Nano Electronics & Photonic Devices

Nano Electronics & Photonic Devices

Symposium Chair

Luigi ColomboLuigi Colombo
Fellow, External Research Development Group
Texas Instruments Incorporated
Leonard Franklin RegisterLeonard Franklin Register
Professor, Electrical and Computer Engineering
University of Texas at Austin
Bob DoeringBob Doering
Senior Fellow and Research Manager
Texas Instruments

Symposium Sessions

Tuesday June 19

12:30 Networking Lunch - Expo
2:45 TechConnect IP Partnering: Electronics, Sensors, Communications
4:30 Expo Reception and Poster Session I (4:30 - 6:30)
 Nanostructured Materials & Devices

Wednesday June 20

8:30 Flexible Electronics I
11:00 Flexible Electronics II
12:30 Networking Lunch - Expo
1:00 NNI - Director’s Networking Session, National Nanotechnology Coordination Office
1:30 Exhibit and Poster Session II
2:30 TechConnect IP Partnering: Cleantech, Energy, Environment
3:30 Nanostructured Materials & Devices for Electronics Applications
5:30 TechConnect Innovation Showcase Reception
6:00 CTSI Utility Technology Challenge Awards and Reception

Thursday June 21

10:00 National Nanotechnology Initiative Triennial Review
11:00 Advanced Electronic Packaging
12:30 National Innovation Showcase - Networking Lunch (available for purchase)
1:00 TechConnect Start-Up Partnering: Electronics, Sensors & Communications
1:30 Novel Nano Electronics & Photonics
1:30 MEMS & NEMS: Industrial Applications and Services
4:00 TechConnect National Innovation Showcase, Reception & Poster Session III
 Advanced & Nano Electronics & Photonic Devices

