Microtech2010 2010
ventures, investment, partnering

Ventures, Investment & Partnering

Business & Strategy
 
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For early stage companies to present technologies and market advantages to corporate partners and funders.
 

2010 Corporate Partnering Speakers and Sponsors Include:

Honda
BASF
Sanyo
DOW
GlaxoSmithKline
 Lockheed Martin
Medtronic
Applied Materials
Genzyme
European Patent Office
 Kodak
Merck
Omron
bp
Panasonic
 

2010 TechConnect Advisory Committee

University & Labs

Co-Chairs:
- Keith Ritala, University
  of Washington
- Goran Matijasevic,
  University of
  California- Irvine

  • AzTE-Arizona State University
  • Boston College
  • Boston University
  • Columbia University
  • ETH Zurich
  • Imperial College-London
  • Johns Hopkins University
  • Mass. Tech Transfer Center
  • Oklahoma State University
  • PARC
  • Rice University
  • Simon Fraser University
  • SUNY Albany
  • Texas A&M University
  • Tufts University
  • UCSD
  • UniQuest, Australia
  • Univalor
  • University of Geneva, CH
  • University of Minnesota
  • University of Notre Dame
  • University of Pittsburgh
  • University of Texas Health Science Center at San Antonio
  • University of Texas Medical Branch-Galveston
  • University of Waterloo
  • University of Western Ontario
  • University of Wisconsin-Madison

Corporate

Co-Chairs:
- Liz Porter,
  Lockheed Martin
- Patricia Ansems,
  Dow Chemical

  • Applied Materials
  • BASF
  • BPT Pharmaceuticals
  • Crowell & Moring L&E
  • CTSI
  • Eastman Kodak
  • ExxonMobil
  • FMC Agricultural Products
  • Ford Motor Company
  • GE Healthcare
  • Genzyme
  • Honda Strategic Ventures
  • Medtronic
  • Merck
  • Motorola
  • NICDP-Saudi Arabia
  • Omron
  • Philips
  • Procter & Gamble
  • Sanyo
  • Solarmer
  • The Livingston Group
  • Tom O'Donnell
  • Toray

Investment

Chair:
- George Petracek,
  Atrium Capital

  • AD.E. Shaw & Co., L.P.
  • CMEA Ventures
  • Davidow Ventures
  • DFJ Mercury
  • Emerald Technology Ventures
  • General Catalyst Partners
  • Harris and Harris Group
  • IBM Venture Capital
  • In-Q-Tel
  • Inovia Capital
  • Intel Capital
  • Massachusetts Technology Development Corporation
  • MSBi Capital
  • MSBi Valorisation
  • NanoDimension AG
  • Navigator Technology Ventures
  • Panasonic Ventures
  • Pangaea Ventures
  • Phoenix Ventures
  • Rockport Capital
  • Samsung Ventures
 

Track Sessions

Tuesday June 22

2:15 TechConnect IP Partnering: Electronics & Semiconductors
4:30 Corporate Partnering Network Reception (4:30 - 6:00) TechConnect Marketplace - Expo Hall
4:00 Poster Session and TechConnect Expo (4:00 - 6:00)

Wednesday June 23

10:00 Networking Coffee Break
1:00 TechConnect IP Partnering: Biotech & Pharma
1:00 TechConnect IP Partnering: Sensors & Microsytems
2:15 TechConnect IP Partnering: Sensors & Microsystems
2:15 TechConnect IP Partnering: Cleantech Power, Storage & Efficiency
2:15 Global IP Practices, Protection and Value
4:30 Corporate Partnering Network Reception (4:30 - 6:00) TechConnect Marketplace - Expo Hall
4:00 Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall
6:00 TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor

Thursday June 24

10:00 TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor
1:30 TechConnect Ventures: Biotech & Pharma
1:30 TechConnect Ventures: Cleantech Storage & Power
3:00 TechConnect Ventures: Sensors & Microsystems
3:00 TechConnect Ventures: Cleantech Efficiency, Grid & Transportation
4:00 TechConnect Ventures: Cleantech Remediation, Purification & Alternative Fuels
5:00 TechConnect Investment Networking Reception - Second Floor

