Microtech 2010 Nanotech 2010

MEMS & NEMS Devices

MEMS & NEMS

Symposium Sessions

Tuesday June 22

10:30 Keynotes: Nanostructured Coatings, Surfaces & Interfaces (InkJet)
10:30 Microtech Commecialization & Applications
10:30 Bio Sensors: Assays & Applications
10:30 Micro & Nano Fluidics I
1:30 Microtech Commecialization & Applications
4:00 Poster Session and TechConnect Expo (4:00 - 6:00)
 MEMS & NEMS Devices
 Sensing Systems & Wireless Networks

Wednesday June 23

8:30 Government & Alternative Commercialization Funding - DOD, NASA, DOE, SBIR & RIC
10:00 Networking Coffee Break
10:30 MEMS & NEMS Sensing Devices
10:30 TechConnect Corporate Partnering
1:30 MEMS & NEMS Devices
2:00 Micro & Nano Fluidics III
3:00 MEMS State of the Industry
3:30 Five Attributes of a Successful Nanotechnology Company
3:30 TechConnect Corporate Partnering
4:00 Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall
 Inkjet Design, Materials & Fabrication
5:30 Microsystem Networking Reception - Hosted by MEMS Industry Group (MIG) & Nano Science & Technology Institute (NSTI)
6:00 TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor

Thursday June 24

8:30 Keynotes: Transformational Nanotech
8:30 MEMS-Based Systems Solutions and Integration Approaches
10:00 TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor
10:30 Bio Sensors: Assays & Applications
10:30 MEMS-Based Systems Solutions and Integration Approaches
10:30 Inkjet Technologies I
3:00 TechConnect Ventures: Sensors & Microsystems
1:30 MEMS Device Modeling I
1:00 MEMS-Based Systems Solutions and Integration Approaches
1:30 Inkjet Technologies II
3:30 MEMS Device Modeling II
3:00 MEMS-Based Systems Solutions and Integration Approaches
3:30 Inkjet Technologies III
4:00 Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective
5:00 TechConnect Investment Networking Reception - Second Floor