Symposium Program

Tuesday June 19

↑ Back to Top
12:30Networking Lunch - ExpoExpo Hall AB
↑ Back to Top
2:45TechConnect IP Partnering: Electronics, Sensors, CommunicationsRoom 212
Session chair: Keith Ritala, Quest, Reviewer: Stefan Heuser, Samsung & Daniel Mahgerefteh, Finisar, US
2:45Electric Current Locator
P. King, National Energy Technology Laboratory (URS Corporation), US
2:55Organic/Inorganic Hybrid Optical Amplifier with Wavelength Conversion
L. Loerchner, University of Waterloo, CA
3:05High Performance Video Compression Coding System
L. Loerchner, University of Waterloo, CA
3:15Batteryless Nanoenergy Harvesting
I. Shum, Lawrence Livermore National Laboratory, US
3:25Hydrophobicity Modulating Underwater Chemical Sensor
M. Sethu, National University of Singapore, Industry Liaison Office, SG
3:35Ultra-miniaturized, Passive Wireless Sensor
E. Hockert, University of Minnesota, US
3:45Silicon Photonics as a Means to Scaleable Optical Interconnection
G. Crossley, McMaster University, CA
↑ Back to Top
4:30Expo Reception and Poster Session I (4:30 - 6:30)Expo Hall AB
↑ Back to Top
Nanostructured Materials & Devices
-Adhesion and dynamic nanotribology of graphene in polar and non-polar liquid environments studied with ultrasonic force microscopy
B.J. Robinson, O.V. Kolosov, Lancaster University, UK
-Synthesis, Characterisation and Catalytic Studies Copper Substituted Nickel Zinc Ferrite Nano Powders
P. Douglas Sanasi, D. Santhi Priya, P. Nageswara Rao, Andhra University, IN
-Hysteresis-free spin valves for GMR sensors
V.V. Ustinov, M.A. Milyaev, L.I. Naumova, V.V. Proglyado, T.P. Krinitsina, Institute of Metal Physics, RU
-Exchange Bias Formation Mechanism in (110)Al2O3/Py/Mn/Ta Nanostructures
I.V. Blinov, T.P. Krinitsina, S.A. Matveev, M.A. Milyaev, V.V. Popov, V.V. Ustinov, Institute of Metal Physics, RU
-Synthesis and Characterization of Graphene Thin Films via Hummer’s Method.
F.T. Thema, M.J. Moloto, N.N. Nyangiwe, M. Khenfouch, M. Maaza, L Kotsedi, E.D. Dikio, Vaal University Of Technology, ZA
-Comparison of Anchoring Materials for High Performance Sensors Modified with Nanoparticles and Enzymes
X. Gao, D. Assan, J.C.K. Lai, S.W. Leung, Idaho State University, US
-Selective Reflectivity and High Absorption in Plasmonic Films
A. Siahmakoun, M. Syed, C. Bolinger, Rose-Hulman Institute of Technology, US
-Synthesis of SiOx Nanowires at Low Temperatures Using Zn Catalyst
C-S Choi, J-H Yoon, Kangwon National University, KR
-AuxAg1-x alloy seeds: A way to control growth, morphology and defect formation in Ge nanowiress
S. Biswas, J.D. Holmes, University College Cork, IE
-CdS Quantum Dot-sensitized anatase single crystalline Branched-TiO2 nanowires for Photoelectrochemical Hydrogen Production
D.H. Kim, W.M. Seong, J.H. Park, H.S. Han, I.J. Park, I.S. Cho, S.S. Shin, S. Lee, K.S. Hong, Seoul National University, KR
-Growth Mechanism of Zinc Oxide Nanowires by Geometrical Selection and the Effect of Zinc Oxide Binding Peptides
T.Y. Olson, A.A. Chernov, K.E. Murphy, J.H. Satcher, T.Y. Han, Lawrence Livermore National Laboratory, US
-Analysis of GaN Grown on Vertically Standing Fractal-Like Si Nanostructures
Q.X. Wee, C.B. Soh, K.Y. Zang, S.J. Chua, C.V. Thompson, National University of Singapore (NUS), SG
-Application of ZnO Nanorods for a UV Photodetector
C.Y. Kung, S.L. Young, C.C. Lin, H.H. Lin, J.H. Lin, H.Z. Chen, M.C. Kao, Y.T. Shih, National Chung Hsing University, TW
-Nanoneedle DIrected Motion of a Functionalized Channel through a Lipid Membrane
M. Dutt, O. Kuksenok, A.C. Balazs, Rutgers University, US
-Au nanoelectrodes for breath analysis
M. Righettoni, A. Tricoli, S.E. Pratsinis, ETH Zurich, CH
-Well-Defined TiO2 Nanostructures Towards Photoanodes Applications for Oxidative Photoelectrochemistry
Y. Pihosh, K. Mawatari, T. Kitamori, The University of Tokyo, JP
-The controllable degree of preferred-orientation in anatase TiO2 nanotube arrays by controlling surface roughness of Ti
W.M. Seong, D.H. Kim, I.J. Park, S. Lee, K.S. Hong, Department of Materials Science Engineering, Seoul National University, Korea, KR
-Electrospun Silver Networks as Transparent Conductive Films
H-T Chen, H-L Ling, C. Kuo, I-G Chen, National Cheng Kung University, TW
-Formation of Covalently Bound Magnetic Molecular Chains
A.R. DiLullo, G. Hoffmann, S.-W. Hla, Ohio University, US
-Ultrafine Silver Nanowire-Polymer Composite Interlayer for Organic Light Emitting Diodes
B. Lee, K. Kim, S. Kim, I-H Lee, B. Koo, J-L Lee, POSTECH, KR
-New Surface analysis methot with Hologram method
P. Kemper, TRIMOS SA, CH

