Symposium Chair |
|||||||
|
|
||||||
Symposium Sessions | ||
Tuesday June 19 | ||
| 12:30 | Networking Lunch - Expo | |
| 2:45 | TechConnect IP Partnering: Electronics, Sensors, Communications | |
| 4:30 | Expo Reception and Poster Session I | |
| Nanostructured Materials & Devices | ||
Wednesday June 20 | ||
| 8:30 | Flexible Electronics I | |
| 11:00 | Flexible Electronics II | |
| 12:30 | Networking Lunch - Expo | |
| 1:00 | NNI - Director's Networking Session, National Nanotechnology Coordination Office | |
| 1:30 | Exhibit and Poster Session II | |
| 2:30 | TechConnect IP Partnering: Cleantech, Energy, Environment | |
| 3:30 | Nanostructured Materials & Devices for Electronics Applications | |
| 5:30 | TechConnect Innovation Showcase Reception | |
| 6:00 | CTSI Utility Technology Challenge Awarde and Reception | |
Thursday June 21 | ||
| 8:30 | Nano Electronics & Photonics: Keynotes | |
| 10:00 | National Nanotechnology Initiative Triennial Review | |
| 11:00 | Advanced Electronic Packaging | |
| 12:30 | Networking Lunch - Innovation Showcase | |
| 1:00 | TechConnect Start-Up Partnering: Electronics, Sensors & Communications | |
| 1:30 | Novel Nano Electronics & Photonics | |
| 1:30 | MEMS & NEMS: Industrial Applications and Services | |
| 4:00 | TechConnect National Innovation Showcase, Reception & Poster Session III | |
| Nano Electronics & Photonic Devices | ||
Symposium Program | ||
Tuesday June 19 | ||
| ↑ Back to Top | ||
| 12:30 | Networking Lunch - Expo | Expo Hall AB |
| ↑ Back to Top | ||
| 2:45 | TechConnect IP Partnering: Electronics, Sensors, Communications | Room 212 |
| Session chair: Keith Ritala, Quest, US | ||
| 2:45 | Electric Current Locator K. Klos, National Energy Technology Laboratory (URS Corporation), US | |
| 2:55 | Organic/Inorganic Hybrid Optical Amplifier with Wavelength Conversion L. Loerchner, University of Waterloo, CA | |
| 3:05 | High Performance Video Compression Coding System L. Loerchner, University of Waterloo, CA | |
| 3:15 | Batteryless Nanoenergy Harvesting I. Shum, Lawrence Livermore National Laboratory, US | |
| 3:25 | Hydrophobicity Modulating Underwater Chemical Sensor M. Sethu, National University of Singapore, Industry Liaison Office, SG | |
| 3:35 | Ultra-miniaturized, Passive Wireless Sensor E. Hockert, University of Minnesota, US | |
| ↑ Back to Top | ||
| 4:30 | Expo Reception and Poster Session I | Expo Hall AB |
| ↑ Back to Top | ||
| Nanostructured Materials & Devices | ||
| - | Adhesion and dynamic nanotribology of graphene in polar and non-polar liquid environments studied with ultrasonic force microscopy B.J. Robinson, O.V. Kolosov, Lancaster University, UK | |
| - | Synthesis, Characterisation and Catalytic Studies Copper Substituted Nickel Zinc Ferrite Nano Powders P. Douglas Sanasi, D. Santhi Priya, P. Nageswara Rao, Andhra University, IN | |
| - | Hysteresis-free spin valves for GMR sensors V.V. Ustinov, M.A. Milyaev, L.I. Naumova, V.V. Proglyado, T.P. Krinitsina, Institute of Metal Physics, RU | |
| - | Exchange Bias Formation Mechanism in (110)Al2O3/Py/Mn/Ta Nanostructures I.V. Blinov, T.P. Krinitsina, S.A. Matveev, M.A. Milyaev, V.V. Popov, V.V. Ustinov, Institute of Metal Physics, RU | |
| - | Synthesis and Characterization of Graphene Thin Films via Hummer’s Method. F.T. Thema, M.J. Moloto, N.N. Nyangiwe, M. Khenfouch, M. Maaza, L Kotsedi, E.D. Dikio, Vaal University Of Technology, ZA | |