Symposium Program

Tuesday June 22

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10:30Keynotes: Nanostructured Coatings, Surfaces & Interfaces (InkJet)Room 208 AB
Session chair: Jan Sumerel, Dimatix, US
10:30Inkjet printing: From Nanoparticle to Bioreactors (invited presentation)
S. Magdassi, Hebrew University, IL
11:00Manipulating Optical Properties of Luminescent Nanoparticle Substrates through Inkjet Printing (invited presentation)
K. Guzan, J. Sumerel, L. Davis, P. Hoertz, K. Mills, D. Magnus-Aryitey, RTI International, US
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10:30Microtech Commecialization & ApplicationsRoom 205 AB
Session chair: Jeff Perkins, Yole Inc., US
10:30MEMS Market Overview
J. Perkins, Yole Inc., US
11:00What it Takes to Develop New MEMS Products: Reality Check
A.M. Fitzgerald, AM Fitzgerald, US
11:30Ultra low cost monolithic CMOS motion sensors for mass-market consumption
J. Montanyà i Silvestre, Baolab, ES
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10:30Bio Sensors: Assays & ApplicationsRoom 201 D
Session chair: Srinivas Iyer, Los Alamos National Labs, US
10:30Bio Sensors Overview (invited presentation)
S. Iyer, Los Alamo National Lab, US
11:00Towards an asynchronous magnetic bead rotation method for immunological assays
A. Hecht, P. Kinnunen, B. McNaughton, R. Kopelman, University of Michigan, US
11:20Label-Free, Electrical Detection of the SARS Virus N-Protein with Nanowire Biosensors Utilizing Antibody Mimics as Capture Probes
H.K. Chang, F. Ishikawa, P.C. Chiang, C. Zhou, University of Southern California, US
11:40Diamond MEMS biosensors for real-time sensing of water-based chemical/biological pathogens
D. Hickey, Advanced Diamond Technologies, Inc., US
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10:30Micro & Nano Fluidics IRoom 201 C
Session chair: Edward Furlani, Eastman Kodak Company, US
10:30High-impact Technologies in Microfluidics (invited presentation)
R. Bringans, Palo Alto Research Center, US
10:50Slip boundary conditions in nanofluidics from the molecular theory of solvation
A.E. Kobryn, A. Kovalenko, National Institute for Nanotechnology, CA
11:10Experimental Study of Drying/Evaporation in an Effective 2D Porous Medium
A.G. Yiotis, I.N. Tsimpanogiannis, A.K. Stubos, National Center for Scientific Research “Demokritos”, GR
11:30Continuous Separation of Non-Magnetic Particles through Negative Magnetophoresis inside Ferrofluids
T. Zhu, F. Marrero, L. Mao, The University of Georgia, US
11:50Simultaneous Positioning and Orientation of a Single Nanorod Using Electro-osmotic Flow Control
P.P. Mathai, P.T. Carmichael, A.J. Berglund, J. Alexander Liddle, B.A. Shapiro, National Institute of Science and Technology, US
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1:30Microtech Commecialization & ApplicationsRoom 205 AB
Session chair: Jeff Perkins, Yole Inc., US
1:30It’s not just about the MEMS
D. Buckley, Micralyne, CA
2:00MEMS-based Silicon Timing: Semiconductor Economics and Benefits Drive Rapid Growth
P. Sevalia, SiTime, US
2:30MEMS Applications - Oscillators
M. Crowley, Sand9, US
3:00MEMS Applications - MEMS ribbons for projectors
M. Bellis, Seikowave, JP
3:30MEMS Applications - RF MEMS Switches
J. Hilbert, wiSpry, Inc., US
4:00MEMS Applications - fluidic transport for consumer applications
F. Bartles, Bartels Mikrotechnik, DE
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4:00Poster Session and TechConnect Expo (4:00 - 6:00)Expo Hall
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MEMS & NEMS DevicesExpo Hall
-Frequency-Interleaved MEMS Ultrasound Transducer
S-J Chen, Y. Choe, E.S. Kim, University of Southern California, US
-High Fidelit Loud Microspeaker Based on PZT Bimorph Diaphragm
Y. Choe, S.J. Chen, E.S. Kim, University of Southern California, US
-Mechanical Robustness of FPA in a-Si Microbolometer with Fine Pitch
H.Y. Kim, K.M. Kim, B.I. Kim, W.S. Jang, T.H. Kim, T.Y. Kang, National Nanofab Center, KR
-Real-time structured light measurements with ambient light rejection
M. Bellis, Seikowave, JP
-Arrayed, Piezoelectrically-Actuated Mirrors and Gratings for Spectrometer
S-J Chen, D. Chi, J. Lo, E.S. Kim, University of Southern California, US
