2010 International Conference on
Nanofabrication Technologies, Devices and Applications
NanoFab 2010
June 21 - 25, 2010
Anaheim Convention Center
Anaheim, California, U.S.A
An Interdisciplinary Integrative Forum on
manufacturability in nanofabrication processes and technologies
for current and novel devices and applications.
Sponsor
2010 Conference Chairs |
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2010 Invited Speakers |
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Symposium Sessions | ||
Tuesday June 22 | ||
| 1:30 | NanoFab: Nanopatterns Intersect Biology: DPN Special Session I | |
| 4:00 | Poster Session and TechConnect Expo (4:00 - 6:00) | |
Wednesday June 23 | ||
| 10:00 | Networking Coffee Break | |
| 10:30 | NanoFab: Direct Nanopatterning Fundamental Methods and Education: DPN Special Session II | |
| 1:30 | NanoFab: Novel Nanomaterials, Nanostructures, and Their Interactions | |
| 4:00 | Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall | |
| NanoFab & MEMSFab: Manufacture, Instrumentation | ||
| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | |
Thursday June 24 | ||
| 8:30 | Keynotes: Transformational Nanotech | |
| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | |
| 10:30 | NanoFab: Novel Applications of Top-Down Nanofabrication | |
| 1:30 | NanoFab: Carbon Nanostructuring; Fabrication of Organic Nanostructures | |
| 3:30 | International Standards Creation and Compliance in Nanotechnology | |
| 3:30 | NanoFab: Nanofabrication Development - Techniques and Facilities | |
| 4:00 | Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective | |
| 5:00 | TechConnect Investment Networking Reception - Second Floor | |
Symposium Program | ||
Tuesday June 22 | ||
| Back to Top | ||
| 1:30 | NanoFab: Nanopatterns Intersect Biology: DPN Special Session I | Room 303 A |
| Session chair: Jason Haaheim, NanoInk, US | ||
| 1:30 | Model Substrates Presenting Peptide Nanoarrays for Studies of Mechanistic Cell Behavior M.N. Yousaf, University of North Caroline at Chapel Hill, US | |
| 1:50 | Spatially nanopatterned ligands alter the response of ErbB receptors (invited presentation) K. Salaita, Emory University, US | |
| 2:10 | Novel opportunities for nanoscale surface scanning probe lithography (invited presentation) S. Rozhok, R. Shile, J. Fragala, N. Amro, M. Nelson, NanoInk, US | |
| 2:30 | Preparation of nanopatterned substrates via Dip-pen Nanolithography for stem cell applications S. Oberhansl, A. Lagunas, E. Martinez, H. Jamil, J. Samitier, Institute for Bioengineering of Catalonia, ES | |
| 2:50 | Functional lipid nanostructures fabricated by dip-pen nanolithography S. Lenhert, Florida State University, US | |
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| 4:00 | Poster Session and TechConnect Expo (4:00 - 6:00) | Expo Hall |
Wednesday June 23 | ||
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| 10:00 | Networking Coffee Break | Foyer 2nd Floor |
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| 10:30 | NanoFab: Direct Nanopatterning Fundamental Methods and Education: DPN Special Session II | Room 205 AB |
| Session chair: Aaron Stein, Brookhaven National Lab, US | ||
| 10:30 | Dip Pen Lithography: A Pathway to Traditional Science Research and Education D. Newberry, Dakota County Technical College, US | |
| 10:50 | Measurement of DPN-Ink Viscosity using an AFM Cantilever S. Biswas, M. Hirtz, S. Lenhert, H. Fuchs, Karlsruhe Institute of Technology, DE | |
| 11:10 | Self-Leveling Two Dimensional Probe Arrays for Dip Pen Nanolithography® J. Haaheim, V. Val, J. Bussan, S. Rozhok, J-W. Jang, J. Fragala, M. Nelson, NanoInk, US | |
| 11:30 | Point-Mass Model for Nano-Patterning Using Dip-Pen Nanolithography (DPN) S.-W. Kang, D. Banerjee, Texas A&M University, US | |
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| 1:30 | NanoFab: Novel Nanomaterials, Nanostructures, and Their Interactions | Room 205 AB |
| Session chair: Jason Haaheim, NanoInk, US | ||
| 1:30 | Neuronal interactions with patterned surfaces, nanofab methods interacting with bio entities (invited presentation) J. Williams, University of Wisconsin-Madison, US | |