| - | Comparison of Anchoring Materials for High Performance Sensors Modified with Nanoparticles and Enzymes X. Gao, D. Assan, J.C.K. Lai, S.W. Leung, Idaho State University, US | |
| - | Selective Reflectivity and High Absorption in Plasmonic Films A. Siahmakoun, M. Syed, C. Bolinger, Rose-Hulman Institute of Technology, US | |
| - | Synthesis of SiOx Nanowires at Low Temperatures Using Zn Catalyst C-S Choi, J-H Yoon, Kangwon National University, KR | |
| - | AuxAg1-x alloy seeds: A way to control growth, morphology and defect formation in Ge nanowiress S. Biswas, J.D. Holmes, University College Cork, IE | |
| - | CdS Quantum Dot-sensitized anatase single crystalline Branched-TiO2 nanowires for Photoelectrochemical Hydrogen Production D.H. Kim, W.M. Seong, J.H. Park, H.S. Han, I.J. Park, I.S. Cho, S.S. Shin, S. Lee, K.S. Hong, Seoul National University, KR | |
| - | Growth Mechanism of Zinc Oxide Nanowires by Geometrical Selection and the Effect of Zinc Oxide Binding Peptides T.Y. Olson, A.A. Chernov, K.E. Murphy, J.H. Satcher, T.Y. Han, Lawrence Livermore National Laboratory, US | |
| - | Analysis of GaN Grown on Vertically Standing Fractal-Like Si Nanostructures Q.X. Wee, C.B. Soh, K.Y. Zang, S.J. Chua, C.V. Thompson, National University of Singapore (NUS), SG | |
| - | Application of ZnO Nanorods for a UV Photodetector C.Y. Kung, S.L. Young, C.C. Lin, H.H. Lin, J.H. Lin, H.Z. Chen, M.C. Kao, Y.T. Shih, National Chung Hsing University, TW | |
| - | Carbon Nanotube Applications for Nanoelectronics S. Roth, Korea University, KR | |
| - | Nanoneedle DIrected Motion of a Functionalized Channel through a Lipid Membrane M. Dutt, O. Kuksenok, A.C. Balazs, Rutgers University, US | |
| - | Au nanoelectrodes for breath analysis M. Righettoni, A. Tricoli, S.E. Pratsinis, ETH Zurich, CH | |
| - | Well-Defined TiO2 Nanostructures Towards Photoanodes Applications for Oxidative Photoelectrochemistry Y. Pihosh, K. Mawatari, T. Kitamori, The University of Tokyo, JP | |
| - | The controllable degree of preferred-orientation in anatase TiO2 nanotube arrays by controlling surface roughness of Ti W.M. Seong, D.H. Kim, I.J. Park, S. Lee, K.S. Hong, Department of Materials Science Engineering, Seoul National University, Korea, KR | |
| - | Electrospun Silver Networks as Transparent Conductive Films H-T Chen, H-L Ling, C. Kuo, I-G Chen, National Cheng Kung University, TW | |
Wednesday June 20 | ||
| ↑ Back to Top | ||
| 8:30 | Flexible Electronics I | Grand Ballroom D |
| Session chair: Anupama B. Kaul, National Science Foundation, US | ||
| 8:30 | Artificial Electronic Skin A. Javey, University of California, Berkeley, US | |
| 9:00 | Organic Complementary Circuits A. Dodabalapur, University of Texas at Austin, US | |
| 9:30 | Highly sensitive organic-inorganic heterojunction flexible photodetectors J-H Seo, T-Y Oh, J. Park, W. Zhou, B-K Ju, Z. Ma, University of Wisconsin, Madison, US | |
| ↑ Back to Top | ||
| 11:00 | Flexible Electronics II | Grand Ballroom D |
| Session chair: Anupama B. Kaul, National Science Foundation, US | ||
| 11:00 | Fabrication and characterization of CNT inductors on flexible plastic substrates L. Diao, W-S Shih, J. Lamb, Brewer Science, US | |
| 11:20 | Flexible Graphene Transistors via Printing Transfer T.-C. Chang, H.-S. Suh, S. Mikael, J.-H. Seo, P.F. Nealey, Z. Ma, University of Wisconsin-Madison, US | |
| 11:40 | Highly Flexible Transparent Thin Film Heaters based on Metallic Nanowires J.-P. Simonato, CEA, FR | |
| 12:00 | Solution Growth of Nanostructured Ceramic Films J. Cho, State Univ of New York (SUNY) at Binghamton, US | |
