Microtech 2011

MEMS-Based Systems Solutions and Integration Approaches

systems integration
   

Symposia Sponsor

Symposia Chair

Roger Grace Associates
Roger Grace MEMS-Based System Solutions: Review and Overview with a Focus on Current and Emerging High Volume Applications
Roger Grace

President
Roger Grace Associates

Confirmed Invited Speakers

Aarne OjaMEMS sensors enable high-performance devices and unique system-level applications
Aarne Oja
Director, High Performance Microsystems Programme, VTT, Finland
Richard  PaynePixtronix DMS™ MEMS Technology for Broad Spectrum of Display System Applications
Richard Payne
Vice President, Pixtronix, Inc
Allyson  HartzellDesign for Reliability in MEMS-Based Systems
Allyson Hartzell
Director of Technology Projects, Lilliputian Systems Inc.
Don  FeuersteinMotivations for a common MEMS test methodology
Don Feuerstein
Vice President, SemiProbe, Inc.
David HarrisIntegration Strategies for Magnetic Microsystems
David Harris
Vice President of Sales & Marketing, Plures Technologies, Inc.
Bob  ScannellIntegration Challenges for High Performance Inertial Sensors
Bob Scannell
Business Development Manager, MEMS/Sensors Technology Group, Analog Devices, Inc.
Arne  LeinseOptofluidics: exiting integration of two microsystem technology platforms
Arne Leinse
Project & Account Manager, LioniX BV, Netherlands
Grant  PeaseHigh Value Sensor Systems – A Commercial View
Grant Pease
Marketing Manager, Sensing Systems Platforms, Hewlett Packard
Eric  LawrenceImproving Performance of Micro Structure and MEMS Designs by using Optical Measurement
Eric Lawrence
EMS Business Development Manager, Polytec, Inc.
Salvatore Coffa Salvatore Coffa
Group Vice President and R&D General Manager, Industrial and Multisegment Sector
STMicroelectronics
Jerome P.  LynchMonitoring and Assessing the Structural Integrity of Infrastructure Systems using Next-Generation Sensor Technologies
Jerome P. Lynch
Associate Professor, University of Michigan
Mary Ann MaherCo-design of Heterogeneous Microsystems
Mary Ann Maher
CEO, SoftMEMS, LLC
Chris Van HoofPower Optimization of heterogeneous and MEMS based systems: “Consume more to consume less
Chris Van Hoof
Director of Integrated Systems, IMEC, Belgium
Nicholas  TiliakosOverview of ATK Micro-Technologies for Aerospace Applications
Nicholas Tiliakos
Senior R&D Engineer, ATK GASL-NY Operations
Jay  MitchellWafer level packaging solutions for hermetic sealing, temperature control and vibration isolation.
Jay Mitchell
President & Co-Founder, Pack, Inc.
James  WalkerOptofluidics: exiting integration of two microsystem technology platforms
James Walker
President & Founder, JayWalker Technical Consulting, LLC
André  RouzaudThe context of MEMS integration at Léti
André Rouzaud
Deputy VP of Microsystems and Heterogeneous Integration on Silicon, CEA-Leti/Minatec, France
Brian  KinkadeMaking a MEMs Mass Flow Controller for Portable Analytics
Brian Kinkade
Sales Development Manager, Sensors, Leister Technologies LLC
Michael  GrimmerSystems solutions using MEMS sensors for inertial navigation systems and wireless sensor networks
Michael Grimmer
MEMSIC, Inc.
 

Track Sessions

Tuesday June 14

4:00 Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707
4:00 Innovation Showcase & Poster Session - Reception (4:00 - 6:00)

Wednesday June 15

4:00 Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707
4:00 Innovation Showcase & Poster Session - Reception (4:00 - 6:00)

Thursday June 16

8:30 MEMS-Based Systems Solutions and Integration Approaches
10:30 MEMS-Based Systems Solutions and Integration Approaches
1:30 MEMS-Based Systems Solutions and Integration Approaches
3:00 MEMS-Based Systems Solutions and Integration Approaches
4:30 Technical and Business Collaboration Opportunities: MEMS-Based Systems Solutions and Integration Approaches
5:00 TechConnect Closing Networking, Partnering & Investment Reception (3rd Floor, Boylston Hallway)

Track Program

Tuesday June 14

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4:00Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707Expo Hall
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4:00Innovation Showcase & Poster Session - Reception (4:00 - 6:00)Expo Hall

Wednesday June 15

Back to Top
4:00Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707Expo Hall
Back to Top
4:00Innovation Showcase & Poster Session - Reception (4:00 - 6:00)Expo Hall