| 1:50 | Hierarchically Branched Gecko Tapes Imprinted Using Porous Alumina Templates A.H.Y. Yee, I. Rodríguez, Y.C. Lam, Institute of Materials Research and Engineering, SG | |
| 2:10 | PRINT® Nanoparticle Manufacturing Scaleup for Pharmaceutical Applications D.A. Schorzman, Liquidia Technologies, Inc., US | |
| 2:30 | Photonic Curing of Silver Nanoparticle Based Inks Deposited by M3D J. West, M. Carter, S. Smith, J. Sears, South Dakota School of Mines and Technology, US | |
| 2:50 | Self-assembly derived sub-50nm scale silicon pillar arrays as high resolution molds for nanoimprint lithography S. Krishnamoorthy, Institute of Materials Research and Engineering (IMRE), SG | |
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| 4:00 | Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall | Expo Hall |
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| NanoFab & MEMSFab: Manufacture, Instrumentation | Expo Hall | |
| - | In-situ Growth of Gold Nanoparticles Conductive Layer on Plastic Film as an Integrated Lead Ions Sensor X. Zhang, C.G. Hu, S.S. Hu, Wuhan University, CN | |
| - | Multicomponent Nanoarrays: Platform for High Sensitive Protein Detections R. Sanedrin, N. Amro, E. Gubbins, J. Ohayon, D. Delaney, S. Rozhok, M. Coen, K. Rusniak, K. Ouyang, I. Ivanov, NanoInk, Inc., US | |
| - | Intermittent desolvation method to prepare size-controlled BSA nanoparticle S-Y-R Paik, H.H. Nguyen, S.C. Yang, J. Che, S. Ko, Sejong university, KR | |
| - | Alkoxide-based precursors for direct drawing of metal oxide micro- and nanofibres T. Tätte, M. Hussainov, G. Kelp, R. Rand, J. Gurauskis, A. Lõhmus, University of Tartu, EE | |
| - | Fabrication of pyramid array nanostructure on gallium nitride C-C Hsieh, W-C Ke, N-P Chen, W-J Lin, Y-C Cheng, T-C Li, J-C Lin, Yuan Ze University, TW | |
| - | Preparation of Electrospun TPU/PCMs Nanofibers as a Thermostatic Clothing Material K. Choi, D. Branson, A. Osta, K. Sallam, Oklahoma state university, US | |
| - | Fabrication of biodegradable zein films by using soft lithography B. Altunakar, J.L. Kokini, University of Illinois at Urbana-Champaign, US | |
| - | Deposition of Interwoven Fibrous Nanostructure using Ultrafast Laser Ablation in Ambient Condition A. Tavangar, B. Tan, K. Venkatakrishan, Ryerson University, CA | |
| - | VDK 4000 Direct Write System: A new approach to direct write technology M. Theodore, J. Fielding, J. Royer, V. Kalanovic, J. Nirilovic, J. Sears, AFRL, US | |
| - | Development of Nitrogen modified TiO2 and activated carbon fiber composites in single step C.-Y. Tsai, H.-C. Hsi, K.-S. Fan, National Taipei University of Technology, TW | |
| - | Development of Precision Stage with Magnified Displacement System J.G. Kim, S.C. Choi, D.W. Lee, Pusan national University, KR | |
| - | Practical issues with ion beam milling in acoustic resonator technologies S. Mishin, Y. Oshmyansky, F. Bi, Advanced Modular Systems, Inc, US | |
| - | Design and assessment of transparent superhydrophobic glass surface with micro-network of nanopillars J.-S. Park, J.-H. Noh, H.-E. Lim, W.-D. Kim, Korea Institute of Machinery and Materials, KR | |
| - | Cost Efficient Method of Rapid Prototyping of Microfluidic Channels and Lab-on-chip Applications N. Alavi, C. Drewbrook, M. Akbari, A. Khosla, Simon Fraser University, CA | |
| - | Investigation on correlation between cold/hot weld line mechanical properties and micro injection molding processing parameters L. Xie, D. Zhu, G. Ziegmann, L. Steuernagel, Technology University of Clausthal, DE | |
| - | Machining Using Fast Tool Servo Combined with Ultrasonic Vibrator S.C. Choi, Lu Hong, D.W. Lee, Pusan University, KR | |
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| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | Ballroom BC |
Thursday June 24 | ||
| Back to Top | ||
| 8:30 | Keynotes: Transformational Nanotech | Room 303 CD |
| Session chair: Clayton Teague, NNCO, US | ||
