MEMS Fab: Design, Manufacture, Instrumentation
Symposium Sessions | ||
Tuesday June 22 | ||
| 10:30 | Microtech Commecialization & Applications | |
| 1:30 | Microtech Commecialization & Applications | |
| 1:30 | NanoFab: Nanopatterns Intersect Biology: DPN Special Session I | |
| 4:00 | Poster Session and TechConnect Expo (4:00 - 6:00) | |
| MEMS & NEMS Devices | ||
Wednesday June 23 | ||
| 8:30 | Government & Alternative Commercialization Funding - DOD, NASA, DOE, SBIR & RIC | |
| 10:00 | Networking Coffee Break | |
| 10:30 | NanoFab: Direct Nanopatterning Fundamental Methods and Education: DPN Special Session II | |
| 10:30 | Advanced Packaging Technologies | |
| 1:30 | NanoFab: Novel Nanomaterials, Nanostructures, and Their Interactions | |
| 1:30 | MEMS & NEMS Devices | |
| 3:00 | MEMS State of the Industry | |
| 4:00 | Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall | |
| NanoFab & MEMSFab: Manufacture, Instrumentation | ||
| 5:30 | Microsystem Networking Reception - Hosted by MEMS Industry Group (MIG) & Nano Science & Technology Institute (NSTI) | |
| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | |
Thursday June 24 | ||
| 8:30 | Keynotes: Transformational Nanotech | |
| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | |
| 10:30 | NanoFab: Novel Applications of Top-Down Nanofabrication | |
| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 10:30 | TechConnect Corporate Partnering | |
| 1:00 | MEMS-Based Systems Solutions and Integration Approaches | |
| 3:30 | International Standards Creation and Compliance in Nanotechnology | |
| 3:30 | NanoFab: Nanofabrication Development - Techniques and Facilities | |
| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | |
| 3:30 | Micro & Nano Reliability III | |
| 5:00 | TechConnect Investment Networking Reception - Second Floor | |
Symposium Program | ||
Tuesday June 22 | ||
| Back to Top | ||
| 10:30 | Microtech Commecialization & Applications | Room 205 AB |
| Session chair: Jeff Perkins, Yole Inc., US | ||
| 10:30 | MEMS Market Overview J. Perkins, Yole Inc., US | |
| 11:00 | What it Takes to Develop New MEMS Products: Reality Check A.M. Fitzgerald, AM Fitzgerald, US | |
| 11:30 | Ultra low cost monolithic CMOS motion sensors for mass-market consumption J. Montanyà i Silvestre, Baolab, ES | |
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| 1:30 | Microtech Commecialization & Applications | Room 205 AB |
| Session chair: Jeff Perkins, Yole Inc., US | ||
| 1:30 | It’s not just about the MEMS D. Buckley, Micralyne, CA | |
| 2:00 | MEMS-based Silicon Timing: Semiconductor Economics and Benefits Drive Rapid Growth P. Sevalia, SiTime, US | |
| 2:30 | MEMS Applications - Oscillators M. Crowley, Sand9, US | |
| 3:00 | MEMS Applications - MEMS ribbons for projectors M. Bellis, Seikowave, JP | |
| 3:30 | MEMS Applications - RF MEMS Switches J. Hilbert, wiSpry, Inc., US | |
| 4:00 | MEMS Applications - fluidic transport for consumer applications F. Bartles, Bartels Mikrotechnik, DE | |
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| 1:30 | NanoFab: Nanopatterns Intersect Biology: DPN Special Session I | Room 303 A |
| Session chair: Jason Haaheim, NanoInk, US | ||
| 1:30 | Model Substrates Presenting Peptide Nanoarrays for Studies of Mechanistic Cell Behavior M.N. Yousaf, University of North Caroline at Chapel Hill, US | |
| 1:50 | Spatially nanopatterned ligands alter the response of ErbB receptors (invited presentation) K. Salaita, Emory University, US | |
| 2:10 | Novel opportunities for nanoscale surface scanning probe lithography (invited presentation) S. Rozhok, R. Shile, J. Fragala, N. Amro, M. Nelson, NanoInk, US | |
| 2:30 | Preparation of nanopatterned substrates via Dip-pen Nanolithography for stem cell applications S. Oberhansl, A. Lagunas, E. Martinez, H. Jamil, J. Samitier, Institute for Bioengineering of Catalonia, ES | |
| 2:50 | Functional lipid nanostructures fabricated by dip-pen nanolithography S. Lenhert, Florida State University, US | |
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| 4:00 | Poster Session and TechConnect Expo (4:00 - 6:00) | Expo Hall |
