Microtech 2010 Nanotech 2010

Micro & Nano Reliability

Micro & Nano Reliability

Symposium Chairs

Dr. Juergen Keller Jürgen Keller
CEO
AMIC GmbH, Berlin, Germany
Prof. Bernd Michel Bernd Michel
Head of MicroMaterials Center, Berlin and Chemnitz
Fraunhofer IZM and ENAS

Invited Speakers

Wolfgang Wondrak Wolfgang Wondrak
Research Leader, Hardware Power Electronics
Daimler AG, Böblingen, Germany
Reinhard Pufall Reinhard Pufal
Infineon Technology AG, Germany
Hossein Shirangi Hossein Shirangi
Bosch Group, Germany
Wolfgang Wondrak Reinhold Dauskardt
Professor and Associate Chair, Department of Materials Science and Engineering, Stanford University

Symposium Sessions

Tuesday June 22

4:00 Poster Session and TechConnect Expo (4:00 - 6:00)

Wednesday June 23

10:00 Networking Coffee Break
4:00 Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall
6:00 TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor

Thursday June 24

8:30 Keynotes: Transformational Nanotech
10:00 TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor
10:30 Micro and Nano Reliability I
1:30 Micro & Nano Reliability II
3:30 Micro & Nano Reliability III
5:00 TechConnect Investment Networking Reception - Second Floor

Symposium Program

Tuesday June 22

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4:00Poster Session and TechConnect Expo (4:00 - 6:00)Expo Hall

Wednesday June 23

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10:00Networking Coffee BreakFoyer 2nd Floor
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4:00Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo HallExpo Hall
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6:00TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd FloorBallroom BC

Thursday June 24

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8:30Keynotes: Transformational NanotechRoom 303 CD
Session chair: Clayton Teague, NNCO, US
8:30Nanotechnology: Path Toward Commercialization at GE
M. Butts, General Electric, US
9:00Getting the Memristor to Market
S. Williams, Hewlett Packard, US
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10:00TechConnect Innovation Showcase Coffee Break - Ballroom 3rd FloorBallroom BC
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10:30Micro and Nano Reliability IRoom 206 A
Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE
10:30Future requirements on electronics reliability for extended application and technology fields
W. Wondrak, R. Dudek, Daimler AG, DE
10:50Thermomechanical Reliability for Emerging Technologies: Implications for Microelectronic and Photovoltaic Devices
R.H. Dauskardt, Stanford University, US
11:10In-situ MEMS Testing
A. Dommann, A. Neels, A. Schifferle, E. Mazza, CSEM, CH
11:30Long term functional stability and encapsulation reliability of fully integrated wireless neural interfaces based on Utah Slant Electrode Array (USEA)
A. Sharma, L. Rieth, P. Tathireddy, R. Harrison, H. Oppermann, M. Klein, R. Normann, G. Clark, F. Solzbacher, University of Utah, US
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1:30Micro & Nano Reliability IIRoom 206 A
Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE
1:30Advanced Virtual Qualification Methods to Reduce the Time-to-Market of Microelectronic Assemblies
M.H. Shirangi, M. Koyuncu, J. Keller, B. Michel, Bosch Mahle TS GmbH, DE
1:50A Multiscale Modeling Approach for Microelectronic Packaging Applications
N. Iwamoto, O. Hölck, S. Noijen, B. Wunderle, S. Todd, Honeywell Specialty Materials, US
2:10A Novel In-situ Force Measurement Method for Real Solder Joints Fatigue Evaluation
M. Roellig, R. Metasch, K. Meier, Fraunhofer Institute for Non-Destructive Testing, DE
2:30Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability
B. Michel, J. Hammacher, T. Winkler, E. Kaulfersch, Fraunhofer ENAS, DE
2:50Tin Whisker Mitigation – A Nanotechnology Enabled Solution
M. Yang, R. Fink, N. Jiang, J.P. Novak, Applied Nanotech, Inc., US
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3:30Micro & Nano Reliability IIIRoom 206 A
Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE
3:30Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?
R. Pufall, B. Michel, E. Kaulfersch, Infineon Technology AG, DE
3:50Influence of moisture on humidity sensitive material parameters of microelectonic relevant polymers
H. Walter, E. Dermitzaki, B. Wunderle, B. Michel, Fraunhofer IZM, DE
4:10fibDAC Stress Relief – a Novel Stress Measurement Approach for Semiconductor BEoL Structures
D. Vogel, A. Gollhardt, J. Keller, B. Michel, Fraunhofer ENAS, DE
4:30Monte Carlo Modeling Of Electrical Breakdown In Layered Capacitors
E. Furman, G. Sethi, B. Koch, M. Lanagan, Pennsylvania State University, US
4:50Advanced In- and Out-off plane High Resolution X-ray Strain Analysis on MEMS
A. Neels, A. Dommann, CSEM, CH
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5:00TechConnect Investment Networking Reception - Second FloorFoyer 2nd Floor

Synopsis

Driving forces in microelectronics and MEMS/NEMS manufacturing are the miniaturization processes with steadily increasing service temperatures, temperature gradients and cooling requirements. For these requirements, new processes and technologies are developed to achieve highly localized tailoredthermo mechanical properties. New approaches down to the nanoscale in frontend as well as backend processes of semiconductor industry are continuously brought into the application.

With worldwide launching of various clean technology initiatives the need for systems with improved energy efficiency is defined and will generate new reliability related questions for general system design and smart system integration.

From the material point of view newly developed nanostructured materials, nanoparticle or nanotube filled structural materials are finding their application in electronics packaging, e.g. underfil of thermal interface materials.

In addition with the emerging sector of bionanotechnology, the development and evaluation of interface concepts of biological structures to microelectronic materials such as polymers, metals, ceramics and semi-conducting materials will be a fundamental challenge.

Simulative and experimental methods for the reliability assessment of products with nanotechnological processes or functionalities are the key for successful product design.

The symposium is focused on reliability tasks of chip design, MEMS/NEMS and cleantech applications were nano or microstructural effects are dominating factors for reliability and lifetime. Novel testing methods for thermo mechanical characterization of the building blocks of nanotechnology are also addressed. Nanoreliability approaches from other sectors are also welcome to provide an overview of experimental and numerical concepts for nanotechnology applications.

Symposium Sessions

Symposium Program

Topics & Application Areas

  • Reliability of MEMS/NEMS, Microsystems, Sensors, Mechatronic Systems
  • Reliability of Microelectronic Components and Systems
  • Reliability in Nanoelectronics, Nanopackaging
  • Nanobiotechnology and Reliability Issues
  • Reliability - Experiments, Testing Methods and Techniques at the Nano Scale
  • Design for Reliability
  • Reliability Concepts on Micro- and Nanoscale; Physics of Failure
  • Reliability Simulation
  • Reliability Monitoring and Diagnostics
  • Fracture, Cracks (e.g. Interface Cracking)
  • Coupled Field Reliability Applications (Mechanical, Thermal, Electrical, Diffusion, Vibration etc.)
  • Mechanical and Thermal Reliability, Thermal Mismatch
  • Micromaterials, Nanomaterials and related Reliability Issues
  • High Resolution Stress and Strain Analysis for Reliability Applications
  • Micro- and Nano Packaging, Reliability Strategies
  • Reliability and Standarization in the Micro-Nano Region
  • Other

Journal Submissions

Experimental Nanoscience

Journal of Experimental Nanoscience

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.

For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.

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