Microtech 2011

Nano Electronics & Photonics

Nano Electronics & Photonics

Symposium Chair

Luigi ColomboLuigi Colombo
Fellow, External Research Development Group
Texas Instruments Incorporated
Bob DoeringBob Doering
Senior Fellow and Research Manager
Texas Instruments
Leonard Frank RegisterLeonard Frank Register
Associate Professor, Electrical and Computer Engineering
University of Texas at Austin

Confirmed Invited Speakers

Shriram  RamanathanPhase Transition Oxide Electronics
Shriram Ramanathan
Associate Professor, Harvard University
Alain C.  DieboldImpact of Nanoscale Dimensions on Optical Properties
Alain C. Diebold
Professor, University of Albany
Sanjay K.  BanerjeeGraphene Nanoelectronics
Sanjay K. Banerjee
Professor, The University of Texas at Austin
Supratik Guha Logic and communications technologies beyond conventional Si CMOS
Supratik Guha
Director Physical Sciences Department, IBM Thomas J. Watson Research Center
Celia MerzbacherNanoelectronics Research Initiative: A Public-Private Partnership Supporting Collaboration
Celia Merzbacher
Vice President for Innovative Partnerships, Semiconductor Research Corporation

Symposium Sessions

Tuesday June 14

8:30 Opening TechConnect World Keynotes - Innovation Impact - Nanotech, Cleantech, Microtech, Biotech 2011
1:30 Welcome to Nanotech Germany
3:15 Harvard and MIT Technology Showcase
4:00 Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707
4:15 MEMS Networking Reception - Sponsored by NSTI & MEMS Industry Group
4:00 Innovation Showcase & Poster Session - Reception (4:00 - 6:00)

Wednesday June 15

8:30 Nanoelectronics for 2020 and Beyond - NNI Signature Initiative Special Session
8:30 Canada Innovates! - Canadian Breakthroughs in Cleantech
10:30 NanoFab: Novel Fabrication & Metrology Techniques 1
10:30 Canada Innovates! - Canadian Breakthroughs in Nanotech
1:30 Power Electronics Innovation Spotlights
2:00 Fraunhofer presents: The German High Tech Champions Award 2011 - in Photovoltaics
3:00 TechConnect IP Partnering: Semiconductors, Sensors & Microsystems
1:30 US-China Nanotech Connect
3:30 US-China Nanotech Connect - Networking Reception - Booth 930 Expo Hall C (3:30 - 4:00)
4:00 Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707
4:00 Innovation Showcase & Poster Session - Reception (4:00 - 6:00)
 Nano Electronics & Photonics

Thursday June 16

8:30 Nanoelectronics Technologies & Applications 1
10:30 Device Design and Simulation 1
10:30 Nanoelectronics Technologies & Applications 2
1:30 Device Design and Simulation 2
2:30 TechConnect Ventures: Semiconductors, Sensors & Microsystems