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| MEMS & NEMS Devices | Expo Hall | |
| - | Frequency-Interleaved MEMS Ultrasound Transducer S-J Chen, Y. Choe, E.S. Kim, University of Southern California, US | |
| - | High Fidelit Loud Microspeaker Based on PZT Bimorph Diaphragm Y. Choe, S.J. Chen, E.S. Kim, University of Southern California, US | |
| - | Mechanical Robustness of FPA in a-Si Microbolometer with Fine Pitch H.Y. Kim, K.M. Kim, B.I. Kim, W.S. Jang, T.H. Kim, T.Y. Kang, National Nanofab Center, KR | |
| - | Real-time structured light measurements with ambient light rejection M. Bellis, Seikowave, JP | |
| - | Arrayed, Piezoelectrically-Actuated Mirrors and Gratings for Spectrometer S-J Chen, D. Chi, J. Lo, E.S. Kim, University of Southern California, US | |
| - | A MEMS-Based Wide-Band Multi-State Power Attenuator for Radio Frequency and Microwave Applications J. Iannacci, A. Faes, F. Mastri, D. Masotti, V. Rizzoli, Fondazione Bruno Kessler - FBK, IT | |
| - | Design of compact, high capacitance ratio MEMS switch for X - Band applications using high-k dielectric materials K. Maninder, CEERI, IN | |
| - | One-chip MOS Structure for Temperature Flow Sensor M. Husak, A. Boura, J. Jakovenko, Czech Technical University in Prague, CZ | |
| - | Gentle Micropump based on Microelectromagnetic Actuator A.T. Al-Halhouli, A. Waldschik, M.I. Kilani, S. Büttgenbach, Technische Universität Braunschweig, DE | |
| - | Investigation of Stress in AlN Thin Films for Piezoelectric MEMS R.E. Sah, L. Kirste, M. Baeumler, P. Hiesinger, V. Cimalla, V. Lebedev, H. Baumann, Fraunhofer Institute for Applied Solid State Physics, DE | |
| - | Preparation of functional PZT films on 6” and 8” silicon wafers by high rate sputtering R. Dudde, D. Kaden, H.-J. Quenzer, B. Wagner, Fraunhofer ISIT, DE | |
| - | Design and Control of a Zero Voltage Switching MEMS DC-DC Power Converter S. Ghandour, G. Despesse, S. Basrour, CEA/LETI, FR | |
| - | A current controlled plasma-on-a-chip for atmospheric plasma generation H. Park, J. Jeong, Y. Kim, Hongik University, KR | |
| - | Development of Surface-micromachined Binary Logic Gate for Low Frequncy Signal Processing in MEMS based Sensor Applications S. Chakraborty, T.K. Bhattacharyya, Indian Institute of Technology (IIT), Kharagpur, IN | |
| - | Magnetoelectric properties of piezeoelectric/magnetostrictive thin film devices J.Y. Zhai, J. Xiong, Y.Y. Zhang, G.F. Zou, Q.X. Jia, Los Alamos National Laboratory, US | |
| - | Using MEMS as Self-Calibrating Force-Displacement Transducers: A Computational Study J.V. Clark, F. Li, H. Lee, K. Kadasia, Purdue University, US | |
| - | Current controlled Plasma-on-a-chip for atmospheric plasma generation H. Park, J. Jeong, Y. Kim, Hong-ik Univ., KR | |
| - | Towards Microrobots with Insect-Like Dexterity J.V. Clark, F. Li, J.V. Clark, Purdue University, US | |
| - | Pb(Zr,Ti)O3 (PZT) Thin Films Sensors for Fully-Intergrated, Passive Telemetric Transponders R.X. Fu, R.C. Toonen, E.H. Ngo, M.W. Cole, S.G. Hirsch, M.P. Ivill, C.W. Hubbard, Army Research Laboratory, US | |
| - | Nanolab System for Nanoelectronics and Sensors A. Dimonte, D. Demarchi, P. Civera, G. Piccinini, Politecnico di Torino, IT | |
| - | Triaxial Accelerometer for Placement Inside the Ear Canal T. Kwa, G. Pender, J. Letterneau, Endevco Corporation, Meggitt Sensing Systems, US | |
| - | Individually addressable Cantilever Arrays for Parallel Atomic Force Microscopy T. Sulzbach, W. Engl, R. Maier, Nanoworld Services GmbH, DE | |
| - | Flexible Micropost Arrays For Studying Traction Forces Of Vascular Smooth Muscle Cells Q. Cheng, Z. Sun, G.A. Meininger, M. Almasri, University of Missouri, US | |
| - | A Fully Symmetric and Completly Decoupled MEMS-SOI Gyroscope A. Sharaf, S. Sedky, M. Serry, A. Elshurafa, M. Ashour, S.E.-D. Habib, American University in Cairo, EG | |
| - | Nano-porous poly-silicon gated ion selective field effect transistors N. Zehfroosh, M. Shahmohammdi, S. Mohajerzadeh, M. Araghchini, University of Tehran, IR | |