Wednesday June 20

↑ Back to Top
8:30Flexible Electronics IGrand Ballroom D
Session chair: Anupama B. Kaul, National Science Foundation, US
8:30Artificial Electronic Skin
A. Javey, University of California, Berkeley, US
9:00Organic Complementary Circuits
A. Dodabalapur, University of Texas at Austin, US
9:30Highly sensitive organic-inorganic heterojunction flexible photodetectors
J-H Seo, T-Y Oh, J. Park, W. Zhou, B-K Ju, Z. Ma, University of Wisconsin, Madison, US
↑ Back to Top
11:00Flexible Electronics IIGrand Ballroom D
Session chair: Anupama B. Kaul, National Science Foundation, US
11:00Fabrication and characterization of CNT inductors on flexible plastic substrates
L. Diao, W-S Shih, J. Lamb, Brewer Science, US
11:20Flexible Graphene Transistors via Printing Transfer
T.-C. Chang, H.-S. Suh, S. Mikael, J.-H. Seo, P.F. Nealey, Z. Ma, University of Wisconsin-Madison, US
11:40Highly Flexible Transparent Thin Film Heaters based on Metallic Nanowires
J.-P. Simonato, CEA, FR
12:00Solution Growth of Nanostructured Ceramic Films
J. Cho, State Univ of New York (SUNY) at Binghamton, US
12:20Fabrication and characterization of thin-film transistors based on Peri-xanthenoxanthene (PXX) derivative
Z. Cui, Chinese Academy of Sciences, CN
↑ Back to Top
12:30Networking Lunch - ExpoExhibit Hall AB
↑ Back to Top
1:00NNI - Director’s Networking Session, National Nanotechnology Coordination OfficeExhibit Hall A
↑ Back to Top
1:30Exhibit and Poster Session IIExhibit Hall AB
↑ Back to Top
2:30TechConnect IP Partnering: Cleantech, Energy, EnvironmentRoom 212
Session chair: Patricia Ansems-Bancroft, Dow, Reviewer: Kristoffer Stokes, Celgard LLC, US
2:30Hybrid Green Cement
L. Simoes, Wayne State University, US
2:40New Polymeric Material and Process for Recycling Plastic Blends
N. Gadoury, Univalor, CA
2:50Buckled Silicon Nanostructures on Elastomeric Substrates for Rechargeable Lithium Ion Batteries
B. Loux, Arizona Technology Enterprises, US
3:00High Performance, High Life Cycle Anode for Lithium Ion Batteries
L. Simoes, Wayne State University, US
3:10Low-cost technology for production of the highly efficient flexible nano-structured materials for Photovoltaic Panels and Supercapacitors.
B. Gilman, Coolsol R&C, US
↑ Back to Top
3:30Nanostructured Materials & Devices for Electronics ApplicationsGrand Ballroom D
Session chair: Bob Doering, Texas Instruments & Frank Register, University of Texas, US
3:30Carbon Nanotube Memory
T. Rueckes, Nantero, Inc, US
4:00Carbon Nanostructure Applications for Nanoelectronics
S. Roth, Max Planck Institute, DE
4:30Three-Dimensional Nanographene as a Low-Cost Tunable Bulk Material
J. Biener, A. Wittstock, S. Dasgupta, L.-H. Shao, D. Wang, M.A. Worsley, J.R.I. Lee, M.M. Biener, C. Orme, S.O. Kucheyev, B.C. Wood, T.M. Willey, A.V. Hamza, J. Weissmüller, H. Hahn, T.F. Baumann, Lawrence Livermore Nat Laboratory, US
4:50Silicon nanowire and graphene FET sensors as new reference electrodes in electrolytic environments
O. Knopfmacher, A. Tarasov, W. Fu, C. Nef, J. Kurz, K. Bedner, M. Wipf, M. Calame, C. Schönenberger, University of Basel, CH
↑ Back to Top
5:30TechConnect Innovation Showcase ReceptionExpo Hall CD
↑ Back to Top
6:00CTSI Utility Technology Challenge Awards and ReceptionExpo Theater 1
Session chair: Patti Glaza, Arsenal Venture Partners, US