Symposium Program

Tuesday June 14

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8:30Opening TechConnect World Keynotes - Innovation Impact - Nanotech, Cleantech, Microtech, Biotech 2011Ball Room A
Session chair: Matthew Laudon, NSTI/CTSI, US
8:30Welcome and Opening
M. Laudon, TechConnect World Co-Chair, US
8:40Cross Sector Perspective on Nanotech to Cleantech Innovation
T. Earles, Lockheed Martin & Former OSTP, US
9:10No Small Matter: Scaling the Business of Materials Science
T. Taber, CTO, Eastman Kodak Company, US
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1:30Welcome to Nanotech GermanyRoom 205
1:30Opening and Welcome
F. Wolf, Federal Ministry of Education and Research (BMBF), Bonn, DE
1:40CNT – A novel cooperation model to conquer new markets for CNT based products
P. Krüger, Inno.CNT, DE
2:00Zentallium®, ZoLiBat® & H2Tank2Go®-modules and ZE-powerplant -nanostructures for zero-emission future transportation and energy
D. Zoz, Zoz Group, DE
2:20Carbon Nanotubes and Nano Structures for Applicati on in Interconnects, Sensors and Wafer Level Packaging
S. Schulz, Fraunhofer Institute for Electronic Nano Systems, Chemnitz, DE
2:40NanoMat: The German Network for Nanomaterials and Polymer Phase Lithography: Layout-Controlled and Spontaneous Structure Formation on the Nano Scale
T. Heiler, R. Hedderich, R. Gröger, S. Walheim, T. Schimmel, Karlsruhe Institute of Technology, NanoMat, DE
3:00Sharing the enthusiasm for Nano
B. Gerbauer, Nanosystems Initiative Munich (NIM), DE
3:20CANdots: Nanoparticles for your Purpose
J. Niehaus, D. Tiegs, S. Becker, V-H. Tran, H. Weller, Center for Applied Nanotechnology (CAN) GmbH, DE
3:40Hi-Tec Nano-Composites Containing Carbon Nanotubes
W. Schütz, FutureCarbon GmbH, DE
4:00Electron Beam Lithography: The Nanolithography for Nanotechnology
J. Krostoff and I. Stolberg, Vistec Electron Beam Lithography Group, US
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3:15Harvard and MIT Technology ShowcaseRoom 306
Session chair: Chris Noble, Massachusetts Institute of Technology
3:15Introduction
C. Noble, MIT, US
3:20Key Semiconductor Advances in Electronics and Optoelectronics (invited presentation)
G. Fitzgerald, MIT, US
3:35New versatile nano/microstructured surfaces: Applications in anti-icing, prevention of biofouling and self-cleaning oleophobic materials (invited presentation)
J. Aizenberg, Harvard University, US
3:50Nanoengineered Surfaces for Efficiency Enhancements in Energy and Water (invited presentation)
K. Varanasi, MIT, US
4:05Filtration System for Small-Medium Scale Wastewater and Water Treatment (invited presentation)
C. Vectis, Harvard University, US
4:20Smartphone control of Unmanned Aerial Vehicles (UAVs) (invited presentation)
M. Cummings, MIT, US
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4:00Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707Expo Hall
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4:15MEMS Networking Reception - Sponsored by NSTI & MEMS Industry GroupRoom 209
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4:00Innovation Showcase & Poster Session - Reception (4:00 - 6:00)Expo Hall