-A MEMS-Based Wide-Band Multi-State Power Attenuator for Radio Frequency and Microwave Applications
J. Iannacci, A. Faes, F. Mastri, D. Masotti, V. Rizzoli, Fondazione Bruno Kessler - FBK, IT
-Design of compact, high capacitance ratio MEMS switch for X - Band applications using high-k dielectric materials
K. Maninder, CEERI, IN
-One-chip MOS Structure for Temperature Flow Sensor
M. Husak, A. Boura, J. Jakovenko, Czech Technical University in Prague, CZ
-Gentle Micropump based on Microelectromagnetic Actuator
A.T. Al-Halhouli, A. Waldschik, M.I. Kilani, S. Büttgenbach, Technische Universität Braunschweig, DE
-Investigation of Stress in AlN Thin Films for Piezoelectric MEMS
R.E. Sah, L. Kirste, M. Baeumler, P. Hiesinger, V. Cimalla, V. Lebedev, H. Baumann, Fraunhofer Institute for Applied Solid State Physics, DE
-Preparation of functional PZT films on 6” and 8” silicon wafers by high rate sputtering
R. Dudde, D. Kaden, H.-J. Quenzer, B. Wagner, Fraunhofer ISIT, DE
-Design and Control of a Zero Voltage Switching MEMS DC-DC Power Converter
S. Ghandour, G. Despesse, S. Basrour, CEA/LETI, FR
-A current controlled plasma-on-a-chip for atmospheric plasma generation
H. Park, J. Jeong, Y. Kim, Hongik University, KR
-Development of Surface-micromachined Binary Logic Gate for Low Frequncy Signal Processing in MEMS based Sensor Applications
S. Chakraborty, T.K. Bhattacharyya, Indian Institute of Technology (IIT), Kharagpur, IN
-Magnetoelectric properties of piezeoelectric/magnetostrictive thin film devices
J.Y. Zhai, J. Xiong, Y.Y. Zhang, G.F. Zou, Q.X. Jia, Los Alamos National Laboratory, US
-Using MEMS as Self-Calibrating Force-Displacement Transducers: A Computational Study
J.V. Clark, F. Li, H. Lee, K. Kadasia, Purdue University, US
-Current controlled Plasma-on-a-chip for atmospheric plasma generation
H. Park, J. Jeong, Y. Kim, Hong-ik Univ., KR
-Towards Microrobots with Insect-Like Dexterity
J.V. Clark, F. Li, J.V. Clark, Purdue University, US
-Pb(Zr,Ti)O3 (PZT) Thin Films Sensors for Fully-Intergrated, Passive Telemetric Transponders
R.X. Fu, R.C. Toonen, E.H. Ngo, M.W. Cole, S.G. Hirsch, M.P. Ivill, C.W. Hubbard, Army Research Laboratory, US
-Nanolab System for Nanoelectronics and Sensors
A. Dimonte, D. Demarchi, P. Civera, G. Piccinini, Politecnico di Torino, IT
-Triaxial Accelerometer for Placement Inside the Ear Canal
T. Kwa, G. Pender, J. Letterneau, Endevco Corporation, Meggitt Sensing Systems, US
-Individually addressable Cantilever Arrays for Parallel Atomic Force Microscopy
T. Sulzbach, W. Engl, R. Maier, Nanoworld Services GmbH, DE
-Flexible Micropost Arrays For Studying Traction Forces Of Vascular Smooth Muscle Cells
Q. Cheng, Z. Sun, G.A. Meininger, M. Almasri, University of Missouri, US
-A Fully Symmetric and Completly Decoupled MEMS-SOI Gyroscope
A. Sharaf, S. Sedky, M. Serry, A. Elshurafa, M. Ashour, S.E.-D. Habib, American University in Cairo, EG
-Nano-porous poly-silicon gated ion selective field effect transistors
N. Zehfroosh, M. Shahmohammdi, S. Mohajerzadeh, M. Araghchini, University of Tehran, IR
-Design and Fabrication of the Sensor for Measuring the Human Bladder Volume
S. Lee, S. Jun, S. Kim, S. Kim, B. Choi, Sogang University, KR
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Sensing Systems & Wireless NetworksExpo Hall
-Development of Quantitative Adhesive Force Measurement Systems for Flexible Electronics
M. Kim, J. Park, B. Choi, Sogang University, KR
-Simple vertical velocity measurement system for different use
M. Husak, J. Jakovenko, Czech Technical University in Prague, Faculty of Electrical Engineering, CZ
-Wireless SensorSystem with Bidirectional Communications
M. Husak, A. Boura, J. Jakovenko, Czech Technical University in Prague, CZ
-Modelling of Low Level Ionic Current Sensing Micro-tip
S. Memon, W. Balachandran, Brunel Univeristy, West London, UK
-Digital signal processing post-hybridization of DNA Biosensor
S.A. Afuwape, NATIONAL UNIVERSITY, US
-Mobility Effects on WCDMA Receivers in Indoor Areas
S. Alhloul, F. Ahmad Alzahrani, Albaha University, SA
-Silicon Germanuim Oxide (SixGe1-xOy) Infrared Sensitive Material for Uncooled Detectors
Q. Cheng, M. Hai, T. Bui, M. Almasri, University of Missouri, US