Thursday June 21

↑ Back to Top
10:00National Nanotechnology Initiative Triennial ReviewGreat America 1
Session chair: Erik Svedberg, National Materials and Manufacturing, National Academies, US
10:00NNI Town Hall Meeting
E. Svedberg, National Nanotechnology Initiative, US
↑ Back to Top
11:00Advanced Electronic PackagingRoom 210
Session chair: Chris Menzel, Dimatix, US
11:00A Novel Method to Maintain Alignment Accuracy in Bonding Process Utilizing Resin as an Adhesive Material
S.-S. Lee, M. Kondo, R. Ishibashi, K. Kinoshita, S. Kishida, Tottori University, JP
11:20Off-Chip Printed Interconnects for Ultrathin Flexible Products
H. Alemohammad, A. Zadeh, J. Sheats, E. Toyserkani, University of Waterloo, CA
11:40nanoCopper based solder-free electronic assembly material
A. Zinn, R. Stoltenberg, Lockheed Martin Space Systems Company Adv. Technol. Center, US
12:00Topology Optimization of Ultrasonic Transducers for Microsystem and IC Packaging
J.S. Kim, J.M. Kim, S.I. Lee, E.J. Lim, University of Seoul, KR
↑ Back to Top
12:30National Innovation Showcase - Networking Lunch (available for purchase)Expo Hall CD
↑ Back to Top
1:00TechConnect Start-Up Partnering: Electronics, Sensors & CommunicationsExpo Theater 3
Session chair: Matt Denesuk, IBM Venture Capital, US
1:00P-Ink Active Heat Reflection Display
P. Chan, Opalux Inc., CA
1:10Next Generation Flat Panel Display Technology
T. Whitfield, NanoPhotonica, US
1:20Nanowire based flexible transparent electrode
H. Wang, Polyradiant Corp, US
1:306x and Beyond MEMS Inertial Sensor and Applications
L. Ross, Virtus Advanced Sensors, Inc., US
1:40Impulse Synthetic Aperture Radar for Remote Through-Wall and Underground Imaging
J. Tatoian, Eureka Aerospace, US
1:50On the Field internal pipe Inspection robotic Vehicle (FIV)
A. Manesh, American Science and Technology Corporation, US
2:00TranSono Noise Reduction and Echo Cancellation
J.G. Lee, TranSono, Inc., KR
2:10APEtalk Speech Synthesis
J. Pearl, Perceptral, US
↑ Back to Top
1:30Novel Nano Electronics & PhotonicsGrand Ballroom H
Session chair: Bob Doering, Texas Instruments & Frank Register, University of Texas, US
1:30On the Possibility of Ultra-Low Power Switching in Multilayer Graphene Nanostructures
B. Dellabetta, J. Shumway, M.J. Gilbert, University of Illinois, US
1:50Inherently Radiation Hardened Electronics: An Examination of III-V Nanowire Transistors and Spin-Based Logic Devices
D. Telesca, Air Force Research Lab (AFRL), US
2:10Charge Manipulation in Silicon Atomic Quantum Dots for Nano-Electronic Computing Architectures
J.L. Pitters, L. Livadaru, M.B. Haider, M. Taucer, R.A. Wolkow, National Research Council of Canada, CA
2:30Polymer:Nanoparticle Memristors with Electrode-Sensitive Resistive Switches
J. Ouyang, National University of Singapore, SG
2:50Random Work Function Induced DC Characteristic Fluctuation in 16-nm High-k/Metal Gate Bulk and SOI FinFETs
H-W Su, Y-Y Chen, C-Y Chen, H-W Cheng, H-T Chang, Y. Li, National Chiao Tung University, TW
3:10Improved RF Characteristics of Carbon Nanotube Interconnects with Deposited Tungsten Contacts
A.A. Vyas, F. Madriz, N. Kanzaki, P. Wilhite, J. Tan, T. Yamada, C.Y. Yang, Santa Clara University, US
↑ Back to Top
1:30MEMS & NEMS: Industrial Applications and ServicesGreat America 2
Session chair: Chris Menzel, Dimatix, US
1:30Health monitoring of flexible composite plates: a MEMS-based approach
S. Mariani, A. Corigliano, F. Caimmi, M. Bruggi, P. Bendiscioli, M. De Fazio, Politecnico di Milano, STMicroelectronics, IT
1:50Coupled Numberical Simulatino Techniques for MEMS & Biomedical Applications
M. Ozen, Ozen Engineering, US
2:10MEMS Oscillators
A. Partridge, SiTime, Corp., US