| 12:20 | Fabrication and characterization of thin-film transistors based on Peri-xanthenoxanthene (PXX) derivative Z. Cui, Chinese Academy of Sciences, CN | |
| ↑ Back to Top | ||
| 12:30 | Networking Lunch - Expo | Exhibit Hall AB |
| ↑ Back to Top | ||
| 1:00 | NNI - Director's Networking Session, National Nanotechnology Coordination Office | Exhibit Hall A |
| ↑ Back to Top | ||
| 1:30 | Exhibit and Poster Session II | Exhibit Hall AB |
| ↑ Back to Top | ||
| 2:30 | TechConnect IP Partnering: Cleantech, Energy, Environment | Room 212 |
| Session chair: Patricia Ansems-Bancroft, Dow, US | ||
| 2:30 | Hybrid Green Cement L. Simoes, Wayne State University, US | |
| 2:40 | New Polymeric Material and Process for Recycling Plastic Blends N. Gadoury, Univalor, CA | |
| 2:50 | Buckled Silicon Nanostructures on Elastomeric Substrates for Rechargeable Lithium Ion Batteries B. Loux, Arizona Technology Enterprises, US | |
| 3:00 | High Performance, High Life Cycle Anode for Lithium Ion Batteries L. Simoes, Wayne State University, US | |
| 3:10 | Low-cost technology for production of the highly efficient flexible nano-structured materials for Photovoltaic Panels and Supercapacitors. B. Gilman, Coolsol R&C, US | |
| ↑ Back to Top | ||
| 3:30 | Nanostructured Materials & Devices for Electronics Applications | Grand Ballroom D |
| 3:30 | Carbon Nanotube Memory T. Rueckes, Nantero, Inc, US | |
| 4:00 | Carbon Nanostructure Applications for Nanoelectronics S. Roth, Max Planck Institute, DE | |
| 4:30 | Three-Dimensional Nanographene as a Low-Cost Tunable Bulk Material J. Biener, A. Wittstock, S. Dasgupta, L.-H. Shao, D. Wang, M.A. Worsley, J.R.I. Lee, M.M. Biener, C. Orme, S.O. Kucheyev, B.C. Wood, T.M. Willey, A.V. Hamza, J. Weissmüller, H. Hahn, T.F. Baumann, Lawrence Livermore Nat Laboratory, US | |
| 4:50 | Silicon nanowire and graphene FET sensors as new reference electrodes in electrolytic environments O. Knopfmacher, A. Tarasov, W. Fu, C. Nef, J. Kurz, K. Bedner, M. Wipf, M. Calame, C. Schönenberger, University of Basel, CH | |
| ↑ Back to Top | ||
| 5:30 | TechConnect Innovation Showcase Reception | Expo Hall CD |
| ↑ Back to Top | ||
| 6:00 | CTSI Utility Technology Challenge Awarde and Reception | Expo Theater 1 |
| Session chair: Patti Glaza, Arsenal Venture Partners, US | ||
Thursday June 21 | ||
| ↑ Back to Top | ||
| 8:30 | Nano Electronics & Photonics: Keynotes | |
| ↑ Back to Top | ||
| 10:00 | National Nanotechnology Initiative Triennial Review | Great America 1 |
| Session chair: Erik Svedberg, National Materials and Manufacturing, National Academies, US | ||
| 10:00 | NNI Town Hall Meeting TBD, National Nanotechnology Initiative, US | |
| ↑ Back to Top | ||
| 11:00 | Advanced Electronic Packaging | Room 210 |
| 11:00 | A Novel Method to Maintain Alignment Accuracy in Bonding Process Utilizing Resin as an Adhesive Material S.-S. Lee, M. Kondo, R. Ishibashi, K. Kinoshita, S. Kishida, Tottori University, JP | |
| 11:20 | Off-Chip Printed Interconnects for Ultrathin Flexible Products H. Alemohammad, A. Zadeh, J. Sheats, E. Toyserkani, University of Waterloo, CA | |
| 11:40 | Improved RF Characteristics of Carbon Nanotube Interconnects with Deposited Tungsten Contacts A.A. Vyas, F. Madriz, N. Kanzaki, P. Wilhite, J. Tan, T. Yamada, C.Y. Yang, Santa Clara University, US | |
| 12:00 | nanoCopper based solder-free electronic assembly material A. Zinn, R. Stoltenberg, Lockheed Martin Space Systems Company Adv. Technol. Center, US | |
