Advanced Packaging
Symposium Sponsor
Synopsis
Advanced packaging needs are driving an incredible convergence across a host of industries. IC is looking to MEMS for guidance, LED is looking to IC and PV is looking at all three… The sessions under this symposium will focus on developments specifically related to 3D integration and packaging. As designers sort out the path forward, the application will be the ultimate arbiter for solutions and as such these sessions seek to highlight shared opportunities and differentiate unique challenges at the application level.
Symposium Sessions | ||
Tuesday June 22 | ||
| 4:00 | Poster Session and TechConnect Expo (4:00 - 6:00) | |
| Nano Electronics, Compound Semiconductors & Photonics | ||
Wednesday June 23 | ||
| 10:30 | Advanced Packaging Technologies | |
| 4:00 | Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall | |
| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | |
Thursday June 24 | ||
| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | |
| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 1:00 | MEMS-Based Systems Solutions and Integration Approaches | |
| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | |
| 4:00 | Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective | |
| 5:00 | TechConnect Investment Networking Reception - Second Floor | |
Symposium Program | ||
Tuesday June 22 | ||
| Back to Top | ||
| 4:00 | Poster Session and TechConnect Expo (4:00 - 6:00) | Expo Hall |
| Back to Top | ||
| Nano Electronics, Compound Semiconductors & Photonics | Expo Hall | |
| - | Characteristic Optimization of Single- and Double-Gate Tunneling Field Effect Transistors K-F Lee, M-H Han, I-S Lo, C-Y Yiu, Y. Li, National Chiao Tung University, TW | |
| - | The Effects of Gamma rays on p-channel MOSFET M.A. Iqbal, U. Firdous, PUNJAB UNIVERSITY, PK | |
| - | Effect of temperature and γ rays radiation on the electrical and optical characteristics of Quantum well structure based laser diode M.A. Iqbal, S. Ghani, PUNJAB UNIVERSITY, PK | |
| - | Semiconductor nanoparticles in Photocatalysis: The Emerging Art and Perspectives A. Sharma, A. Sharma, R. Sharma, AKG College of Engineering, UPTU, IN | |
| - | An Architecture for Designing Noise-Tolerant QCA Nanocircuits S.C. Lee, L.R. Hook IV, University of Oklahoma, US | |
| - | A New QCA Architecture for the Future of Nano-Scale Computing L.R. Hook IV, S.C. Lee, University of Oklahoma, US | |
| - | A Fan-in Bounded Low Delay Adder for Nanotechnology Y. Sun, M.D. Wagh, Lehigh University, US | |
| - | Electrical characteristics of self-assembled Ge nanocrystals embedded in SiO2 E.S.M. Goh, T.P. Chen, C.Q. Sun, M. Yang, Y.C. Liu, Nanyang Technological University, SG | |
| - | The Effects of Gamma rays on P-channel MOSFET M.A. Iqbal, U. Firdous, Punjab University, PK | |
| - | Advanced Nanocomposite Materials Tailored to Solid-State Lighting Applications J.L. Davis, K. Guzan, K. Mills, L. Han, RTI International, US | |
| - | Luminescence Properties of Tm3+-Doped YVO4 Phosphors S.S. Yi, Silla University, KR | |
| - | Luminescence Properties of Tm3+-Doped YVO4 Phosphors R. Balakrishnaiah, D.W. Kim, S.S. Yi, S.H. Kim, K. Jang, H.S. Lee, B.K. Moon, J.H. Jeong, Silla University, KR | |
| - | Enhanced Photoluminescence Properties of Li/Al-doped YPO4:Eu phosphors R. Balakrishnaiah, D.W. Kim, S.S. Yi, S.H. Kim, K. Jang, H.S. Lee, B.K. Moon, J.H. Jeong, Silla University, KR | |
| - | Enhanced Photoluminescence Properties of Li/Al-doped YPO4:Eu phosphors S.S. Yi, Silla University, KR | |
Wednesday June 23 | ||
| Back to Top | ||
| 10:30 | Advanced Packaging Technologies | Room 206 A |
| Session chair: Jeff Perkins, Yole Inc., US | ||
| 10:30 | Advanced Packaging - Industry Overview J. Perkins, Yole, Inc., US | |
| 11:00 | Application of YAG Laser Micro-Welding in MEMS Packaging P. Bozorgi, University of California, Santa Barbara, US | |
| 11:20 | Silicon lid for hermetic encapsulation of electronics on implantable systems P. Tathireddy, L. Rieth, A. Sharma, M. Wilke, M. Toepper, F. Solzbacher, University of Utah, US | |
| Back to Top | ||