Track Program

Tuesday June 22

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2:15TechConnect IP Partnering: Electronics & SemiconductorsRoom 207 A
Session chair: Kenichi Mori, Fuji Electric, US
2:15Cooling electronics by liquid submersion and heat exchanger
C. Hanson, Venture Isles, LLC, US
2:25A Novel MOCVD Technology in LED and Solar Cell Applications
C. Byun, KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY(KITECH), US
2:35Multilayer Heterostructures for Application in OLEDs and Photovoltaic Devices
T. Chong, National Universtiy of Singapore, SG
2:45Low-voltage field emission scanning electron microscope
T. Kirk, Swiss federal institute of technology, Zurich (ETH Zurich), CH
2:55AFM Method for Fast Mapping of Materials Properties
L. Besemann, University of Minnesota, US
3:05SimpleSilence: Method and apparatus for controlling tonal noise from subsonic fans
F. DesRosiers, SOCPRA, CA
3:15Barium titanate nanopowder
A. Ragulya, Frantsevich Institute for Problems in Materials Science, UA
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4:30Corporate Partnering Network Reception (4:30 - 6:00) TechConnect Marketplace - Expo HallTechConnect ME
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4:00Poster Session and TechConnect Expo (4:00 - 6:00)Expo Hall

Wednesday June 23

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10:00Networking Coffee BreakFoyer 2nd Floor
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1:00TechConnect IP Partnering: Biotech & PharmaRoom 207 B
Session chair: Sarah Audet, Medtronic, US
1:00An Improved Implantable Heart Failure Monitor
J. Hofmeister, University of Minnesota, US
1:10Method of fabricating 1.5T MgB2-magnet based MRI
YJ Kim, University of Puerto Rico, US
1:20Method and Apparatus for Measuring Locally and Superfi¬cially the Scattering and Absorption Properties of Turbid Media
C. Depeursinge, EPFL, CH
1:30Needle free intradermal injection
F. DesRosiers, SOCPRA, CA
1:40CisPlatinum gold nanoparticles with a pH sensitive linker for intracellular delivery and the use of nanoparticle conjugate
J. Reverter, INSTITUT CATALA DE NANOTECNOLOGIA, ES
1:50Robotic Serum Extractor
N. Pattrick, IP Pragmatics/InterAct, UK
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1:00TechConnect IP Partnering: Sensors & MicrosytemsRoom 207 C
Session chair: Brent Segal, Lockheed Martin, US
1:00High-Resolution Microscopy and Photolithography Devices Using Focusing Micromirrors (PCT/IB2010/050300)
B. Rachet, Ecole Polytechnique de Lausanne (EPFL), CH
1:10Electrocatalytic quantification of gold nanoparticles based on the hydrogen reduction and application for DNA, proteins and cells analysis
J. Reverter, INSTITUT CATALA DE NANOTECNOLOGIA, ES
1:20Synthesis of Specific Number of Graphene Layers by Thickness Selective Laser Ablation
T. Chong, National Universtiy of Singapore, SG
1:30Optical Scanning using Vibratory Diffraction Grating
J. Koh, National Universtiy of Singapore, SG
1:40Low light image enhancer
L. Loev, Ramot at Tel Aviv University, Ltd., IL
1:50Clog-free inkjet printhead
J. Kwon, University of Missouri-Columbia, US
2:00Self-Sustainable Magnetoelectric Smart Sensors
D. Or, The Hong Kong Polytechnic University, HK
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2:15TechConnect IP Partnering: Sensors & MicrosystemsRoom 207 B
Session chair: Brent Segal, Lockheed Martin, US
2:153D MEMS Antenna
E. Sum, Simon Fraser University, CA
2:25Real-time detection of known files over a network
T. Martinuzzo, Univalor, CA
2:35Waveguide Based Biosensors
N. Gadoury, Univalor, CA
2:45Method for simultaneous measurement of gaseous or liquid species concentration and solids fraction
N. Gadoury, Univalor, CA
2:55Miniature Transforming Robot with Ground and Air Locomotion
D. Nugent, University of Minnesota, US
3:05Novel Bioelectronic Photodetector
J. Bindra, WORLDiscoveries, CA
3:15Novel Light-based Micro-Pressure Sensor
J. Bindra, WORLDiscoveries, CA
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2:15TechConnect IP Partnering: Cleantech Power, Storage & EfficiencyRoom 207 C
Session chair: Patricia Ansems, Dow, US
2:15Modified cathode LiFePO4 with ultrafast charge rate and ultrahigh power density for high performance Li rechargeable batteries
T. Chong, National Universtiy of Singapore, SG
2:25Mesoporous TiO2 with High Packing Density for Superior Lithium Storage Capacity
T. Chong, National Universtiy of Singapore, SG
2:35A highly ordered nanostructured carbon–sulphur cathode for lithium–sulphur batteries
S. Bagheri, University of Waterloo, CA
2:45Real-Time 3D Video Capture system
R. Broadbridge, 4D View Solutions, FR
2:55Low Cost Hybrid Substrates for Solid State Lighting Applications
P. Dowd, AzTE, US
3:05Membranes for Electrochemical Devices and Materials (Fuel cells, Photovoltaic, Batteries)
F. Caporale, University of California, Santa Barbara, US
3:10Energy-Efficient Driver System for Light-Emitting Diodes
E. Lam, The Hong Kong Polytechnic University, HK
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2:15Global IP Practices, Protection and ValueRoom 207 D
Session chair: David Novak, Inventis Group, US
2:15Filing for Global Protection of your Nanotech or Cleantech Inventions: What you Need to Know
V. Veefkind, C. Kallinger, European Patent Office, NL
2:50Global Patenting Strategies and Tactics
S. Cummings, Buchanan Ingersoll, US
3:10Connecting Mexico with the United States using the Redspan Innovation Network to Accelerate Opportunity Assessment, Technology Commercialization and Innovation through the Power of Community
M. Masquelier, J.A. Peralta, B.M. Lopez, Redspan Inc., US
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4:30Corporate Partnering Network Reception (4:30 - 6:00) TechConnect Marketplace - Expo HallTechConnect ME
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4:00Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo HallExpo Hall
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6:00TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd FloorBallroom BC