| - | Design and Fabrication of the Sensor for Measuring the Human Bladder Volume S. Lee, S. Jun, S. Kim, S. Kim, B. Choi, Sogang University, KR | |
Wednesday June 23 | ||
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| 8:30 | Government & Alternative Commercialization Funding - DOD, NASA, DOE, SBIR & RIC | Room 207 D |
| Session chair: Kelly Carnes, TechVision21, US | ||
| 8:30 | DOE SBIR Funding Opportunities D. Goodwin, US Department of Energy, US | |
| 8:50 | DOD Commercialization Funding Opportunities F. Barros, US Department of Homeland Security, US | |
| 9:10 | NASA Commercialization Funding Opportunities R. Pisarski, NASA/Ames, US | |
| 9:30 | Renewable Energy Commercialization J. Croce, Nevada Institute for Renewable Energy Commercialization, US | |
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| 10:00 | Networking Coffee Break | Foyer 2nd Floor |
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| 10:30 | NanoFab: Direct Nanopatterning Fundamental Methods and Education: DPN Special Session II | Room 205 AB |
| Session chair: Aaron Stein, Brookhaven National Lab, US | ||
| 10:30 | Dip Pen Lithography: A Pathway to Traditional Science Research and Education D. Newberry, Dakota County Technical College, US | |
| 10:50 | Measurement of DPN-Ink Viscosity using an AFM Cantilever S. Biswas, M. Hirtz, S. Lenhert, H. Fuchs, Karlsruhe Institute of Technology, DE | |
| 11:10 | Self-Leveling Two Dimensional Probe Arrays for Dip Pen Nanolithography® J. Haaheim, V. Val, J. Bussan, S. Rozhok, J-W. Jang, J. Fragala, M. Nelson, NanoInk, US | |
| 11:30 | Point-Mass Model for Nano-Patterning Using Dip-Pen Nanolithography (DPN) S.-W. Kang, D. Banerjee, Texas A&M University, US | |
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| 10:30 | Advanced Packaging Technologies | Room 206 A |
| Session chair: Jeff Perkins, Yole Inc., US | ||
| 10:30 | Advanced Packaging - Industry Overview J. Perkins, Yole, Inc., US | |
| 11:00 | Application of YAG Laser Micro-Welding in MEMS Packaging P. Bozorgi, University of California, Santa Barbara, US | |
| 11:20 | Silicon lid for hermetic encapsulation of electronics on implantable systems P. Tathireddy, L. Rieth, A. Sharma, M. Wilke, M. Toepper, F. Solzbacher, University of Utah, US | |
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| 1:30 | NanoFab: Novel Nanomaterials, Nanostructures, and Their Interactions | Room 205 AB |
| Session chair: Jason Haaheim, NanoInk, US | ||
| 1:30 | Neuronal interactions with patterned surfaces, nanofab methods interacting with bio entities (invited presentation) J. Williams, University of Wisconsin-Madison, US | |
| 1:50 | Hierarchically Branched Gecko Tapes Imprinted Using Porous Alumina Templates A.H.Y. Yee, I. Rodríguez, Y.C. Lam, Institute of Materials Research and Engineering, SG | |
| 2:10 | PRINT® Nanoparticle Manufacturing Scaleup for Pharmaceutical Applications D.A. Schorzman, Liquidia Technologies, Inc., US | |
| 2:30 | Photonic Curing of Silver Nanoparticle Based Inks Deposited by M3D J. West, M. Carter, S. Smith, J. Sears, South Dakota School of Mines and Technology, US | |
| 2:50 | Self-assembly derived sub-50nm scale silicon pillar arrays as high resolution molds for nanoimprint lithography S. Krishnamoorthy, Institute of Materials Research and Engineering (IMRE), SG | |
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| 1:30 | MEMS & NEMS Devices | Room 303 C |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 1:30 | Micro Crumples for Self-Assembly of Field Emission Devices S. Sambandan, Palo Alto Research Center, US | |
| 1:50 | Modeling of a Surface Acoustic Wave Strain Sensor W.C. Wilson, G.M. Atkinson, NASA Langley Research Center, US | |
| 2:10 | Micromachined Glass-Blown 3-D Spherical Shells as Mechanical Vibratory Elements I.P. Prikhodko, A.A. Trusov, S.A. Zotov, A.M. Shkel, University of California, Irvine, US | |
| 2:30 | Monolithic CMOS MEMS technology development: A piezoresistive-sensors case study A. Chaehoi, D. Weiland, D. O’Connell, S. Bruckshaw, S. Ray, M. Begbie, Institute for System Level Integration, UK | |