| ↑ Back to Top | ||
| 12:30 | Networking Lunch - Innovation Showcase | Expo Hall CD |
| ↑ Back to Top | ||
| 1:00 | TechConnect Start-Up Partnering: Electronics, Sensors & Communications | Expo Theater 3 |
| Session chair: Matt Denesuk, IBM Venture Capital, US | ||
| 1:00 | P-Ink Active Heat Reflection Display P. Chan, Opalux Inc., CA | |
| 1:10 | Next Generation Flat Panel Display Technology T. Whitfield, NanoPhotonica, US | |
| 1:20 | Advanced Infra-red Thermal Imaging V. Novotny, AltraVision, US | |
| 1:30 | Nanowire based flexible transparent electrode H. Wang, Polyradiant Corp, US | |
| 1:40 | 6x and Beyond MEMS Inertial Sensor and Applications L. Ross, Virtus Advanced Sensors, Inc., US | |
| 1:50 | Impulse Synthetic Aperture Radar for Remote Through-Wall and Underground Imaging J. Tatoian, Eureka Aerospace, US | |
| 2:00 | On the Field internal pipe Inspection robotic Vehicle (FIV) A. Manesh, American Science and Technology Corporation, US | |
| 2:10 | TranSono Noise Reduction and Echo Cancellation T. Kim, TranSono Inc., KR | |
| 2:20 | APEtalk Speech Synthesis J. Pearl, Perceptral, US | |
| ↑ Back to Top | ||
| 1:30 | Novel Nano Electronics & Photonics | Grand Ballroom H |
| 1:30 | On the Possibility of Ultra-Low Power Switching in Multilayer Graphene Nanostructures B. Dellabetta, J. Shumway, M.J. Gilbert, University of Illinois, US | |
| 1:50 | Inherently Radiation Hardened Electronics: A Examination of III-V Nanowire Transistors and Spin-Based Logic Devices D. Telesca, Air Force Research Lab (AFRL), US | |
| 2:10 | Charge Manipulation in Silicon Atomic Quantum Dots for Nano-Electronic Computing Architectures J.L. Pitters, L. Livadaru, M.B. Haider, M. Taucer, R.A. Wolkow, National Research Council of Canada, CA | |
| 2:30 | Polymer:Nanoparticle Memristors with Electrode-Sensitive Resistive Switches J. Ouyang, National University of Singapore, SG | |
| 2:50 | Random Work Function Induced DC Characteristic Fluctuation in 16-nm High-k/Metal Gate Bulk and SOI FinFETs H-W Su, Y-Y Chen, C-Y Chen, H-W Cheng, H-T Chang, Yiming Li, National Chiao Tung University, TW | |
| ↑ Back to Top | ||
| 1:30 | MEMS & NEMS: Industrial Applications and Services | Great America 2 |
| 1:30 | Health monitoring of flexible composite plates: a MEMS-based approach S. Mariani, A. Corigliano, F. Caimmi, M. Bruggi, P. Bendiscioli, M. De Fazio, Politecnico di Milano, STMicroelectronics, IT | |
| 1:50 | A CRITICAL ASSESSMENT OF TECHNOLOGIES FOR ELECTRONIC COMPASS APPLICATIONS Y. Zhao, Y. Cai, X. Ding, Memsic Inc., US | |
| 2:10 | MEMS Oscillators A. Partridge, SiTime, Corp., US | |
| 2:30 | Advances in MEMS Fabrication for Fabless MEMS Companies M. Lim, M. Daneman, InvenSense, US | |
| ↑ Back to Top | ||
| 4:00 | TechConnect National Innovation Showcase, Reception & Poster Session III | Expo Hall CD |
| ↑ Back to Top | ||
| Nano Electronics & Photonic Devices | ||
| - | Print Transferrable Large-Area Broadband Membrane Reflectors by Laser Interference Lithography J-H Seo, J. Park, D. Zhao, H. Yang, W. Zhou, B-K Ju, Z. Ma, University of Wisconsin-Madison, US | |
| - | Quantum Breathers in Klein-Gordon Lattice in Ferroelectrics A. Biswas, S.J. Mandal, R. Basu, A.K. Bandyopadhyay, A.K. Bhattacharjee, D. Mandal, Dumkal Institute of Engineering & Technology, IN | |
| - | Synthesis of ZnO Nanosheets by Exposing Zn Film to Oxygen Plasma at Low Temperatures J.H. Yoon, Kangwon National University, KR | |