| 4:00 | Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall | Expo Hall |
| Back to Top | ||
| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | Ballroom BC |
Thursday June 24 | ||
| Back to Top | ||
| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 8:30 | Welcome and Introduction R. Grace, Roger Grace Associates, US | |
| 8:40 | Micro Analytical Instruments: A Systems Approach (keynote) J. Mueller, University of Technology Hamburg, DE | |
| 9:10 | MEMS-Based Systems Solutions: Introduction and Overview with Selected Case Studies of Current and Future High Volume Applications R. Grace, Roger Grace Associates, US | |
| 9:30 | Smart System Integration Trends in Europe: The perspective of a European Technology Platform H. Metras, CEA-Leti, FR | |
| 9:50 | MEMS-Based Photonic Systems: Hardware Synergy for Maximized User Benefits (invited) H. Gruger, M. Scholles, H. Schenk, Fraunhofer Institute for Photonic Microsystems, DE | |
| Back to Top | ||
| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | Ballroom BC |
| Back to Top | ||
| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 10:30 | A Critical Review of Thermal Management Schemes for MEMS and Electronics Cooling N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US | |
| 10:50 | Co-Design of MEMS, Electronics and Packaging: Putting the “Design” Back in “Design Tools” M. Maher, SoftMEMS, US | |
| 11:10 | Microfluidic System Integration (invited) D. Sparks, Integrated Sensing Systems, US | |
| 11:30 | Motion MEMS: Think Outside the Box and Beyond the Chip F. Pasolini, ST Microelectronics, IT | |
| Back to Top | ||
| 1:00 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 1:00 | Welcome and Introduction R. Grace, Roger Grace Associates, US | |
| 1:10 | Research Trajectories of Microsystems for Health-Care and Environmental Sensing (keynote) Y. Gianchandani, University of Michigan Wireless Integrated Microsystems Center, US | |
| 1:40 | Recent Progress in MEMS Process Integration for Optical and Microfluidic Applications P. Lin, Touch Micro-system Technology, TW | |
| 2:00 | Systems Approach to Inertial Motion Tracking C. Lucien, Hillcrest Laboratories, US | |
| 2:20 | Overcoming the Challenges of Using Gyroscopes for Motion Sensing in Pointing Device Applications T. Kelliher, Movea, US | |
| Back to Top | ||
| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 3:00 | Wafer Bonding as a Key Technology for 3D Integration of MEMS and Electronics (invited) M. Wiemer, J. Braeuer, D. Wuensch, T. Gessner, Fraunhofer Research Institution for Electronic NanoSystems, DE | |
| 3:20 | Wafer-Level Testing of MEMS Devices in Controlled Vacuum Environment A. Rumiantsev, S. Giessmann, F.-M. Werner, F. Coccetti, L. Bary, Cascade Microtech and MEMUNITY, DE | |
| 3:40 | Challenges and New Strategies for Inertial MEMS Testing L. Zana, M. Tschirky, Acutronic, US | |
| Back to Top | ||
| 4:00 | Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| - | J. Brown, MEMS and Nano Exchange, US | |
| - | K. Lightman, MEMS Industry Group, US | |
| - | W. McCulley, InterMEMS, US | |
| Back to Top | ||
| 5:00 | TechConnect Investment Networking Reception - Second Floor | Foyer 2nd Floor |
Topics & Application Areas
- Interconnect Technologies
- 3D Packages (System in Package)
- Chip Stack MCM)
- 3D Integrated Circuits (3D IC)
- Through-Silicon Vias (TSV)
- System-on-a-Chip (SoC)
- Wafer-Level Packaging (WLP)
- Materials
- Flexible Electronics & Printing Technologies
- Other
Journal Submissions
Microelectronics Journal
Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics. Papers published in Microelectronics Journal have undergone peer review to ensure originality, relevance and timeliness. The journal thus provides a worldwide, regular and comprehensive update on microelectronics.
For consideration into the Microelectronics Journal please select the “Submit to Microelectronics Journal” button during the on-line submission procedure.
On-line Journal ‘Sensors & Transducers’
Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.
For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.