Wednesday June 23

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8:30Government & Alternative Commercialization Funding - DOD, NASA, DOE, SBIR & RICRoom 207 D
Session chair: Kelly Carnes, TechVision21, US
8:30DOE SBIR Funding Opportunities
D. Goodwin, US Department of Energy, US
8:50DOD Commercialization Funding Opportunities
F. Barros, US Department of Homeland Security, US
9:10NASA Commercialization Funding Opportunities
R. Pisarski, NASA/Ames, US
9:30Renewable Energy Commercialization
J. Croce, Nevada Institute for Renewable Energy Commercialization, US
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10:00Networking Coffee BreakFoyer 2nd Floor
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10:30MEMS & NEMS Sensing DevicesRoom 303 B
Session chair: Bart Romanowicz, NSTI, US
10:30Single-Walled Carbon Nanotube Gas Sensors Integrated on Complementary Metal Oxide Semiconductor circuitry
C.-L. Chen, Y. Liu, V. Agarwal, S. Sonkusale, A. Busnaina, M. Chen, M.R. Dokmeci, Northeastern University, US
10:50Innovative Gas Sensors for Sub-ppm Detection of Organophosphorus Nerve Agents by Chemically Functionalized Carbon Nanotube Field-Effect Transistors
A. Carella, L. Caillier, S. Clavaguera, C. Celle, J-P Simonato, CEA, FR
11:10Chemo-resistive Si:WO3 sensors for selective detection of acetone
M. Righettoni, A. Tricoli, S.E. Pratsinis, Particle Technology Laboratory, Institute of Process Engineering, CH
11:30Low-power / High-temperature sensors and MEMS in SOI technology
L. Moreno-Hagelsieb, O. Bulteel, N. André, P. Gerard, J.-P. Raskin, D. Flandre, Université catholique de Louvain / SENSOI, BE
11:50Carbon-based Nanoelectronic Devices for Space Applicatoins
A.B. Kaul, A.R. Khan, K.G. Megerian, P. von Allmen, L. Bagge, L. Epp, R.L. Baron, Jet Propulsion Laboratory, US
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10:30TechConnect Corporate PartneringRoom 207 D
Session chair: Saeed Bagheri, University of Waterloo, CA
10:30Kodak TechConnect Partnering
B. Johnston, Eastman Kodak, US
10:50Toray Industries TechConnect Partnering
T. Yamashiki, Toray Industries America, US
11:10Fuji Electric TechConnect Partnering
K. Mori, Fuji Electric, US
11:30Sanyo TechConnect Partnering
S. Tanimoto, Sanyo, US
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1:30MEMS & NEMS DevicesRoom 303 C
Session chair: Roger Grace, Roger Grace Associates, US
1:30Micro Crumples for Self-Assembly of Field Emission Devices
S. Sambandan, Palo Alto Research Center, US
1:50Modeling of a Surface Acoustic Wave Strain Sensor
W.C. Wilson, G.M. Atkinson, NASA Langley Research Center, US
2:10Micromachined Glass-Blown 3-D Spherical Shells as Mechanical Vibratory Elements
I.P. Prikhodko, A.A. Trusov, S.A. Zotov, A.M. Shkel, University of California, Irvine, US
2:30Monolithic CMOS MEMS technology development: A piezoresistive-sensors case study
A. Chaehoi, D. Weiland, D. O’Connell, S. Bruckshaw, S. Ray, M. Begbie, Institute for System Level Integration, UK
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2:00Micro & Nano Fluidics IIIRoom 303 B
Session chair: Edward Furlani, Eastman Kodak, US
2:00Biomolecular Adsorption Phenomena in Electrowetting-Based Digital Microfluidic Devices
A. Ahmadi, K.D. Devlin, H. Najjaran, J.F. Holzman, M. Hoorfar, University of British Columbia, CA
2:20Novel Parameters for Rapid Blood Separation on a Centrifugal Platform
R. Gorkin, T.H. Kim, M. Madou, Y.K. Cho, University of California Irvine, US
2:40Multiplexed Localization in Bi-Layer Digital Microfluidic Systems
M. Abolhasani, K.D. Devlin, H. Najjaran, M. Hoorfar, J.F. Holzman, The University of British Columbia Okanagan, CA
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3:00MEMS State of the IndustryRoom 303 C
Session chair: Karen Lightman, MEMS Industry Group, US
-State of the IndustryK. Lightman, MEMS Industry Group, US
-C. White, A.M. Fitzgerald & Associates, US
-M. Tschirky, Acutronic, CH
-M.A. Maher, SoftMEMS, US
-P. Krishnan, SVTC, US
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3:30Five Attributes of a Successful Nanotechnology CompanyRoom 206 A
Session chair: John R. Bashaw, Day Pitney LLP
-T.C. Chase, Day Pitney LLP, US
-R.C. Pleus, Intertox, US
-C.H. Pham, Greenberg Traurig, US
-M.P. Johns, Blue Water Consulting, US
-Z. Kosim, Enviromental Protection Agency, US
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3:30TechConnect Corporate PartneringRoom 207 D
Session chair: Michael Pottenger, University of California Los Angeles, US
3:30Dow TechConnect Partnering
P. Ansems, Dow, US
3:50Omron TechConnect Partnering
D. Uchida, Omron, US
4:10Chevron TechConnect Partnering
T. Unneland, Chevron, US
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4:00Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo HallExpo Hall
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Inkjet Design, Materials & FabricationExpo Hall
-Machine Vision System for Analysis of Drops-in-flight and Wetting Visualization
Y. Kipman, ImageXpert Inc., US
-Nano-Patterning of NaCl Using Nanopipette based on the QTF-AFM System
S.M. An, M. Geol W.H. Jhe, Department of Physics and Astronomy, Seoul National University, KR
-Customer-focused batch production via printing technology
A. Kain, C. Mueller, H. Reinecke, University of Freiburg, DE
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5:30Microsystem Networking Reception - Hosted by MEMS Industry Group (MIG) & Nano Science & Technology Institute (NSTI)Room 303 C
Session chair: Karen Lightman, MEMS Industry Group, US
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6:00TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd FloorBallroom BC

