Nanotech 2010

Thermomechanical Reliability for Emerging Technologies: Implications for Microelectronic and Photovoltaic Devices

R.H. Dauskardt
Stanford University, US

Keywords: thermomechanical reliability, photovoltaic device

Abstract:

Materials and interfaces in device technologies operate near the envelope of their mechanical and adhesive properties with remarkably high levels of film stress. Debonding and cohesive fracture are major challenges for device reliability at all levels of processing and packaging. In the case of emerging photovoltaic technologies, the thermomechanical properties of device structures including the adhesion and cohesion of component layers are critical for aiding new materials integration as well as understanding longer term device reliability and durability. In this presentation we describe research aimed at characterizing thin-film thermomechanical properties including adhesion and cohesion that are critical for emerging device technologies. We consider particular challenges of integrating nanostructured materials like nanoporous ULK materials and heterojunction layers in photovoltaic devices. Manipulating the composition and molecular structure of nanomaterials is shown to optimize thermomechanical properties. Specifically, we consider strategies to produce molecularly reinforced ULK materials for device technologies, hybrid glass layers for enhanced adhesion in packaging, and finally we consider the role of composition and molecular structure on cohesion in bulk heterojunction layers used in emerging photovoltaic devices. We describe research to quantitatively characterize critical thermomechanical properties in typical organic and inorganic organic solar cells. We finally consider how fabrication or operating environments may affect device reliability. We will particularly consider the synergistic effects of environmental species like water and surfactant molecules, mechanical stresses, temperature and in the case of photovoltaic devices, the role of solar UV radiation on the kinetic processes of damage formation and growth. These are centeral to understanding and predicting device reliability through processing and in service.
 
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