2:30Advances in MEMS Fabrication for Fabless MEMS Companies
M. Lim, M. Daneman, InvenSense, US
↑ Back to Top
4:00TechConnect National Innovation Showcase, Reception & Poster Session IIIExpo Hall CD
↑ Back to Top
Advanced & Nano Electronics & Photonic Devices
-Print Transferrable Large-Area Broadband Membrane Reflectors by Laser Interference Lithography
J-H Seo, J. Park, D. Zhao, H. Yang, W. Zhou, B-K Ju, Z. Ma, University of Wisconsin-Madison, US
-Synthesis of ZnO Nanosheets by Exposing Zn Film to Oxygen Plasma at Low Temperatures
J.H. Yoon, Kangwon National University, KR
-Investigation of Frequency Dependent Noise Performance Metrices for Gate Electrode Work function Engineered Recessed Channel MOSFET
A. Agarwala, R. Chaujar, Delhi Technological University, IN
-Fabrication and Characterization of of Nanoscale Tellurium Fuses for Long Term Solid State Data Storage
A.C. Pearson, B. Singh, M.R. Linford, B.M. Lunt, R.C. Davis, Brigham Young University, US
-Suppression of Variability in Metal Source/Drain SOI MOSFET with Partial Buried Oxide and δ-doping
G.C. Patil, S. Qureshi, Indian Institute of Technology Kanpur, IN
-A model to describe the hump-like feature observed in the accumulation branch of CV-characteristics of MOS capacitors with oxide-hosted Si nanoparticles
V.A. Stuchinsky, G.N. Kamaev, M.D. Efremov, S.A. Arzhannikova, Institute of Semiconductor Physics, RU
-MIM Capacitors with stacked dielectrics
H. Gopalakrishnan, B.J. Kailath, Indian Institute of Information Technology Design and Manufacturing, Kancheepuram, IN
-Dynamical Tunneling in the Systems of Double Quantum Dots and Rings
I. Filikhin, S.G. Matinyan, B. Vlahovic, North Carolina Central University, US
-Understanding Charge Dynamics in Silicon Dangling Bond Structures for Nanoscale Devices
L. Livadaru, J.L. Pitters, M. Taucer, R.A. Wolkow, University of Alberta / NINT, CA
-Study on Grid structure Effect for Field Enhancement Factor in Triode type CNT X-ray source
W.S. Chang, S.K. Seol, D. Kim, B.S. Kim, W.M. Bae, K.C. Park, S. Jung, Korea Electrotechnology Research Institute, KR
-Large Area Nanostructred Antirefelction Coatings for EO/IR Sensor Applications
A.K. Sood, R.E. Welser, A.W. Sood, G. Petuhraja, E.F. Schubert, N.K. Dhar, Magnolia Optical Technologies Inc., US
-Impact of hydrostatic pressure on the structure and electrical properties of Ge2Sb2Te5 films for phase change memory applications
Z. Liu, B. Xu, Yi Su, Nanjing University, CN
-Optimization of the device design technologies for optimum analog/RF performance of Nanoscale DG MOSFETs
R.K. Sharma, M. Bucher, Technical University of Crete, GR
-High performance ZnO-based thin film transistor with high-κ gate dielectrics fabricated at low temperature
D.D. Han, J. Cai, W. Wang, L.L. Wang, Y.C. Ren, S.J. Li, Y. Wang, S.D. Zhang, Peking University, CN
-Current Degradation due to electromechanical coupling in GaN HEMT’s
B. Padmanabhan, D. Vasileska, S.M. Goodnick, Arizona State University, US
-Interfacial Studies of CrSi2/ HfO2 thin films as High k Metal Gate Dielectric layer on SiC devices
S. Hullavarad, N. Hullavarad, University of Alaska Fairbanks, US
-Voltage Control Of A 3-Ø Self – Excited Induction Generators Using TSC (Thyristor Switched Capacitance)
A. Kumar, A. Chaubey, Infosys Limited, IN
-Improved Commutation Control in Switching Regulators for Battery Equalizer Applications
V. Mihov, E. Dinkov, Technical University of Sofia, Branch Plovdiv, BG
-The effect of compact densification on the soft magnetic properties of Fe-based amorphous P/M cores mixed with pure iron powder
S.C. Yoon, K.S. Kim, K.Y. Sohn, M.R. Kim, Y.S. Song, W.W. Park, Inje University, KR

