Micro & Nano Reliability

Micro & Nano Reliability

Symposium Chair

Jürgen KellerJürgen Keller
CEO
AMIC GmbH, Germany
Bernd MichelBernd Michel
Director of MicroMaterials Center, Berlin and Chemnitz
Fraunhofer ENAS, Germany

Abstracts Due: March 30th (POSTER Presentation Only)

Special Symposium

Driving forces in microelectronics and MEMS/NEMS manufacturing are the miniaturization processes with steadily increasing service temperatures, temperature gradients and cooling requirements. For these requirements, new processes and technologies are developed to achieve highly localized tailoredthermo mechanical properties. New approaches down to the nanoscale in frontend as well as backend processes of semiconductor industry are continuously brought into the application.

This symposium is focused on reliability tasks of chip design, MEMS/NEMS and cleantech applications were nano or microstructural effects are dominating factors for reliability and lifetime. Novel testing methods for thermo mechanical characterization of the building blocks of nanotechnology are also addressed. Nanoreliability approaches from other sectors are also welcome to provide an overview of experimental and numerical concepts for nanotechnology applications.

Topics & Application Areas

  • Reliability of MEMS/NEMS, Microsystems, Sensors, Mechatronic Systems
  • Reliability of Microelectronic Components & Systems
  • Reliability in Nanoelectronics, Nanopackaging
  • Nanobiotechnology & Reliability Issues
  • Reliability - Experiments, Testing Methods & Techniques at the Nano Scale
  • Design for Reliability
  • Reliability Concepts on Micro- & Nanoscale; Physics of Failure
  • Reliability Simulation
  • Reliability Monitoring & Diagnostics
  • Fracture, Cracks (e.g. Interface Cracking)
  • Coupled Field Reliability Applications (Mechanical, Thermal, Electrical, Diffusion, Vibration etc.)
  • Mechanical & Thermal Reliability, Thermal Mismatch
  • Micromaterials, Nanomaterials & related Reliability Issues
  • High Resolution Stress & Strain Analysis for Reliability Applications
  • Micro- & Nano Packaging, Reliability Strategies
  • Reliability & Standarization in the Micro-Nano Region
  • Other

Technical Abstract Submission

Please first review the information for authors as well as the abstract preparation guidelines.

 

Journal Submissions

Experimental Nanoscience

Journal of Experimental Nanoscience

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.

For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.

 

Sponsor & Exhibitor Opportunities

 Exhibit and Showcase
 Become a Sponsor

Please contact: Denise Lee


Program Tracks

MEMS & Microsystems
Medical & Biotech
Design, Fabrication & Characterization

2011 Platinum Sponsors

Canada
Italian Trade Commission
Jackson Walker
Lockheed Martin

In Partnership with

NSTI


2012 TechConnect Corporate & Technology Acceleration Partners:

AC-NET
Applied Materials
Austin_Energy
BASF
BayerMaterialScience
bp
ConstellationEnergy
DOW
Fraunhofer TechBridge
Honda
IBM
Kauffman Foundation
Kodak
Lockheed Martin
Merck
MWV
nationalgrid
NortheastUtilities
novaris
Panasonic
schlumberger
Shell_GameChanger
siemens
SouthernCalEdison
Toray

Sponsorship Opportunities: Contact Denise Lee

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