Thursday June 24

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8:30Keynotes: Transformational NanotechRoom 303 CD
Session chair: Clayton Teague, NNCO, US
8:30Nanotechnology: Path Toward Commercialization at GE
M. Butts, General Electric, US
9:00Getting the Memristor to Market
S. Williams, Hewlett Packard, US
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8:30MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
8:30Welcome and Introduction
R. Grace, Roger Grace Associates, US
8:40Micro Analytical Instruments: A Systems Approach (keynote)
J. Mueller, University of Technology Hamburg, DE
9:10MEMS-Based Systems Solutions: Introduction and Overview with Selected Case Studies of Current and Future High Volume Applications
R. Grace, Roger Grace Associates, US
9:30Smart System Integration Trends in Europe: The perspective of a European Technology Platform
H. Metras, CEA-Leti, FR
9:50MEMS-Based Photonic Systems: Hardware Synergy for Maximized User Benefits (invited)
H. Gruger, M. Scholles, H. Schenk, Fraunhofer Institute for Photonic Microsystems, DE
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10:00TechConnect Innovation Showcase Coffee Break - Ballroom 3rd FloorBallroom BC
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10:30Bio Sensors: Assays & ApplicationsRoom 201 B
Session chair: Srinivas Iyer, Los Alamos National Labs, US
10:30Rapid Detection of Oral Cancer: Electrophysiological Characterization by Dielectrophoresis technology
H.J. Mulhall, R. Abdallat, X. Liang, S. Fedele, M.P. Lewis, S. Porter, D.E. Costea, A.C. Johannessen, M.P. Hughes, O. Tsinkalovsky, F.H. Labeed, University of Surrey, UK
10:50Microfluidic Devices for Rapid Separation and Sensing of Cells
S. Bose, C-H. Lee, J.M. Karp, R. Karnik, Massachusetts Institute of Technology, US
11:10DNA Extraction, Purification and Quantification Using Micromachined Microfluidic Chip
S.M. Azimi, G. Nixon, J. Ahern, W. Balachandran, BRUNEL UNIVERSITY, UK
11:30Multiplexed protein detection using antibody-conjugated microbead arrays assembled on a microfabricated electrophoretic device
K.D. Barbee, A.P. Hsiao, E.E. Roller, X. Huang, University of California San Diego, US
11:50A flow-assisted point-of-care testing device based on gravitational field-flow fractionation for analysis on biological fluids
M. Mirasoli, L. Cevenini, S. Casolari, B. Roda, A. Di Carlo, P. Reschiglian, A. Roda, University of Bologna, IT
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10:30MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
10:30A Critical Review of Thermal Management Schemes for MEMS and Electronics Cooling
N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US
10:50Co-Design of MEMS, Electronics and Packaging: Putting the “Design” Back in “Design Tools”
M. Maher, SoftMEMS, US
11:10Microfluidic System Integration (invited)
D. Sparks, Integrated Sensing Systems, US
11:30Motion MEMS: Think Outside the Box and Beyond the Chip
F. Pasolini, ST Microelectronics, IT
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10:30Inkjet Technologies IRoom 210 D
Session chair: Chris Menzel, Dimatix, US
10:30Modeling Drop Generation at the Microscale
M.S. Hanchak, E.P. Furlani, Eastman Kodak Company, US
11:00Using simulation and experiment to uncover the influence of material properties
O.A. Basaran, P.P. Bhat, S. Appathurai, Purdue University, US
11:30Drop Formation and Control of Non-Newtonian Fluid
J. Gao, K. Ng, Eastman Kodak Company, US
12:00The Investigation of Electrostatic Induced Inkjet Printing System for the Ejection of a Stable Micro/Nano Droplet
J. Choi, Y-J Kim, S.U. Son, K. Chul An, S. Lee, Sungkyunkwan University, KR
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3:00TechConnect Ventures: Sensors & MicrosystemsRoom 207 A
Session chair: George Petracek, Atrium Capital, US
3:00P&E Automation,Inc
D. Bebb, P&E Automation, Inc., US
3:10nanoLambda
B. Choi, nanoLambda, US
3:20Blackrock Sensors Inc
J. Chance, Blackrock Sensors Inc., US
3:30MEMS Foundry Itzehoe GmbH
R. Dudde, MEMS Foundry Itzehoe GmbH, DE
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1:30MEMS Device Modeling IRoom 208 A
Session chair: Cy Wilson, NASA, US
1:30Modeling study of capacitance and gate current in strained High--K Metal gate technology: impact of Si/SiO2/HK interfacial layer and band structure model
D. Garetto, D. Rideau, E. Dornel, W.F. Clark, C. Tavernier, Y. Leblebici, A. Schmid, H. Jaouen, IBM France, FR
