Microtech2010 2010

Compound Semiconductors

Compound Semiconductor

Symposium Sponsor

Yole Développement;

Symposium Sessions

Tuesday June 22

4:00 Poster Session and TechConnect Expo (4:00 - 6:00)
 Nano Electronics, Compound Semiconductors & Photonics

Wednesday June 23

4:00 Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall
6:00 TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor

Thursday June 24

8:30 MEMS-Based Systems Solutions and Integration Approaches
10:00 TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor
10:30 MEMS-Based Systems Solutions and Integration Approaches
1:00 MEMS-Based Systems Solutions and Integration Approaches
3:00 MEMS-Based Systems Solutions and Integration Approaches
4:00 Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective
5:00 TechConnect Investment Networking Reception - Second Floor

Symposium Program

Tuesday June 22

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4:00Poster Session and TechConnect Expo (4:00 - 6:00)Expo Hall
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Nano Electronics, Compound Semiconductors & PhotonicsExpo Hall
-Characteristic Optimization of Single- and Double-Gate Tunneling Field Effect Transistors
K-F Lee, M-H Han, I-S Lo, C-Y Yiu, Y. Li, National Chiao Tung University, TW
-The Effects of Gamma rays on p-channel MOSFET
M.A. Iqbal, U. Firdous, PUNJAB UNIVERSITY, PK
-Effect of temperature and γ rays radiation on the electrical and optical characteristics of Quantum well structure based laser diode
M.A. Iqbal, S. Ghani, PUNJAB UNIVERSITY, PK
-Semiconductor nanoparticles in Photocatalysis: The Emerging Art and Perspectives
A. Sharma, A. Sharma, R. Sharma, AKG College of Engineering, UPTU, IN
-An Architecture for Designing Noise-Tolerant QCA Nanocircuits
S.C. Lee, L.R. Hook IV, University of Oklahoma, US
-A New QCA Architecture for the Future of Nano-Scale Computing
L.R. Hook IV, S.C. Lee, University of Oklahoma, US
-A Fan-in Bounded Low Delay Adder for Nanotechnology
Y. Sun, M.D. Wagh, Lehigh University, US
-Electrical characteristics of self-assembled Ge nanocrystals embedded in SiO2
E.S.M. Goh, T.P. Chen, C.Q. Sun, M. Yang, Y.C. Liu, Nanyang Technological University, SG
-The Effects of Gamma rays on P-channel MOSFET
M.A. Iqbal, U. Firdous, Punjab University, PK
-Advanced Nanocomposite Materials Tailored to Solid-State Lighting Applications
J.L. Davis, K. Guzan, K. Mills, L. Han, RTI International, US
-Luminescence Properties of Tm3+-Doped YVO4 Phosphors
S.S. Yi, Silla University, KR
-Luminescence Properties of Tm3+-Doped YVO4 Phosphors
R. Balakrishnaiah, D.W. Kim, S.S. Yi, S.H. Kim, K. Jang, H.S. Lee, B.K. Moon, J.H. Jeong, Silla University, KR
-Enhanced Photoluminescence Properties of Li/Al-doped YPO4:Eu phosphors
R. Balakrishnaiah, D.W. Kim, S.S. Yi, S.H. Kim, K. Jang, H.S. Lee, B.K. Moon, J.H. Jeong, Silla University, KR
-Enhanced Photoluminescence Properties of Li/Al-doped YPO4:Eu phosphors
S.S. Yi, Silla University, KR

Wednesday June 23

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4:00Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo HallExpo Hall
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6:00TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd FloorBallroom BC

Thursday June 24

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8:30MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
8:30Welcome and Introduction
R. Grace, Roger Grace Associates, US
8:40Micro Analytical Instruments: A Systems Approach (keynote)
J. Mueller, University of Technology Hamburg, DE
9:10MEMS-Based Systems Solutions: Introduction and Overview with Selected Case Studies of Current and Future High Volume Applications
R. Grace, Roger Grace Associates, US
9:30Smart System Integration Trends in Europe: The perspective of a European Technology Platform
H. Metras, CEA-Leti, FR
9:50MEMS-Based Photonic Systems: Hardware Synergy for Maximized User Benefits (invited)
H. Gruger, M. Scholles, H. Schenk, Fraunhofer Institute for Photonic Microsystems, DE
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10:00TechConnect Innovation Showcase Coffee Break - Ballroom 3rd FloorBallroom BC
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10:30MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
10:30A Critical Review of Thermal Management Schemes for MEMS and Electronics Cooling
N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US
10:50Co-Design of MEMS, Electronics and Packaging: Putting the “Design” Back in “Design Tools”
M. Maher, SoftMEMS, US
11:10Microfluidic System Integration (invited)
D. Sparks, Integrated Sensing Systems, US
11:30Motion MEMS: Think Outside the Box and Beyond the Chip
F. Pasolini, ST Microelectronics, IT
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1:00MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
1:00Welcome and Introduction
R. Grace, Roger Grace Associates, US
1:10Research Trajectories of Microsystems for Health-Care and Environmental Sensing (keynote)
Y. Gianchandani, University of Michigan Wireless Integrated Microsystems Center, US
1:40Recent Progress in MEMS Process Integration for Optical and Microfluidic Applications
P. Lin, Touch Micro-system Technology, TW
2:00Systems Approach to Inertial Motion Tracking
C. Lucien, Hillcrest Laboratories, US
2:20Overcoming the Challenges of Using Gyroscopes for Motion Sensing in Pointing Device Applications
T. Kelliher, Movea, US
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3:00MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
3:00Wafer Bonding as a Key Technology for 3D Integration of MEMS and Electronics (invited)
M. Wiemer, J. Braeuer, D. Wuensch, T. Gessner, Fraunhofer Research Institution for Electronic NanoSystems, DE
3:20Wafer-Level Testing of MEMS Devices in Controlled Vacuum Environment
A. Rumiantsev, S. Giessmann, F.-M. Werner, F. Coccetti, L. Bary, Cascade Microtech and MEMUNITY, DE
3:40Challenges and New Strategies for Inertial MEMS Testing
L. Zana, M. Tschirky, Acutronic, US
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4:00Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test PerspectiveRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
-J. Brown, MEMS and Nano Exchange, US
-K. Lightman, MEMS Industry Group, US
-W. McCulley, InterMEMS, US
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5:00TechConnect Investment Networking Reception - Second FloorFoyer 2nd Floor

Topics & Application Areas

  • Novel RFIC Devices & Circuits
  • Millimeter-wave/High-Speed CMOS Technology & ICs
  • Fabrication Technologies
  • IC Testing & Methodology
  • Advanced Device Applications
  • System Applications (e.g., wireless, vehicular, RADAR, military)
  • Optoelectronic and OEIC Applications
  • High Brightness LEDs
  • High Efficiency Solar Cells
  • Hi Temp/Hi Power Electronics & Sensors
  • Other

Journal Submissions

Microelectronics Journal

Microelectronics Journal

Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.

For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.

Sensors & Transducers

On-line Journal ‘Sensors & Transducers’

Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.

For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.

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