MEMS-Based Systems Solutions and Integration Approaches
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Track Sessions | ||
Tuesday June 14 | ||
| 4:00 | Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707 | |
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | |
Wednesday June 15 | ||
| 4:00 | Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707 | |
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | |
Thursday June 16 | ||
| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 1:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | |
| 4:30 | Technical and Business Collaboration Opportunities: MEMS-Based Systems Solutions and Integration Approaches | |
| 5:00 | TechConnect Closing Networking, Partnering & Investment Reception (3rd Floor, Boylston Hallway) | |
Track Program | ||
Tuesday June 14 | ||
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| 4:00 | Italian Trade Commission Reception - Nanotech booth 1607, Cleantech booth 707 | Expo Hall |
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| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | Expo Hall |
Wednesday June 15 | ||
| Back to Top | ||
| 4:00 | Piemonte Agency For Investments, Export And Tourism Reception - Nanotech booth 1607, Cleantech booth 707 | Expo Hall |
| Back to Top | ||
| 4:00 | Innovation Showcase & Poster Session - Reception (4:00 - 6:00) | Expo Hall |
Thursday June 16 | ||
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| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 8:30 | Welcome and Introduction R. Grace, Roger Grace Associates, US | |
| 8:45 | Think Beyond the Chip: Challenges of Smart System Integration and the Critical Role of the European Platform for Smart Systems (Keynote) S. Coffa, ST Microelectronics, IT | |
| 9:30 | MEMS-Based System Solutions: Review and Overview with a Focus on Current and Emerging High Volume Applications (invited presentation) R. Grace, Roger Grace Associates, US | |
| 9:50 | Power Optimization of heterogeneous and MEMS based systems: “Consume more to consume less” (invited presentation) C. Van Hoof, IMEC, BE | |
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| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 10:30 | MEMS sensors enable high-performance devices and unique system-level applications (invited presentation) A. Oja, VTT Technical Research Centre of Finland, FI | |
| 10:50 | Integration Approaches of Combining Micro and Nano Technologies (invited presentation) A. Rouzaud, Ph. Robert, J.-Ph. Polizzi, N. Sillon, Léti, FR | |
| 11:10 | Integration Challenges for High Performance Inertial Sensors (invited presentation) R. Scannell, Analog Devices, Inc., US | |
| 11:30 | Optofluidics: exciting integration of two microsystem technology platforms (invited presentation) A. Leinse, J. Walker, LioniX BV, US | |
| 11:50 | Integration Strategies for Magnetic Microsystems (invited presentation) D. Harris, Advanced MicroSensors, Inc., US | |
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| 1:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 1:40 | Monitoring and Assessing the Structural Integrity of Infrastructure Systems using Next-Generation Sensor Technologies (invited presentation) J.P. Lynch, University of Michigan, US | |
| 2:00 | Pixtronix DMS™ MEMS Technology for Broad Spectrum of Display System Applications (invited presentation) R. Payne, J. Gandhi, T. Brosnihan, L. Steyn, J. Wu, J. DeRoo, S. Lewis, G. Fike, M. Halfman, N. Hagood, Pixtronix, Inc., US | |
| 2:20 | Wafer level packaging solutions for hermetic sealing, temperature control and vibration isolation (invited presentation) J. Mitchell, S. Lee, K. Najafi, ePack, Inc., US | |
| 2:40 | Making a MEMs Mass Flow Controller for Portable Analytics (invited presentation) R. Meisinger, B. Kinkade, Leister Technologies LLC, US | |
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| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 3:00 | Design for Reliability in MEMS-Based Systems (invited presentation) A. Hartzell, Lilliputian Systems Inc., US | |
| 3:20 | Co-design of Heterogeneous Microsystems (invited presentation) M.A. Maher, SoftMEMS LLC, US | |
| 3:40 | Improving Performance of Micro Structure and MEMS Designs by using Optical Measurement (invited presentation) E.M. Lawrence, Polytec Inc., US | |
| 4:00 | Motivations for a common MEMS test methodology (invited presentation) D. Feuerstein, SemiProbe, Inc., US | |
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| 4:30 | Technical and Business Collaboration Opportunities: MEMS-Based Systems Solutions and Integration Approaches | Room 209 |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| - | High Value Sensor Systems – a Commercial View G. Pease, Hewlett Packard, US | |
| - | Overview of ATK Micro-Technologies for Aerospace Applications N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US | |
| - | System Solutions Using MEMS Sensors for Inertial Navigation and Wireless Sensor Applications M. Grimmer, MEMSIC, Inc., US | |
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| 5:00 | TechConnect Closing Networking, Partnering & Investment Reception (3rd Floor, Boylston Hallway) | Boylston Hallway |
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Session Description
This all-day session will address, from a global perspective, current and future applications and major issues associated with the creation of a MEMS-based system and its design and manufacturing/testing. The focus will be upon the system elements which compliment the MEMS sensor/actuator e.g. signal conditioning circuits, microcontrollers, embedded intelligence, networking circuits and their interaction with the MEMS device. System element connectivity and device/system packaging will be addressed. The session will begin with an overview of market and technology trends and the technology infrastructure to support the systems approach. World-renowned researchers from national laboratories and academia review some of their more significant current activities that are expected to form the basis of many innovative products scheduled for near-term commercialization. Technical staffers from major manufacturers and exciting new startups will present information on their technology approaches to systems solutions for current and future applications. A panel discussion will conclude the event.
Topics of interest include:
| Accelerometers | Humidity Sensors | Signal Conditioning/ASICs | RF MEMS |
| Actuators | “Smart” Systems | Design for Manufacturing/Test | System Tradeoffs |
| Chemical/Bio Sensors | Microassembly | Packaging/Connectivity | Structures |
| Design Tools/CAD | Microintegration | Photonic Sensors | Switches/Relays |
| Gyros/Rate Sensors | Nanomanufacturing | Pressure Sensors | Embedded Software |
Companies supporting these technologies will discuss recent developments in interface circuits, packaging/connectivity, MEMS software design tools, high-volume testing and specialized manufacturing equipment that are expected to play a major role in the successful commercialization of these technologies. A panel of industry experts will discuss a number of technical and commercialization issues. Audience participation is encouraged.