Wednesday June 15

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8:30Nanoelectronics for 2020 and Beyond - NNI Signature Initiative Special SessionRoom 208
Session chair: Bob Doering, Texas Instruments, US
8:30Nanoelectronics Research Initiative: A Public-Private Partnership Supporting Collaboration (invited presentation)
C. Merzbacher, Semiconductor Research Corporation, US
8:55Exploiting the Intrinsic Nature of Small Scales (invited presentation)
J. Rogers, DARPA, US
9:20Graphene Nanoelectronics (invited presentation)
S.K. Banerjee, L.F. Register, E. Tutuc, D. Akinwande, L. Colombo and G. Carpenter, University of Texas at Austin, US
9:45Logic and communications technologies beyond conventional Si CMOS (invited presentation)
S. Guha, IBM T.J. Watson Research Center, US
11:15Shared Topic Presentation - Room 206 at 11:15, Next Generation Electronic Products
C. Jean, Teledyne Dalsa Semiconductor, CA
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8:30Canada Innovates! - Canadian Breakthroughs in CleantechRoom 206
8:30Welcome to Canadian Innovation
C. Denter, Technology Partnering Officer, Consulate General of Canada to New England, CA
8:40Opening Remarks
P. Binns, Consul General, Consulate General of Canada to New England, CA
9:00Canadian Energy RD&D and Clean Technology Developments
P. St-Jean, Natural Resources Canada, Energy Technology Policy, CA
9:15Canada-US CleanTech collaboration Opportunities
G. Murphy, Director, Natural Resources Canada, CA
9:30On the Rise – Conversion Efficiency in Organic Photovoltaics
Y. Tao, National Research Council (NRC), CA
9:45Utilizing Renewable Energy Resources for Distributed Power
K. Kassam, Ballard Power, CA
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10:30NanoFab: Novel Fabrication & Metrology Techniques 1Room 203
Session chair: Jason Haaheim, NanoInk, US
10:30Photonic Sintering of Silver for Roll-to Roll-Printed Electronics
S. Ahmed, Xenon Corporation, US
10:50Development of Methanol Based Reactive Ion Etching Processes for Nanoscale Magnetic Devices
M.T. Moneck, J.-G. Zhu, Carnegie Mellon University, US
11:10Patterning Technology for Nanomanufacturing
H.I. Smith, M. Walsh, F. Zhang, G. Hourihan, J. Ferrera, M. Jaspan, LumArray, US
11:30Picosun SUNALE™ ALD process tools for nanoscale coatings – seamless transition from R&D to industrial production
M. Toivola, P.J. Soininen, T. Lehto, T. Pilvi, Picosun Oy, FI
11:50Fabrication and Recording of Bit Patterned Media Prepared by Rotary Stage Electron Beam Lithography
M.T. Moneck, W. Lin, S. Powell, T. Okada, J. Fujimori, T. Kasuya, M. Katsumura, T. Iida, K. Kuriyama, J. Bain, J.-G. Zhu, Carnegie Mellon University, US
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10:30Canada Innovates! - Canadian Breakthroughs in NanotechRoom 206
10:30Breadth of Nano Research in Canada
M. D'Iorio, Director General, National Institute for Nanotechnology, CA
10:45Nanotechnology Research Landscape in Canadian Universities
F. Gu, University of Waterloo, CA
11:00Towards Industrialization of Single-Walled Carbon Nanotubes
B. Simard, NRC Steacie Institute for Molecular Sciences, CA
11:15Next Generation Electronic Products
C. Jean, Executive VP & General Manager, Teledyne Dalsa Semiconductor, CA
11:30Scientific Research and Experimental Development (SR&ED) How to help fund your Research in Canada
M. Machado, Pricewaterhouse Coopers, US
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1:30Power Electronics Innovation SpotlightsRoom 310
Session chair: Andrew Ray, Bingham McCutchen LLP, US
1:30Low Weight, Low Cost Commercial-Scale PV Inverter
P. Bundschuh, Ideal Power Converters, US
1:45Silicon Carbide Power Devices in Renewable Energy Applications
R. Singh, GeneSiC Semiconductor Inc., US
2:00Distributed Energy Optimization for Photovoltaic Systems with a Module-Integrated Balancing Converter
J. Stauth, Solar Semiconductor, Inc., US
2:15New Capacitor Materials for Power Electronics
G. Welsch, Case Western Reserve University, US
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2:00Fraunhofer presents: The German High Tech Champions Award 2011 - in PhotovoltaicsRoom 309
2:00PV Technology from Basic Science to Application
R. Schindler, Fraunhofer Center for Sustainable Energy Systems, US
2:20Business Case Ion Layer Gas Reaction
R. S. Araoz, H. Zentrum, Helmholtz-Zentrum Berlin, DE
2:40Business Case Protective PV Module Coating
U. Lommatzsch, Fraunhofer Institute for Manufacturing Technology and Advanced Materials, DE
3:00Business Case Time Resolved Photoluminescence Imaging
D. Kiliani, University of Konstanz, DE