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| 3:00 | MEMS State of the Industry | Room 303 C |
| Session chair: Karen Lightman, MEMS Industry Group, US | ||
| - | State of the IndustryK. Lightman, MEMS Industry Group, US | |
| - | C. White, A.M. Fitzgerald & Associates, US | |
| - | M. Tschirky, Acutronic, CH | |
| - | M.A. Maher, SoftMEMS, US | |
| - | P. Krishnan, SVTC, US | |
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| 4:00 | Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall | Expo Hall |
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| NanoFab & MEMSFab: Manufacture, Instrumentation | Expo Hall | |
| - | In-situ Growth of Gold Nanoparticles Conductive Layer on Plastic Film as an Integrated Lead Ions Sensor X. Zhang, C.G. Hu, S.S. Hu, Wuhan University, CN | |
| - | Multicomponent Nanoarrays: Platform for High Sensitive Protein Detections R. Sanedrin, N. Amro, E. Gubbins, J. Ohayon, D. Delaney, S. Rozhok, M. Coen, K. Rusniak, K. Ouyang, I. Ivanov, NanoInk, Inc., US | |
| - | Intermittent desolvation method to prepare size-controlled BSA nanoparticle S-Y-R Paik, H.H. Nguyen, S.C. Yang, J. Che, S. Ko, Sejong university, KR | |
| - | Alkoxide-based precursors for direct drawing of metal oxide micro- and nanofibres T. Tätte, M. Hussainov, G. Kelp, R. Rand, J. Gurauskis, A. Lõhmus, University of Tartu, EE | |
| - | Fabrication of pyramid array nanostructure on gallium nitride C-C Hsieh, W-C Ke, N-P Chen, W-J Lin, Y-C Cheng, T-C Li, J-C Lin, Yuan Ze University, TW | |
| - | Preparation of Electrospun TPU/PCMs Nanofibers as a Thermostatic Clothing Material K. Choi, D. Branson, A. Osta, K. Sallam, Oklahoma state university, US | |
| - | Fabrication of biodegradable zein films by using soft lithography B. Altunakar, J.L. Kokini, University of Illinois at Urbana-Champaign, US | |
| - | Deposition of Interwoven Fibrous Nanostructure using Ultrafast Laser Ablation in Ambient Condition A. Tavangar, B. Tan, K. Venkatakrishan, Ryerson University, CA | |
| - | VDK 4000 Direct Write System: A new approach to direct write technology M. Theodore, J. Fielding, J. Royer, V. Kalanovic, J. Nirilovic, J. Sears, AFRL, US | |
| - | Development of Nitrogen modified TiO2 and activated carbon fiber composites in single step C.-Y. Tsai, H.-C. Hsi, K.-S. Fan, National Taipei University of Technology, TW | |
| - | Development of Precision Stage with Magnified Displacement System J.G. Kim, S.C. Choi, D.W. Lee, Pusan national University, KR | |
| - | Practical issues with ion beam milling in acoustic resonator technologies S. Mishin, Y. Oshmyansky, F. Bi, Advanced Modular Systems, Inc, US | |
| - | Design and assessment of transparent superhydrophobic glass surface with micro-network of nanopillars J.-S. Park, J.-H. Noh, H.-E. Lim, W.-D. Kim, Korea Institute of Machinery and Materials, KR | |
| - | Cost Efficient Method of Rapid Prototyping of Microfluidic Channels and Lab-on-chip Applications N. Alavi, C. Drewbrook, M. Akbari, A. Khosla, Simon Fraser University, CA | |
| - | Investigation on correlation between cold/hot weld line mechanical properties and micro injection molding processing parameters L. Xie, D. Zhu, G. Ziegmann, L. Steuernagel, Technology University of Clausthal, DE | |
| - | Machining Using Fast Tool Servo Combined with Ultrasonic Vibrator S.C. Choi, Lu Hong, D.W. Lee, Pusan University, KR | |
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| 5:30 | Microsystem Networking Reception - Hosted by MEMS Industry Group (MIG) & Nano Science & Technology Institute (NSTI) | Room 303 C |
| Session chair: Karen Lightman, MEMS Industry Group, US | ||
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| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | Ballroom BC |
Thursday June 24 | ||
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| 8:30 | Keynotes: Transformational Nanotech | Room 303 CD |
| Session chair: Clayton Teague, NNCO, US | ||
| 8:30 | Nanotechnology: Path Toward Commercialization at GE M. Butts, General Electric, US | |