| - | Investigation of Frequency Dependent Noise Performance Metrices for Gate Electrode Work function Engineered Recessed Channel MOSFET A. Agarwala, R. Chaujar, Delhi Technological University, IN | |
| - | Fabrication and Characterization of of Nanoscale Tellurium Fuses for Long Term Solid State Data Storage A.C. Pearson, B. Singh, M.R. Linford, B.M. Lunt, R.C. Davis, Brigham Young University, US | |
| - | Suppression of Variability in Metal Source/Drain SOI MOSFET with Partial Buried Oxide and δ-doping G.C. Patil, S. Qureshi, Indian Institute of Technology Kanpur, IN | |
| - | A model to describe the hump-like feature observed in the accumulation branch of CV-characteristics of MOS capacitors with oxide-hosted Si nanoparticles V.A. Stuchinsky, G.N. Kamaev, M.D. Efremov, S.A. Arzhannikova, Institute of Semiconductor Physics, RU | |
| - | MIM Capacitors with stacked dielectrics H. Gopalakrishnan, B.J. Kailath, Indian Institute of Information Technology Design and Manufacturing, Kancheepuram, IN | |
| - | Dynamical Tunneling in the Systems of Double Quantum Dots and Rings I. Filikhin, S.G. Matinyan, B. Vlahovic, North Carolina Central University, US | |
Scaling of semiconductor devices has continued unabated for the past three decades, and will likely continue for the near future. However, at the end of this decade (ca. 2011), the nature of the silicon device is such that many alternative approaches are likely to be viable contenders.
Electronic, photonic and communication device opportunities are emerging, but require coordinated industrial efforts to realize their potential. Already, new materials (SOI, SiGe, strained Si) are used in current production, high-k dielectrics, fully metallic gates and more non-(Si, SiO2) are expected in the coming generations. In addition, low dimension structures such as Fin-FETS are being considered.
Yet, the International Technology Roadmap for Semiconductors does not identify logic devices beyond CMOS, which presents a unique opportunity for the research community to influence the future of technology. Consequently, this symposium will address the role of several prospective technologies in creating new device options in the post-2011 era (sub-10 nm equivalent technologies). It will provide a forum for the presentation of new designs, processes, devices, architectures, and characterization at the nanoscale. Content will be mindful of the rigors of the existing roadmaps and their associated infrastructure, but will also explore extensions to the roadmap in alignment with industry, SIA and governmental initiatives.
Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.
For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.
Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.
For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.
Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of Molecular Simulation. The journal covers all aspects of research related to, or of importance to, molecular modelling and simulation (including informatics, theoretical and experimental work).
For consideration into this Special Issue of Molecular Simulations, please select the “Submit to Molecular Simulation” button during the on-line submission procedure.
| Exhibit and Showcase |
| Become a Sponsor |
Please contact: Denise Lee
| MEMS & Microsystems | ![]() |
| Medical & Biotech | ![]() |
| Design, Fabrication & Characterization | ![]() |
| Business & Partnering | ![]() |




