3:20Business Case Direct Laser Interference Patterning
A. Lasagni, Fraunhofer Institute for Material and Beam Technology, DE
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3:00TechConnect IP Partnering: Semiconductors, Sensors & MicrosystemsRoom 305
Session chair: Ryan Williams, Fraunhofer, US
3:00High-speed feedback controller
P. Lamoureux, Valeo Management, CA
3:10Organic/Inorganic Hybrid Optical Amplifier with Wavelength Conversion
L. Loerchner, University of Waterloo, CA
3:20Inertial Sensors Based on Magnetic Levitation
F. Barrot, CSEM SA, CH
3:30Low cost production of single crystal-like films
S. Lux, ETH Zurich - ETH transfer, CH
3:40Tunable High Sensitivity or Low Cost Gas Detectors
D. Nugent, University of Minnesota, US
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1:30US-China Nanotech ConnectExpo Hall Theater
1:30Introducing Suzhou Industry Park- a Vibrant and Progressive High-tech Hub in China
D. Zhang, Technology and Development Bureau, Suzhou Industrial Park (SIP), CN
1:45Overview of Suzhou Nano-manufacturing Capabilities
L. Liu, NanoGlobe, CN
2:00Printed electronics R&D in China and collaboration opportunities
Z. Cui, Suzhou Institute of Nanotech and Nanobionics (SINANO), CN
2:15Intradermal Drug Delivery Devices Based on Proprietary Functional Micro Array (FMA) Technology
B. Xu, Suzhou Natong Bionanotechnology Ltd. (Nanomed), CN
2:30Experience Sharing: Growing Venture Businesses in China
N. An, New England Chinese Information and Networking Association, CN
2:45Technology Partnership and Business Development Opportunities in Nanopolis Suzhou Q&A
L. Liu, NanoGlobe, CN
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3:30US-China Nanotech Connect - Networking Reception - Booth 930 Expo Hall C (3:30 - 4:00)Expo Hall Theater
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4:00Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707Expo Hall
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4:00Innovation Showcase & Poster Session - Reception (4:00 - 6:00)Expo Hall
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Nano Electronics & PhotonicsExpo Hall
-Effect of Thickness based on self-assembly of block copolymer
S.W. Lee, N.R. Park, S.Y. Kim, D.M. Shin, HongKong University, KR
-Novel Plasmon Coupled Nanophotonic Devices and Sensors Based on Encapsulated 2-D Silver Nanoparticle arrays
Y. Tzeng, C-Y Liu, H.C. Chui, C. Huang, C-H Tu, G.W.L. Chen, S. Chen, K-C Liang, Y. Chu, National Cheng Kung University, TW
-Photoalingnment using Reactive Monomers added Photodecomposition Polyimide
H.J. Kim, D.M. Shin, Hongik Univercity, KR
-Comprehensive Study on Reflectance of Si3N4 Subwavelength Structures for Silicon Solar Cell Applications Using 3D Finite Element Analysis
Z-L Lu, National Chiao Tung University, TW
-Underlap Channel Nanoscale Dopant Segregated Schottky Barrier SOI MOSFET for Low Power Mixed Signal Circuits
G.C. Patil, S. Qureshi, Indian Institute of Technology Kanpur, IN
-Variability Study for Silicon Nanowire FETs
Y.-B. Liao, M.-H. Chiang, K. Kim, W.-C. Hsu, National Cheng Kung University, TW
-Effects of Random Work Function Fluctuations in Nanoszied Metal Grains on Electrical Characteristic of 16 nm High-/Metal Gate Bulk FinFETs
H-W Cheng, Y-Y Chiu, Y. Li, National Chiao Tung University, TW
-Biomolecular, Organic and Inorganic Processing Fabrics: Design and Synthesis of Processing Cells and Primitives
S.E. Lyshevski, Rochester Institute of Technology, US
-C-V Data and Geometry Parameters of Self-Assembled INAS/GAAS Quantum Rings
I. Filikhin, V.M. Suslov, B. Vlahovic, North Carolina Central University, US
-Single Molecule Quantum-Effect Electronic Devices
S.E. Lyshevski, Rochester Institute of Technology, US
-Annealing effects on electrical and optical properties of
S.M. Faraz, NED University of Engineering & Technology, PK
-Characteristics of co-doped device with hole and electron transport material
N.R. Park, G.Y. Ryu, D.H. Lim, S.J. Lee, Y.K. Kim, D.M. Shin, Hong-ik University, KR
-Photon-Induced Biomolecular Sensing and Processing: Towards Engineering, Science and Medical Applications
S.E. Lyshevski, Rochester Institute of Technology, US
-Nanoporous thin-film waveguide resonance sensors with wavelength interrogation over a broad bandwidth
Z-M Qi, Z. Zhang, Q. Liu, D. Lu, Institute of Electronics, Chinese Academy of Sciences, CN
-VerilogA modeling and simulation of Memristor for circuit application
D. Xia, L. He, San Jose State University, US
-Self-assembled monolayer (SAMs) and electroplating process for Cu filling on 32-nm trench
M. Hong, Hanyang university, KR