1:50A Sparse Grid based Collocation Method for Model Order Reduction of Finite Element Models of MEMS under Uncertainty
P.S. Sumant, H. Wu, A.C. Cangellaris, N. Aluru, University of Illinois at Urbana-Champaign, US
2:10Calibration and Validation Procedure for Reliable and Predictive High-level Transducer Models Suited for System-level Design
R. Khalilyulin, G. Schrag, G. Wachutka, Munich University of Technology, DE
2:30An Online Electrostatics Modeling Tool for Microdevices with Dirichlet Boundary Conditions by Schwarz-Christoffel Mapping
F. Li, J.V. Clark, Purdue University, US
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1:00MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
1:00Welcome and Introduction
R. Grace, Roger Grace Associates, US
1:10Research Trajectories of Microsystems for Health-Care and Environmental Sensing (keynote)
Y. Gianchandani, University of Michigan Wireless Integrated Microsystems Center, US
1:40Recent Progress in MEMS Process Integration for Optical and Microfluidic Applications
P. Lin, Touch Micro-system Technology, TW
2:00Systems Approach to Inertial Motion Tracking
C. Lucien, Hillcrest Laboratories, US
2:20Overcoming the Challenges of Using Gyroscopes for Motion Sensing in Pointing Device Applications
T. Kelliher, Movea, US
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1:30Inkjet Technologies IIRoom 210 D
Session chair: Chris Menzel, Dimatix, US
1:30Novel Dynamic Volume Control in Jetting of Complex Fluids
G.E. Mårtensson, Mydata Automation AB, SE
2:00Ink Jet Printing Electronics and Optical Devices
S. Ready, Palo Alto Research Center, Inc, US
2:20Inkjet Printed Devices for Armament Applications
J.L. Zunino III, D.P. Schmidt, A.M. Petrock, B.E. Fuchs, U.S. Army, US
2:40Printed sensor and liquid actuation on natural fiber based substrate
J.J. Saarinen, P. Ihalainen, A. Määttänen, R. Bollström, J. Peltonen, Abo Akademi University, FI
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3:30MEMS Device Modeling IIRoom 208 A
Session chair: Cy Wilson, NASA, US
3:30Dynamic Compact Thermal Model of an Electrothermal Micromirror Based on Transmission Line Theory
S. Pal, H. Xie, University of Florida, US
3:50Passive Temperature-Compensation of MEM Resonators
X. Rottenberg, R. Jansen, S. Stoffels, J. De Coster, W. De Raedt, H.A.C. Tilmans, IMEC, BE
4:10Improved Modeling of the Comb Drive Levitation Effect
F. Li, J.V. Clark, Purdue University, US
4:30Finite Element Modeling and Analysis of CMOS-SAW Sensors
O. Tigli, M.E. Zaghloul, Washington State University Vancouver, US
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3:00MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
3:00Wafer Bonding as a Key Technology for 3D Integration of MEMS and Electronics (invited)
M. Wiemer, J. Braeuer, D. Wuensch, T. Gessner, Fraunhofer Research Institution for Electronic NanoSystems, DE
3:20Wafer-Level Testing of MEMS Devices in Controlled Vacuum Environment
A. Rumiantsev, S. Giessmann, F.-M. Werner, F. Coccetti, L. Bary, Cascade Microtech and MEMUNITY, DE
3:40Challenges and New Strategies for Inertial MEMS Testing
L. Zana, M. Tschirky, Acutronic, US
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3:30Inkjet Technologies IIIRoom 210 D
Session chair: Chris Menzel, Dimatix, US
3:30Rapid Metallization of Silver and Copper Nano Inks by Surface Wave Plasma Sintering
J.M. Cho, Y.I. Lee, Y.A. Song, T.H. Kim, S.E. Kim, D.H. Kim, Samsung Electro-mechanics, Co. Ltd., KR
3:50Stable colloidal dispersion of luminescing silicon nanoparticles for inkjet printing
A. Gupta, A.S.G. Khalil, M. Winterer, H. Wiggers, Universität Duisburg-Essen, DE
4:10Optimising the properties of TIPS-pentacene: polystyrene thin film transistors by inkjet printing
M.-B. Madec, P.J. Smith, J.G. Korvink, S.G. Yeates, University of Manchester, UK
4:30Ink-jet printed ZnO Nanoparticle Thin Films for Sensing Applications
S. Hartner, A.S.G. Khalil, M. Ali, M. Winterer, H. Wiggers, University Duisburg-Essen, DE
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4:00Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test PerspectiveRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
-J. Brown, MEMS and Nano Exchange, US
-K. Lightman, MEMS Industry Group, US
-W. McCulley, InterMEMS, US
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5:00TechConnect Investment Networking Reception - Second FloorFoyer 2nd Floor