| 8:30 | Nanotechnology: Path Toward Commercialization at GE M. Butts, General Electric, US | |
| 9:00 | Getting the Memristor to Market S. Williams, Hewlett Packard, US | |
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| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | Ballroom BC |
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| 10:30 | NanoFab: Novel Applications of Top-Down Nanofabrication | Room 210 C |
| Session chair: Guy DeRose, Caltech, US | ||
| 10:30 | Nanoscale Device Fabrication using Focused Ion Beam and Scanning Electron Beam (DualBeamTM) Technology L. Giannuzzi, FEI, US | |
| 10:50 | Silicon Nanostructure Fabrication by Direct FIB Writing and TMAH Wet Chemical Etching P. Sievilä, N. Chekurov, I. Tittonen, Aalto University, FI | |
| 11:10 | Fabrication of Micro Photonic Crystals for Handling of Terahertz Electromagnetic Waves S. Kirihara, D. Sano, T. Niki, N. Ohta, Y. Takinami, Osaka University, JP | |
| 11:30 | Efficient coupling of light into nanometer sized objects via dielectric microcavities and metal nanoantennas M. Hagner, T. Thomay, M. Kahl, J. Merlein, V. Kohnle, T. Hanke, A. Leitenstorfer, R. Bratschitsch, University of Konstanz, DE | |
| 11:50 | Nanomechanical Mass Spectrometry and NEMS VLSI A. Naik, California Institute of Technology, US | |
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| 1:30 | NanoFab: Carbon Nanostructuring; Fabrication of Organic Nanostructures | Room 210 C |
| Session chair: Aaron Stein, Brookhaven National Lab, US | ||
| 1:30 | DNA Nanostructures (invited presentation) B. Sherman, Brookhaven, US | |
| 1:50 | Nanoscale Graphene Lithography Using an Atomic Force Microscope K. Kumar, E.H. Yang, Stevens Institute of Technology, US | |
| 2:10 | Measurement of Figure of Merit for a Single β-Silicon Carbide Nanowire by the Four-Point Three-ω Method T.Y. Choi, University of North Texas, US | |
| 2:30 | Nanotube Lithography (invited presentation) Y.H. Wang, University of Maryland, US | |
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| 3:30 | International Standards Creation and Compliance in Nanotechnology | Room 202 A |
| Session chair: William S. Rogers, Day Pitney | ||
| - | J.A. Clark, Day Pitney LL, US | |
| - | S.R. Amdt, Exponent, Inc., US | |
| - | R.C. Pleus, Intertox, Inc., US | |
| - | M.E. Marrapese, Keller and Heckman, US | |
| - | C. Teague, National Nanotechnology Coordination Office, US | |
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| 3:30 | NanoFab: Nanofabrication Development - Techniques and Facilities | Room 210 C |
| Session chair: Guy DeRose, Caltech, US | ||
| 3:30 | The Application of the Fixed Beam Moving Stage (FBMS) Lithography Mode and the Metrology Toolset to Fabricate and Measure Waveguide Coupling Devices J. E. Sanabia, J. Klingfus, M. Aktary, Raith USA, Inc., US | |
| 3:50 | The Challenges Facing Open Access Nanofabrication Facilities R. Hicks, Australian National Fabrication Facility, AU | |
| 4:10 | Influence of resist composition on demolding force in UV nanoimprint lithography A. Amirsadeghi, J. Lee, S. Park, Louisiana State University, US | |
| 4:30 | Maskless Lithography Using Patterned Amorphous Silicon Layer Induced by Femtosecond Laser Irradiation A. Kiani, K. Venkatakrishnan, B. Tan, Ryerson University, CA | |
| 4:50 | Characterization of an ultra high aspect ratio electron beam resist for nano-lithography S. Lewis, D. Jeanmaire, V. Haynes, L. Piccirillo, The University of Manchester, UK | |
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| 4:00 | Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| - | J. Brown, MEMS and Nano Exchange, US | |
| - | K. Lightman, MEMS Industry Group, US | |
| - | W. McCulley, InterMEMS, US | |
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| 5:00 | TechConnect Investment Networking Reception - Second Floor | Foyer 2nd Floor |
Announcement and Call for Participation
About NanoFab
The largest gathering in the field worldwide, NanoFab is the premier technical forum for presenting the latest research and development in nanofabrication technologies, devices and applications.
