Micro & Nano Reliability
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Invited Speakers |
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Symposium Sessions | ||
Tuesday June 22 | ||
| 4:00 | Poster Session and TechConnect Expo (4:00 - 6:00) | |
Wednesday June 23 | ||
| 10:00 | Networking Coffee Break | |
| 4:00 | Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall | |
| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | |
Thursday June 24 | ||
| 8:30 | Keynotes: Transformational Nanotech | |
| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | |
| 10:30 | Micro and Nano Reliability I | |
| 1:30 | Micro & Nano Reliability II | |
| 3:30 | Micro & Nano Reliability III | |
| 5:00 | TechConnect Investment Networking Reception - Second Floor | |
Symposium Program | ||
Tuesday June 22 | ||
| Back to Top | ||
| 4:00 | Poster Session and TechConnect Expo (4:00 - 6:00) | Expo Hall |
Wednesday June 23 | ||
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| 10:00 | Networking Coffee Break | Foyer 2nd Floor |
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| 4:00 | Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall | Expo Hall |
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| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | Ballroom BC |
Thursday June 24 | ||
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| 8:30 | Keynotes: Transformational Nanotech | Room 303 CD |
| Session chair: Clayton Teague, NNCO, US | ||
| 8:30 | Nanotechnology: Path Toward Commercialization at GE M. Butts, General Electric, US | |
| 9:00 | Getting the Memristor to Market S. Williams, Hewlett Packard, US | |
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| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | Ballroom BC |
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| 10:30 | Micro and Nano Reliability I | Room 206 A |
| Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE | ||
| 10:30 | Future requirements on electronics reliability for extended application and technology fields W. Wondrak, R. Dudek, Daimler AG, DE | |
| 10:50 | Thermomechanical Reliability for Emerging Technologies: Implications for Microelectronic and Photovoltaic Devices R.H. Dauskardt, Stanford University, US | |
| 11:10 | In-situ MEMS Testing A. Dommann, A. Neels, A. Schifferle, E. Mazza, CSEM, CH | |
| 11:30 | Long term functional stability and encapsulation reliability of fully integrated wireless neural interfaces based on Utah Slant Electrode Array (USEA) A. Sharma, L. Rieth, P. Tathireddy, R. Harrison, H. Oppermann, M. Klein, R. Normann, G. Clark, F. Solzbacher, University of Utah, US | |
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| 1:30 | Micro & Nano Reliability II | Room 206 A |
| Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE | ||
| 1:30 | Advanced Virtual Qualification Methods to Reduce the Time-to-Market of Microelectronic Assemblies M.H. Shirangi, M. Koyuncu, J. Keller, B. Michel, Bosch Mahle TS GmbH, DE | |
| 1:50 | A Multiscale Modeling Approach for Microelectronic Packaging Applications N. Iwamoto, O. Hölck, S. Noijen, B. Wunderle, S. Todd, Honeywell Specialty Materials, US | |
| 2:10 | A Novel In-situ Force Measurement Method for Real Solder Joints Fatigue Evaluation M. Roellig, R. Metasch, K. Meier, Fraunhofer Institute for Non-Destructive Testing, DE | |
| 2:30 | Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability B. Michel, J. Hammacher, T. Winkler, E. Kaulfersch, Fraunhofer ENAS, DE | |
| 2:50 | Tin Whisker Mitigation – A Nanotechnology Enabled Solution M. Yang, R. Fink, N. Jiang, J.P. Novak, Applied Nanotech, Inc., US | |
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| 3:30 | Micro & Nano Reliability III | Room 206 A |
| Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE | ||
| 3:30 | Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components? R. Pufall, B. Michel, E. Kaulfersch, Infineon Technology AG, DE | |
| 3:50 | Influence of moisture on humidity sensitive material parameters of microelectonic relevant polymers H. Walter, E. Dermitzaki, B. Wunderle, B. Michel, Fraunhofer IZM, DE | |
| 4:10 | fibDAC Stress Relief – a Novel Stress Measurement Approach for Semiconductor BEoL Structures D. Vogel, A. Gollhardt, J. Keller, B. Michel, Fraunhofer ENAS, DE | |
| 4:30 | Monte Carlo Modeling Of Electrical Breakdown In Layered Capacitors E. Furman, G. Sethi, B. Koch, M. Lanagan, Pennsylvania State University, US | |
| 4:50 | Advanced In- and Out-off plane High Resolution X-ray Strain Analysis on MEMS A. Neels, A. Dommann, CSEM, CH | |
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| 5:00 | TechConnect Investment Networking Reception - Second Floor | Foyer 2nd Floor |
Synopsis
Driving forces in microelectronics and MEMS/NEMS manufacturing are the miniaturization processes with steadily increasing service temperatures, temperature gradients and cooling requirements. For these requirements, new processes and technologies are developed to achieve highly localized tailoredthermo mechanical properties. New approaches down to the nanoscale in frontend as well as backend processes of semiconductor industry are continuously brought into the application.
With worldwide launching of various clean technology initiatives the need for systems with improved energy efficiency is defined and will generate new reliability related questions for general system design and smart system integration.
From the material point of view newly developed nanostructured materials, nanoparticle or nanotube filled structural materials are finding their application in electronics packaging, e.g. underfil of thermal interface materials.
In addition with the emerging sector of bionanotechnology, the development and evaluation of interface concepts of biological structures to microelectronic materials such as polymers, metals, ceramics and semi-conducting materials will be a fundamental challenge.
Simulative and experimental methods for the reliability assessment of products with nanotechnological processes or functionalities are the key for successful product design.
The symposium is focused on reliability tasks of chip design, MEMS/NEMS and cleantech applications were nano or microstructural effects are dominating factors for reliability and lifetime. Novel testing methods for thermo mechanical characterization of the building blocks of nanotechnology are also addressed. Nanoreliability approaches from other sectors are also welcome to provide an overview of experimental and numerical concepts for nanotechnology applications.
Symposium Sessions | ||
Symposium Program |
Topics & Application Areas
- Reliability of MEMS/NEMS, Microsystems, Sensors, Mechatronic Systems
- Reliability of Microelectronic Components and Systems
- Reliability in Nanoelectronics, Nanopackaging
- Nanobiotechnology and Reliability Issues
- Reliability - Experiments, Testing Methods and Techniques at the Nano Scale
- Design for Reliability
- Reliability Concepts on Micro- and Nanoscale; Physics of Failure
- Reliability Simulation
- Reliability Monitoring and Diagnostics
- Fracture, Cracks (e.g. Interface Cracking)
- Coupled Field Reliability Applications (Mechanical, Thermal, Electrical, Diffusion, Vibration etc.)
- Mechanical and Thermal Reliability, Thermal Mismatch
- Micromaterials, Nanomaterials and related Reliability Issues
- High Resolution Stress and Strain Analysis for Reliability Applications
- Micro- and Nano Packaging, Reliability Strategies
- Reliability and Standarization in the Micro-Nano Region
- Other
Journal Submissions
Journal of Experimental Nanoscience
Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.
For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.
Microelectronics Journal
Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.
For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.