Thursday June 16

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8:30MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
8:30Welcome and Introduction
R. Grace, Roger Grace Associates, US
8:45Think Beyond the Chip: Challenges of Smart System Integration and the Critical Role of the European Platform for Smart Systems (Keynote)
S. Coffa, ST Microelectronics, IT (presentation slides)
9:30MEMS-Based System Solutions: Review and Overview with a Focus on Current and Emerging High Volume Applications (invited presentation)
R. Grace, Roger Grace Associates, US (presentation slides)
9:50Power Optimization of heterogeneous and MEMS based systems: “Consume more to consume less” (invited presentation)
C. Van Hoof, IMEC, BE (presentation slides)
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10:30MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
10:30MEMS sensors enable high-performance devices and unique system-level applications (invited presentation)
A. Oja, VTT Technical Research Centre of Finland, FI (presentation slides)
10:50Integration Approaches of Combining Micro and Nano Technologies (invited presentation)
A. Rouzaud, Ph. Robert, J.-Ph. Polizzi, N. Sillon, Léti, FR (presentation slides)
11:10Integration Challenges for High Performance Inertial Sensors (invited presentation)
R. Scannell, Analog Devices, Inc., US (presentation slides)
11:30Optofluidics: exciting integration of two microsystem technology platforms (invited presentation)
A. Leinse, J. Walker, LioniX BV, US (presentation slides)
11:50Integration Strategies for Magnetic Microsystems (invited presentation)
D. Harris, Advanced MicroSensors, Inc., US (presentation slides)
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1:30MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
1:40Monitoring and Assessing the Structural Integrity of Infrastructure Systems using Next-Generation Sensor Technologies (invited presentation)
J.P. Lynch, University of Michigan, US (presentation slides)
2:00Pixtronix DMS™ MEMS Technology for Broad Spectrum of Display System Applications (invited presentation)
R. Payne, J. Gandhi, T. Brosnihan, L. Steyn, J. Wu, J. DeRoo, S. Lewis, G. Fike, M. Halfman, N. Hagood, Pixtronix, Inc., US (presentation slides)
2:20Wafer level packaging solutions for hermetic sealing, temperature control and vibration isolation (invited presentation)
J. Mitchell, S. Lee, K. Najafi, ePack, Inc., US (presentation slides)
2:40Making a MEMs Mass Flow Controller for Portable Analytics (invited presentation)
R. Meisinger, B. Kinkade, Leister Technologies LLC, US (presentation slides)
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3:00MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
3:00Design for Reliability in MEMS-Based Systems (invited presentation)
A. Hartzell, Lilliputian Systems Inc., US (presentation slides)
3:20Co-design of Heterogeneous Microsystems (invited presentation)
M.A. Maher, SoftMEMS LLC, US (presentation slides)
3:40Improving Performance of Micro Structure and MEMS Designs by using Optical Measurement (invited presentation)
E.M. Lawrence, Polytec Inc., US (presentation slides)
4:00Motivations for a common MEMS test methodology (invited presentation)
D. Feuerstein, SemiProbe, Inc., US (presentation slides)
Back to Top
4:30Technical and Business Collaboration Opportunities: MEMS-Based Systems Solutions and Integration ApproachesRoom 209
Session chair: Roger Grace, Roger Grace Associates, US
-High Value Sensor Systems – a Commercial View
G. Pease, Hewlett Packard, US (presentation slides)
-Overview of ATK Micro-Technologies for Aerospace Applications
N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US (presentation slides)
-System Solutions Using MEMS Sensors for Inertial Navigation and Wireless Sensor Applications
M. Grimmer, MEMSIC, Inc., US (presentation slides)
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5:00TechConnect Closing Networking, Partnering & Investment Reception (3rd Floor, Boylston Hallway)Boylston Hallway
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Session Description

This all-day session will address, from a global perspective, current and future applications and major issues associated with the creation of a MEMS-based system and its design and manufacturing/testing. The focus will be upon the system elements which compliment the MEMS sensor/actuator e.g. signal conditioning circuits, microcontrollers, embedded intelligence, networking circuits and their interaction with the MEMS device.  System element connectivity and device/system packaging will be addressed.  The session will begin with an overview of market and technology trends and the technology infrastructure to support the systems approach. World-renowned researchers from national laboratories and academia review some of their more significant current activities that are expected to form the basis of many innovative products scheduled for near-term commercialization. Technical staffers from major manufacturers and exciting new startups will present information on their technology approaches to systems solutions for current and future applications.  A panel discussion will conclude the event.

Topics of interest include:

Accelerometers Humidity Sensors Signal Conditioning/ASICs RF MEMS
Actuators “Smart” Systems Design for Manufacturing/Test System Tradeoffs
Chemical/Bio Sensors Microassembly Packaging/Connectivity Structures
Design Tools/CAD Microintegration Photonic Sensors Switches/Relays
Gyros/Rate Sensors Nanomanufacturing Pressure Sensors Embedded Software

Companies supporting these technologies will discuss recent developments in interface circuits, packaging/connectivity, MEMS software design tools, high-volume testing and specialized manufacturing equipment that are expected to play a major role in the successful commercialization of these technologies. A panel of industry experts will discuss a number of technical and commercialization issues.  Audience participation is encouraged.


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