Micro & Nano Reliability

Micro & Nano Reliability

Symposium Chairs

Jürgen KellerJürgen Keller
AMIC GmbH, Germany
Bernd  MichelBernd Michel
Director of MicroMaterials Center, Berlin and Chemnitz
Fraunhofer ENAS, Germany

Symposium Sessions

Tuesday June 19

12:30 Networking Lunch - Expo
4:30 Expo Reception and Poster Session I (4:30 - 6:30)

Wednesday June 20

11:00 Micro & Nano Reliability
12:30 Networking Lunch - Expo
1:00 NNI - Director’s Networking Session, National Nanotechnology Coordination Office
1:30 Exhibit and Poster Session II
 Micro & Nano Reliability
5:30 TechConnect Innovation Showcase Reception
6:00 CTSI Utility Technology Challenge Awards and Reception

Thursday June 21

12:30 National Innovation Showcase - Networking Lunch (available for purchase)
4:00 TechConnect National Innovation Showcase, Reception & Poster Session III

Symposium Program

Tuesday June 19

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12:30Networking Lunch - ExpoExpo Hall AB
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4:30Expo Reception and Poster Session I (4:30 - 6:30)Expo Hall AB

Wednesday June 20

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11:00Micro & Nano ReliabilityRoom 206
Session chair: Jürgen Keller, AMIC GmbH, Germany
11:00Reliability Prediction of Single-Crystal Silicon MEMS Using Dynamic Raman Spectroscopy
R. Dewanto, Z. Hu, B. Gallacher, J. Hedley, Newcastle University, UK
11:20Detecting Defects over the Whole Surface of Wafer by Non-destructive and Non-contact Pulse Photoconductivity Method (PPCM)
J. Ndagijimana, Y. Soh, H. Kubota, K. Kobayashi, Kumamoto University, JP
11:40Experimental analysis of the MEMS Capacitive accelerometer’s shock resistibility
Y. Tao, Y. Liu, J. Dong, Tsinghua University, CN
12:00Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages.
J. Keller, M. Schulz, R. Mrossko, B. Wunderle, B. Michel, AMIC Angwandte Micro-Messtechnik GmbH, DE (bio)
12:20Shock Testing of Free Standing Silicon-Nitride and Beryllium Membranes
D. Brough, L. Barrett, R. Vanfleet, R. Davis, S. Liddiard, S. Cornaby, M. Coffin, Brigham Young University, US
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12:30Networking Lunch - ExpoExhibit Hall AB
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1:00NNI - Director’s Networking Session, National Nanotechnology Coordination OfficeExhibit Hall A
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1:30Exhibit and Poster Session IIExhibit Hall AB
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Micro & Nano Reliability
-Reliability of spectral analysis in Interferometric Optical and Atomic Force Microscopies
M. Jobin, hepia, HES-SO, CH
-Modeling of Dynamic Threshold Voltage of High K Gate Stack and Application in FinFET Reliability
H. He, C. Ma, C. Wang, A. Zhang, J. He, Peking Univeristy, CN
-Functional Performance of Microfluidic On-Board Pumps and Valves with Various Actuation Protocols
J. Podczeviensky, J. McDowell, L. Levine, ALine, Inc., US
-Impact of Channel Length and Gate Width of a N-MOSFET Device on the Threshold Voltage and its Fluctuations in Presence of Random Channel Dopants and Random Interface Trap: A 3D Ensemble Monte Carlo Stud
N. Ashraf, S. Joshi, D. Vasileska, ASU, US
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5:30TechConnect Innovation Showcase ReceptionExpo Hall CD
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6:00CTSI Utility Technology Challenge Awards and ReceptionExpo Theater 1
Session chair: Patti Glaza, Arsenal Venture Partners, US

Thursday June 21

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12:30National Innovation Showcase - Networking Lunch (available for purchase)Expo Hall CD
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4:00TechConnect National Innovation Showcase, Reception & Poster Session IIIExpo Hall CD

Special Symposium

Driving forces in microelectronics and MEMS/NEMS manufacturing are the miniaturization processes with steadily increasing service temperatures, temperature gradients and cooling requirements. For these requirements, new processes and technologies are developed to achieve highly localized tailoredthermo mechanical properties. New approaches down to the nanoscale in frontend as well as backend processes of semiconductor industry are continuously brought into the application.

This symposium is focused on reliability tasks of chip design, MEMS/NEMS and cleantech applications were nano or microstructural effects are dominating factors for reliability and lifetime. Novel testing methods for thermo mechanical characterization of the building blocks of nanotechnology are also addressed. Nanoreliability approaches from other sectors are also welcome to provide an overview of experimental and numerical concepts for nanotechnology applications.

Topics & Application Areas

  • Reliability of MEMS/NEMS, Microsystems, Sensors, Mechatronic Systems
  • Reliability of Microelectronic Components & Systems
  • Reliability in Nanoelectronics, Nanopackaging
  • Nanobiotechnology & Reliability Issues
  • Reliability - Experiments, Testing Methods & Techniques at the Nano Scale
  • Design for Reliability
  • Reliability Concepts on Micro- & Nanoscale; Physics of Failure
  • Reliability Simulation
  • Reliability Monitoring & Diagnostics
  • Fracture, Cracks (e.g. Interface Cracking)
  • Coupled Field Reliability Applications (Mechanical, Thermal, Electrical, Diffusion, Vibration etc.)
  • Mechanical & Thermal Reliability, Thermal Mismatch
  • Micromaterials, Nanomaterials & related Reliability Issues
  • High Resolution Stress & Strain Analysis for Reliability Applications
  • Micro- & Nano Packaging, Reliability Strategies
  • Reliability & Standarization in the Micro-Nano Region
  • Other

Journal Submissions

Experimental Nanoscience

Journal of Experimental Nanoscience

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.

For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.


Sponsor & Exhibitor Opportunities

 Exhibit and Showcase
 Become a Sponsor

Please contact: Denise Lee

Program Tracks

MEMS & Microsystems
Medical & Biotech
Design, Fabrication & Characterization
Business & Partnering

2012 TechConnect Corporate Acceleration Partners:

Applied Materials
Fraunhofer TechBridge
Kauffman Foundation
Lockheed Martin
SK Innovation

In Partnership with


Sponsorship Opportunities: Contact Denise Lee

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