Topics & Application Areas

  • Acoustic Devices
  • Optical MEMS
  • RF MEMS, Resonators & Oscillators
  • Thermal Devices
  • Actuating Devices
  • Novel MEMS Devices
  • Novel NEMS Devices
  • Mechanical & Physical Sensors
  • Chemical & Gas Sensors
  • Other Micro Sensors
  • Other

Journal Submissions

Sensors & Transducers

On-line Journal ‘Sensors & Transducers’

Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’.

For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to Sensors & Transducers” button during the on-line submission procedure.

Experimental Nanoscience

Journal of Experimental Nanoscience

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of the Journal of Experimental Nanoscience. The journal provides a showcase for advances in the experimental sciences underlying nanotechnology and nanomaterials.

For consideration into this Special Issue of the Journal of Experimental Nanoscience, please select the “Submit to Journal of Experimental Nanoscience” button during the on-line submission procedure.

Molecular Simulation

Molecular Simulation

Selected Nanotech Proceedings papers will be reviewed and invited into a Special Issue of Molecular Simulation. The journal covers all aspects of research related to, or of importance to, molecular modelling and simulation (including informatics, theoretical and experimental work).

For consideration into this Special Issue of Molecular Simulations, please select the “Submit to Molecular Simulation” button during the on-line submission procedure.

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