Nanotech 2010

Sintered copper nanoparticle paste as a low cost replacement for solders in high power electronics

L. Laxton, R. Fink, J.P. Novak
Applied Nanotech, Inc., US

Keywords: solder, electronics, copper, nanoparticles, bonding, thermal

Abstract:

The electronics packaging industry faces a pressing need for thermally stable, highly thermally conductive, lead-free materials for bonding components. State of the art lead-free solders are prone to fatigue and crack in demanding applications. ANI has succeeded in developing a copper nanoparticle paste that can be sintered at component compatible temperatures to create a thermally conductive and thermally stable adhesive between electronic components and substrates
 
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