| 9:00 | Getting the Memristor to Market S. Williams, Hewlett Packard, US | |
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| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 8:30 | Welcome and Introduction R. Grace, Roger Grace Associates, US | |
| 8:40 | Micro Analytical Instruments: A Systems Approach (keynote) J. Mueller, University of Technology Hamburg, DE | |
| 9:10 | MEMS-Based Systems Solutions: Introduction and Overview with Selected Case Studies of Current and Future High Volume Applications R. Grace, Roger Grace Associates, US | |
| 9:30 | Smart System Integration Trends in Europe: The perspective of a European Technology Platform H. Metras, CEA-Leti, FR | |
| 9:50 | MEMS-Based Photonic Systems: Hardware Synergy for Maximized User Benefits (invited) H. Gruger, M. Scholles, H. Schenk, Fraunhofer Institute for Photonic Microsystems, DE | |
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| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | Ballroom BC |
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| 10:30 | NanoFab: Novel Applications of Top-Down Nanofabrication | Room 210 C |
| Session chair: Guy DeRose, Caltech, US | ||
| 10:30 | Nanoscale Device Fabrication using Focused Ion Beam and Scanning Electron Beam (DualBeamTM) Technology L. Giannuzzi, FEI, US | |
| 10:50 | Silicon Nanostructure Fabrication by Direct FIB Writing and TMAH Wet Chemical Etching P. Sievilä, N. Chekurov, I. Tittonen, Aalto University, FI | |
| 11:10 | Fabrication of Micro Photonic Crystals for Handling of Terahertz Electromagnetic Waves S. Kirihara, D. Sano, T. Niki, N. Ohta, Y. Takinami, Osaka University, JP | |
| 11:30 | Efficient coupling of light into nanometer sized objects via dielectric microcavities and metal nanoantennas M. Hagner, T. Thomay, M. Kahl, J. Merlein, V. Kohnle, T. Hanke, A. Leitenstorfer, R. Bratschitsch, University of Konstanz, DE | |
| 11:50 | Nanomechanical Mass Spectrometry and NEMS VLSI A. Naik, California Institute of Technology, US | |
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| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 10:30 | A Critical Review of Thermal Management Schemes for MEMS and Electronics Cooling N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US | |
| 10:50 | Co-Design of MEMS, Electronics and Packaging: Putting the “Design” Back in “Design Tools” M. Maher, SoftMEMS, US | |
| 11:10 | Microfluidic System Integration (invited) D. Sparks, Integrated Sensing Systems, US | |
| 11:30 | Motion MEMS: Think Outside the Box and Beyond the Chip F. Pasolini, ST Microelectronics, IT | |
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| 10:30 | TechConnect Corporate Partnering | Room 207 D |
| Session chair: Dave Gibbons, University of California, San Diego, US | ||
| 10:30 | Honda TechConnect Partnering N. Sugimoto, Honda Strategic Venturing, US | |
| 10:50 | Applied Materials TechConnect Partnering C. Moran, Applied Materials Ventures, US | |
| 11:10 | Samsung TechConnect Partnering B. Byun, Samsung Ventures, US | |
| 11:30 | Panasonic TechConnect Partnering I. Nydick, Panasonic Ventures Group, US | |
| 11:50 | Siemens TechConnect Partnering S. Heuser, Siemens, US | |
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| 1:00 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 1:00 | Welcome and Introduction R. Grace, Roger Grace Associates, US | |
| 1:10 | Research Trajectories of Microsystems for Health-Care and Environmental Sensing (keynote) Y. Gianchandani, University of Michigan Wireless Integrated Microsystems Center, US | |
| 1:40 | Recent Progress in MEMS Process Integration for Optical and Microfluidic Applications P. Lin, Touch Micro-system Technology, TW | |
| 2:00 | Systems Approach to Inertial Motion Tracking C. Lucien, Hillcrest Laboratories, US | |
| 2:20 | Overcoming the Challenges of Using Gyroscopes for Motion Sensing in Pointing Device Applications T. Kelliher, Movea, US | |
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| 3:30 | International Standards Creation and Compliance in Nanotechnology | Room 202 A |