Thursday June 16

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8:30Nanoelectronics Technologies & Applications 1Room 207
Session chair: Frank Register, Univeristy of Texas, US
8:30Impact of Nanoscale Dimensions on Optical Properties (invited presentation)
A. Diebold, SUNY Albany, US
9:00Opening of a tunable bandgap in graphene via oxygen plasma treatment: An building block for graphene-based electronics
A. Nourbakhsh, M. Cantoro, A. Klekachev, S. De Gendt, B. Sels, IMEC, BE
9:20Analysis of Graphene, Molecular Wires and Inorganic Materials for Nanoelectronics and Low Power Integrated Circuits
S.E. Lyshevski, Rochester Institute of Technology, US
9:40Electron Transition Between Weakly Coupled Concentric Quantum Rings
I. Filikhin, S.G. Matinyan, J. Nimmo, B. Vlahovic, North Carolina Central University, US
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10:30Device Design and Simulation 1Room 205
10:30Design of Microassembly through Process Modeling in Virtual Reality
A.N. Das, H.E. Stephanou, University of Texas at Arlington, US
10:50Simulation of Field-Plate Effects on Surface-State-Related Lag and Current Slump in GaAs FETs
T. Tanaka, K. Itagaki, A. Nakajima, K. Horio, Shibaura Institute of Technology, JP
11:10Performance Study of Nitride-Based Gunn Diodes
G. Aloise, S. Vitanov, V. Palankovski, Advanced Material and Device Analysis Group, AT
11:30The role of Electromechanical coupling in AlGaN/AlN/GaN HEMTs
B. Padmanabhan, D. Vasileska, S.M. Goodnick, Arizona State University, US
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10:30Nanoelectronics Technologies & Applications 2Room 207
Session chair: Bob Doering, Texas Instruments, US
10:30Phase Transition Oxide Electronics (invited presentation)
S. Ramanathan, Harvard University, US
11:00Graphene Nanoelectronics Beyond Current Technological Limitations (invited presentation) a Simulation Perspective
F. Register, D. Basu, X. Mou, D. Reddy, S.K. Banerjee, G. Carpenter, A. Hassabi, A. MacDonald, University of Texas Austin, US
11:30A Five Input Majority Gate in Quantum-Dot Cellular Automatta
R. Akeela, M.D. Wagh, Lehigh University, US
11:50Artificial Nanostructure Materials for Optical Power Control Devices
Y. Ofir, A. Donval, D. Cheskis, T. Fisher and M. Oron, KiloLambda, IL
12:10Hybrid CMOS/nanodevice circuits with tightly integrated memory and logic functionality
D.B. Strukov, University of California at Santa Barbara, US
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1:30Device Design and Simulation 2Room 204
1:30Bottom-up device simulations: modeling electrical currents on the atomic scale
A. Blom, K. Stokbro, QuantumWise A/S, DK
1:50Advanced physics for simulation of ultrascaled devices with UTOXPP Solver
D. Garetto, D. Rideau, C. Tavernier, Y. Leblebiciand, A. Schmid, H. Jaouen, IBM corp., FR
2:10A Negative Index Metamaterial Waveguide for De-Multiplexing
X. Vidal, A. Baev, E.P. Furlani, P.N. Prasad, The Institute for Lasers, Photonics and Biophotonics, US
2:30SUGARX: an Online Tool That Bridges the Gap Between Experiment and Simulation
P. Marepalli, F. Li, J.V. Clark, Purdue University, US
2:50A Regional Model for Threshold Switching in Phase Change Memory
L. Wang, Peking University Shenzhen Graduate Schoo, CN
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2:30TechConnect Ventures: Semiconductors, Sensors & MicrosystemsRoom 303
Session chair: Bill Byun, 7Capital, US
2:30Linear Signal, LLC
G. Mockett, Linear Signal, LLC, US
2:40mc10
G. Callsen, mc10, US
2:50Nanofab3D Inc.
D. Diesk, Nanofab3D Inc., US
3:00Arkansas Power Electronics International, Inc.
T. McNutt, Arkansas Power Electronics International, Inc., US
3:10nanoLambda
B. Choi, nanoLambda, US
3:20VERSATILIS LLC
G. Powch, VERSATILIS LLC, US

Special Symposium

Scaling of semiconductor devices has continued unabated for the past three decades, and will likely continue for the near future. However, at the end of this decade (ca. 2020), the nature of the silicon device is such that many alternative approaches are likely to be viable contenders.

Electronic, photonic and communication device opportunities are emerging, but require coordinated industrial efforts to realize their potential. Already, new materials (SOI, SiGe, strained Si), low-k, high-k dielectrics, and metal gates are used in current production, and III-V compounds and Ge are being developed for he coming generations. In addition, low dimension structures such as Fin-FETS are also being considered.

Yet, the International Technology Roadmap for Semiconductors does not identify logic devices beyond CMOS, which presents a unique opportunity for the research community to influence the future of technology. Consequently, this symposium will address the role of several prospective technologies in creating new device options in the 2020 timeframe (sub-10 nm equivalent technologies). It will provide a forum for the presentation of new designs, processes, devices, architectures, and characterization at the nanoscale. Content will be mindful of the rigors of the existing roadmaps and their associated infrastructure, but will also explore extensions to the roadmap in alignment with industry, SIA and governmental initiatives.

Topics & Application Areas

  • Nano Photonics & Devices
  • Novel Nanoscale Devices and Applications
  • Si Based Nanoscale Devices
  • Hybrid Organic/Inorganic Devices
  • Quantum Devices, Effects & Spintronics
  • Nanoscale Device and Process Modeling
  • Nanoscale Electronic Materials Modeling
  • Nano Wires & Devices
  • Carbon Based Devices
  • Optoelectronics
  • Novel Memory Materials & Devices
  • Interconnect Technologies
  • Nanoscale Architectures
  • Other

Journal Submissions

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.

Experimental Nanoscience

Journal of Experimental Nanoscience

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.

For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.

Molecular Simulation

Molecular Simulation

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of Molecular Simulation. The journal covers all aspects of research related to, or of importance to, molecular modelling and simulation (including informatics, theoretical and experimental work).

For consideration into this Special Issue of Molecular Simulations, please select the “Submit to Molecular Simulation” button during the on-line submission procedure.

 

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