Objectives
Nanotechnology promises an unprecedented era of innovation across multiple disciplines and diverse applications. Its pursuits and activities are proliferating with different approaches, from top-down to bottom-up to converging techniques, and with varying degree of maturity from concept to commercialization. The key to realize nanotechnology's potential is still the ability to assemble and manufacture nano-scale devices, structures with dimensions smaller than 100nm. This conference will focus on all areas of nanofabrication that will accelerate nanotechnology's progress: innovative research to state-of-the-art development to cost-effective manufacturability in nanofabrication processes and technologies for current and novel devices and applications, including enabling and differentiating aspects in materials, metrology, characterization, and reliability.
Topics & Application Areas
- Novel Materials, Nano-Structures, and Nanoscale Processes
- Novel Nanoscale Device Fabrication (including nanophotonics)
- Carbon Nano Structure Devices and Nano-Wires: Fabrication and Applications
- Advances in Direct-Write Nanoscale Deposition and Patterning
- Advances in Bottom-Up Approaches to Nano-Composites and Nano-Particles
- Non-Conventional Nano-Patterning: Top Down/Bottom Up Convergence
- Harnessing Nanofabrication for Pharmaceutical Applications: biosensors, drug delivery, screening
- Symbiotic technologies in Nanofabrication and Inspection: patterning, deposition, microscopy, and spectroscopy
- Other
All papers on nano-applications in photonic, microelectronic, telecommunication, chemical, biotech, medical, pharmaceutical, homeland security, environmental, agricultural, consumer, and transportation are relevant. The primary focus is on innovative fabrication that significantly advances current application and enables novel nano-application.
Nanofabrication papers that have significant overlap with other Nanotechnology Conferences at NSTI Nanotech may be presented in joint sessions to enhance the synergism of the Nanotechnology Conferences.
Journal Submissions
Journal of Experimental Nanoscience
Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.
For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.
Microelectronics Journal
Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.
For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.
Conference Organization
Conference Chairs
Jason Haaheim, NanoInk, Ink.Guy A. DeRose, California Institute of Technology
Aaron Stein, Brookhaven National Laboratory
Program Committee
Adekunle Adeyeye, National University of Singapore, Singapore
Ronald S. Besser, Stevens Institute of Technology, USA
Gregory R. Bogart, Symphony Acoustics, USA
Charles Kin P. Cheung, NIST, USA
Zheng Cui, Principal Scientist, Group Leader,Micro and Nanotechnology Centre, Rutherford Appleton Laboratory, UK
Guy A. DeRose, California Institute of Technology, USA
Majeed Foad, Applied Materials, USA
Zhixiong Guo, Rutgers University, USA
Takamaro Kikkawa, Hiroshima University and National Institute of Advanced Industrial Science and Technology, Japan
Jungsang Kim, Duke University, USA
Uma Krishnamoorthy, Sandia National Laboratory, USA
Andres H. La Rosa, Portland State University, USA
Warren Y.C. Lai, New Jersey Institute of Technology, USA
Pawitter Mangat, Motorola, USA
Vivian Ng, National University of Singapore, Singapore
Leonidas E. Ocola, Argonne National Laboratory
Sang Hyun Oh, University of Minnesota, USA
Nag Patibandla, Applied Materials, USA
Stanley Pau, University of Arizona
John A. Rogers, University of Illinois at Urbana-Champaign, USA
Nicolaas F. de Rooij, Université de Neuchâtel, Switzerland
Aaron Stein, Brookhaven National Laboratory, USA
Rajesh Swaminathan, Applied Materials, USA
Vijay R. Tirumala, Cabot Corporation, USA
Gary Wiederrecht, Argonne National Laboratory, USA
Eric Witherspoon, Applied Materials, USA