Special Symposium

Scaling of semiconductor devices has continued unabated for the past three decades, and will likely continue for the near future. However, at the end of this decade (ca. 2011), the nature of the silicon device is such that many alternative approaches are likely to be viable contenders.

Electronic, photonic and communication device opportunities are emerging, but require coordinated industrial efforts to realize their potential. Already, new materials (SOI, SiGe, strained Si) are used in current production, high-k dielectrics, fully metallic gates and more non-(Si, SiO2) are expected in the coming generations. In addition, low dimension structures such as Fin-FETS are being considered.

Yet, the International Technology Roadmap for Semiconductors does not identify logic devices beyond CMOS, which presents a unique opportunity for the research community to influence the future of technology. Consequently, this symposium will address the role of several prospective technologies in creating new device options in the post-2011 era (sub-10 nm equivalent technologies). It will provide a forum for the presentation of new designs, processes, devices, architectures, and characterization at the nanoscale. Content will be mindful of the rigors of the existing roadmaps and their associated infrastructure, but will also explore extensions to the roadmap in alignment with industry, SIA and governmental initiatives.

Topics & Application Areas

  • Nano Photonics & Devices
  • Photonic & Nanophotonic Materials
  • Novel Nanoscale Devices & Applications
  • Si Based Nanoscale Devices
  • Hybrid Organic/Inorganic Devices
  • Quantum Devices, Effects & Spintronics
  • Nanoscale Device & Process Modeling
  • Nanoscale Electronic Materials Modeling
  • Nano Wires & Devices
  • Carbon Based Devices
  • Optoelectronics
  • Novel Memory Materials & Devices
  • Interconnect Technologies
  • Nanoscale Architectures
  • Other

Journal Submissions

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.

Experimental Nanoscience

Journal of Experimental Nanoscience

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.

For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.

Molecular Simulation

Molecular Simulation

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of Molecular Simulation. The journal covers all aspects of research related to, or of importance to, molecular modelling and simulation (including informatics, theoretical and experimental work).

For consideration into this Special Issue of Molecular Simulations, please select the “Submit to Molecular Simulation” button during the on-line submission procedure.


Sponsor & Exhibitor Opportunities

 Exhibit and Showcase
 Become a Sponsor

Please contact: Denise Lee

Program Tracks

MEMS & Microsystems
Medical & Biotech
Design, Fabrication & Characterization
Business & Partnering

2012 TechConnect Corporate Acceleration Partners:

Applied Materials
Fraunhofer TechBridge
Kauffman Foundation
Lockheed Martin
SK Innovation

In Partnership with


Sponsorship Opportunities: Contact Denise Lee

Free Subscription