| Session chair: William S. Rogers, Day Pitney | ||
| - | J.A. Clark, Day Pitney LL, US | |
| - | S.R. Amdt, Exponent, Inc., US | |
| - | R.C. Pleus, Intertox, Inc., US | |
| - | M.E. Marrapese, Keller and Heckman, US | |
| - | C. Teague, National Nanotechnology Coordination Office, US | |
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| 3:30 | NanoFab: Nanofabrication Development - Techniques and Facilities | Room 210 C |
| Session chair: Guy DeRose, Caltech, US | ||
| 3:30 | The Application of the Fixed Beam Moving Stage (FBMS) Lithography Mode and the Metrology Toolset to Fabricate and Measure Waveguide Coupling Devices J. E. Sanabia, J. Klingfus, M. Aktary, Raith USA, Inc., US | |
| 3:50 | The Challenges Facing Open Access Nanofabrication Facilities R. Hicks, Australian National Fabrication Facility, AU | |
| 4:10 | Influence of resist composition on demolding force in UV nanoimprint lithography A. Amirsadeghi, J. Lee, S. Park, Louisiana State University, US | |
| 4:30 | Maskless Lithography Using Patterned Amorphous Silicon Layer Induced by Femtosecond Laser Irradiation A. Kiani, K. Venkatakrishnan, B. Tan, Ryerson University, CA | |
| 4:50 | Characterization of an ultra high aspect ratio electron beam resist for nano-lithography S. Lewis, D. Jeanmaire, V. Haynes, L. Piccirillo, The University of Manchester, UK | |
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| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 3:00 | Wafer Bonding as a Key Technology for 3D Integration of MEMS and Electronics (invited) M. Wiemer, J. Braeuer, D. Wuensch, T. Gessner, Fraunhofer Research Institution for Electronic NanoSystems, DE | |
| 3:20 | Wafer-Level Testing of MEMS Devices in Controlled Vacuum Environment A. Rumiantsev, S. Giessmann, F.-M. Werner, F. Coccetti, L. Bary, Cascade Microtech and MEMUNITY, DE | |
| 3:40 | Challenges and New Strategies for Inertial MEMS Testing L. Zana, M. Tschirky, Acutronic, US | |
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| 3:30 | Micro & Nano Reliability III | Room 206 A |
| Session chair: Jürgen Keller, AMIC GmbH and Bernd Michel, Fraunhofer IZM, DE | ||
| 3:30 | Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components? R. Pufall, B. Michel, E. Kaulfersch, Infineon Technology AG, DE | |
| 3:50 | Influence of moisture on humidity sensitive material parameters of microelectonic relevant polymers H. Walter, E. Dermitzaki, B. Wunderle, B. Michel, Fraunhofer IZM, DE | |
| 4:10 | fibDAC Stress Relief – a Novel Stress Measurement Approach for Semiconductor BEoL Structures D. Vogel, A. Gollhardt, J. Keller, B. Michel, Fraunhofer ENAS, DE | |
| 4:30 | Monte Carlo Modeling Of Electrical Breakdown In Layered Capacitors E. Furman, G. Sethi, B. Koch, M. Lanagan, Pennsylvania State University, US | |
| 4:50 | Advanced In- and Out-off plane High Resolution X-ray Strain Analysis on MEMS A. Neels, A. Dommann, CSEM, CH | |
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| 5:00 | TechConnect Investment Networking Reception - Second Floor | Foyer 2nd Floor |
Topics & Application Areas
- CMOS Integration & Design
- MEMS Front-End Processes
- MEMS Litho & Patterning Processes
- MEMS Back-End Processes
- MEMS Packaging Technologies
- Metrology & Inspection Methodology
- CMOS Integration Processes
- Novel Materials & Processes
- Process Control
- Other
Journal Submissions
On-line Journal ‘Sensors & Transducers’
Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.
For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.
Journal of Experimental Nanoscience
Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.
For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.
Molecular Simulation
Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of Molecular Simulation. The journal covers all aspects of research related to, or of importance to, molecular modelling and simulation (including informatics, theoretical and experimental work).
For consideration into this Special Issue of Molecular Simulations, please select the “Submit to Molecular Simulation” button during the on-line submission procedure.