodeposition, 3d, nanostructures

Abstract:

The 3D Direct-Writing Meniscus-Confined Electrodeposition System is an advanced nanofabrication technology which can produce complex 3D nanostructures. A glass micropipette is filled with an electrolyte and moved towards the substrate surface. At the instant of the meniscus formation between the micropipette and the substrate surface, a local electrodeposition of metal is initiated. The micropipette is then withdrawn from the substrate surface at a speed coinciding with the growth speed of the metal deposit, maintaining a stable meniscus. This allows the continuous fabrication of an out-of-plane nanowire, with a length limited by the withdrawal distance of the micropipette. A variety of metals can be used as long as they can be electrodeposited. This nanofabrication process has a number of advantages as compared to other technologies. This technique employs a direct-writing method, which provides ultimate flexibility in creating 3-D structures; it operates in an ambient environment, which makes it compatible with existing manufacturing processes and significantly reduces the cost of the fabrication equipment. This technology can be used to fabricate a wide range of products such as high density interconnects for integrated circuits, high-aspect ratio AFM probes for critical metrology, and nanoscale needle probes for cell biology research.
 

TechConnect World 2011 Nanotech 2011 Clean Technology 2011 Microtech 2011 BioNanotech 2011 TechConnect Summit 2011
Program | Tracks | Exhibition | Press | Venue | Register |
Symposia | Short Courses | News | Subscribe | Contact | Site Map
© Copyright 2010 TechConnect World. All Rights Reserved.