Advanced Packaging

Symposium Sessions
	Tuesday June 19
12:30	Networking Lunch - Expo
4:30	Expo Reception and Poster Session I
	Wednesday June 20
12:30	Networking Lunch - Expo
1:00	NNI - Director's Networking Session, National Nanotechnology Coordination Office
1:30	Exhibit and Poster Session II
5:30	TechConnect Innovation Showcase Reception
6:00	CTSI Utility Technology Challenge Awarde and Reception
	Thursday June 21
10:00	National Nanotechnology Initiative Triennial Review
11:00	Advanced Electronic Packaging
12:30	Networking Lunch - Innovation Showcase
4:00	TechConnect National Innovation Showcase, Reception & Poster Session III

Symposium Program
	Tuesday June 19
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12:30	Networking Lunch - Expo	Expo Hall AB
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4:30	Expo Reception and Poster Session I	Expo Hall AB
	Wednesday June 20
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12:30	Networking Lunch - Expo	Exhibit Hall AB
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1:00	NNI - Director's Networking Session, National Nanotechnology Coordination Office	Exhibit Hall A
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1:30	Exhibit and Poster Session II	Exhibit Hall AB
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5:30	TechConnect Innovation Showcase Reception	Expo Hall CD
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6:00	CTSI Utility Technology Challenge Awarde and Reception	Expo Theater 1
	Session chair: Patti Glaza, Arsenal Venture Partners, US
	Thursday June 21
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10:00	National Nanotechnology Initiative Triennial Review	Great America 1
	Session chair: Erik Svedberg, National Materials and Manufacturing, National Academies, US
10:00	NNI Town Hall Meeting TBD, National Nanotechnology Initiative, US
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11:00	Advanced Electronic Packaging	Room 210
11:00	A Novel Method to Maintain Alignment Accuracy in Bonding Process Utilizing Resin as an Adhesive Material S.-S. Lee, M. Kondo, R. Ishibashi, K. Kinoshita, S. Kishida, Tottori University, JP
11:20	Off-Chip Printed Interconnects for Ultrathin Flexible Products H. Alemohammad, A. Zadeh, J. Sheats, E. Toyserkani, University of Waterloo, CA
11:40	Improved RF Characteristics of Carbon Nanotube Interconnects with Deposited Tungsten Contacts A.A. Vyas, F. Madriz, N. Kanzaki, P. Wilhite, J. Tan, T. Yamada, C.Y. Yang, Santa Clara University, US
12:00	nanoCopper based solder-free electronic assembly material A. Zinn, R. Stoltenberg, Lockheed Martin Space Systems Company Adv. Technol. Center, US
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12:30	Networking Lunch - Innovation Showcase	Expo Hall CD
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4:00	TechConnect National Innovation Showcase, Reception & Poster Session III	Expo Hall CD

Special Symposium

Advanced packaging needs are driving an incredible convergence across a host of industries. IC is looking to MEMS for guidance, LED is looking to IC and PV is looking at all three… The sessions under this symposium will focus on developments specifically related to 3D integration and packaging. As designers sort out the path forward, the application will be the ultimate arbiter for solutions and as such these sessions seek to highlight shared opportunities and differentiate unique challenges at the application level.

Topics & Application Areas

Novel Materials for Advanced Packaging
Interconnect Technologies
3D Packages (System in Package)
3D Integrated Circuits (3D IC)
Through-Silicon Vias (TSV)
System-on-a-Chip (SoC)
Wafer-Level Packaging (WLP)
Flexible Electronics & Printing Technologies
Other

Journal Submissions

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.

On-line Journal ‘Sensors & Transducers’

Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.

For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.