Advanced Packaging

Advanced Packaging

Symposium Sessions

Tuesday June 19

12:30 Networking Lunch - Expo
4:30 Expo Reception and Poster Session I (4:30 - 6:30)

Wednesday June 20

12:30 Networking Lunch - Expo
1:00 NNI - Director’s Networking Session, National Nanotechnology Coordination Office
1:30 Exhibit and Poster Session II
5:30 TechConnect Innovation Showcase Reception
6:00 CTSI Utility Technology Challenge Awards and Reception

Thursday June 21

10:00 National Nanotechnology Initiative Triennial Review
11:00 Advanced Electronic Packaging
12:30 National Innovation Showcase - Networking Lunch (available for purchase)
4:00 TechConnect National Innovation Showcase, Reception & Poster Session III

Symposium Program

Tuesday June 19

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12:30Networking Lunch - ExpoExpo Hall AB
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4:30Expo Reception and Poster Session I (4:30 - 6:30)Expo Hall AB

Wednesday June 20

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12:30Networking Lunch - ExpoExhibit Hall AB
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1:00NNI - Director’s Networking Session, National Nanotechnology Coordination OfficeExhibit Hall A
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1:30Exhibit and Poster Session IIExhibit Hall AB
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5:30TechConnect Innovation Showcase ReceptionExpo Hall CD
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6:00CTSI Utility Technology Challenge Awards and ReceptionExpo Theater 1
Session chair: Patti Glaza, Arsenal Venture Partners, US

Thursday June 21

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10:00National Nanotechnology Initiative Triennial ReviewGreat America 1
Session chair: Erik Svedberg, National Materials and Manufacturing, National Academies, US
10:00NNI Town Hall Meeting
E. Svedberg, National Nanotechnology Initiative, US
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11:00Advanced Electronic PackagingRoom 210
Session chair: Chris Menzel, Dimatix, US
11:00A Novel Method to Maintain Alignment Accuracy in Bonding Process Utilizing Resin as an Adhesive Material
S.-S. Lee, M. Kondo, R. Ishibashi, K. Kinoshita, S. Kishida, Tottori University, JP
11:20Off-Chip Printed Interconnects for Ultrathin Flexible Products
H. Alemohammad, A. Zadeh, J. Sheats, E. Toyserkani, University of Waterloo, CA
11:40nanoCopper based solder-free electronic assembly material
A. Zinn, R. Stoltenberg, Lockheed Martin Space Systems Company Adv. Technol. Center, US
12:00Topology Optimization of Ultrasonic Transducers for Microsystem and IC Packaging
J.S. Kim, J.M. Kim, S.I. Lee, E.J. Lim, University of Seoul, KR
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12:30National Innovation Showcase - Networking Lunch (available for purchase)Expo Hall CD
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4:00TechConnect National Innovation Showcase, Reception & Poster Session IIIExpo Hall CD

Special Symposium

Advanced packaging needs are driving an incredible convergence across a host of industries. IC is looking to MEMS for guidance, LED is looking to IC and PV is looking at all three… The sessions under this symposium will focus on developments specifically related to 3D integration and packaging. As designers sort out the path forward, the application will be the ultimate arbiter for solutions and as such these sessions seek to highlight shared opportunities and differentiate unique challenges at the application level.

Topics & Application Areas

  • Novel Materials for Advanced Packaging
  • Interconnect Technologies
  • 3D Packages (System in Package)
  • 3D Integrated Circuits (3D IC)
  • Through-Silicon Vias (TSV)
  • System-on-a-Chip (SoC)
  • Wafer-Level Packaging (WLP)
  • Flexible Electronics & Printing Technologies
  • Other

Journal Submissions

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.

Sensors & Transducers

On-line Journal ‘Sensors & Transducers’

Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.

For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.

 

Sponsor & Exhibitor Opportunities

 Exhibit and Showcase
 Become a Sponsor

Please contact: Denise Lee


Program Tracks

MEMS & Microsystems
Medical & Biotech
Design, Fabrication & Characterization
Business & Partnering

2012 TechConnect Corporate Acceleration Partners:

AC-NET
Applied Materials
Austin_Energy
BASF
BayerMaterialScience
bp
ConstellationEnergy
DOW
Fraunhofer TechBridge
Hitachi
Honda
IBM
Kauffman Foundation
Kodak
Lam
Lockheed Martin
MWV
nationalgrid
NortheastUtilities
novaris
Panasonic
PPG
Samsung
schlumberger
Shell_GameChanger
siemens
SK Innovation
SouthernCalEdison
Toray


In Partnership with

NSTI


Sponsorship Opportunities: Contact Denise Lee

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