Thursday June 24

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10:00TechConnect Innovation Showcase Coffee Break - Ballroom 3rd FloorBallroom BC
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1:30TechConnect Ventures: Biotech & PharmaRoom 207 B
Session chair: Lynn Foster, BPT Pharmaceuticals, US
1:30Adjuvance Technologies, Inc
J. Gardner, Adjuvance Technologies, Inc., US
1:40FluimediX
T. Ussing, FluimediX, DK
1:50MITI Systems
B. Sul, MITI systems, KR
2:00BioMers Pte Ltd
M. Fathianathan, BioMers Pte Ltd, SG
2:10Curapel Ltd
S. France, University of Manchester/ Curapel Ltd, UK
2:20NanGenex Inc
G. Heltovics, NanGenex Inc., HU
2:30Bilcare Technologies Singapore Pte Ltd
A. Burden, Bilcare Technologies Singapore Pte Ltd, SG
2:40Diomics Corporation
J. Morhet, Diomics Corporation, US
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1:30TechConnect Ventures: Cleantech Storage & PowerRoom 207 C
Session chair: Dhiraj Malkani, Rockport Capital, US
1:30Paper Battery Company Inc
S. Mehta, Paper Battery Company, US
1:40Yunasko
A. Shnaydruk, Yunasko, UA
1:50Graphene Energy Inc
D. Agnihotri, Graphene Energy Inc, US
2:00Anzode
C. Officer, Anzode, US
2:10Angstron Supercapacitor Co
R. Beech, Angstron Supercapacitor Co., US
2:20NanoeXa, Inc
J. Chen, NanoeXa, Inc, US
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3:00TechConnect Ventures: Sensors & MicrosystemsRoom 207 A
Session chair: George Petracek, Atrium Capital, US
3:00P&E Automation,Inc
D. Bebb, P&E Automation, Inc., US
3:10nanoLambda
B. Choi, nanoLambda, US
3:20Blackrock Sensors Inc
J. Chance, Blackrock Sensors Inc., US
3:30MEMS Foundry Itzehoe GmbH
R. Dudde, MEMS Foundry Itzehoe GmbH, DE
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3:00TechConnect Ventures: Cleantech Efficiency, Grid & TransportationRoom 207 C
Session chair: Cheemin Bo-Linn, Peritus Partners, Inc., US
3:00ThinkEco Inc
M. Shibata, ThinkEco, Inc., US
3:10EcoThermics Corporation
M. Rocke, EcoThermics Corporation, US
3:20Ener-G-Rotors, Inc
T. Eveleth, Ener-G-Rotors, Inc., US
3:30AC Research Lab, Inc
T. Vo, AC Research Lab, Inc., US
3:40Motiv Power Systems, Inc
J. Castelaz, Motiv Power Systems, Inc., US
3:50Tour Engine, Inc
O. Tour, Tour Engine, Inc., US
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4:00TechConnect Ventures: Cleantech Remediation, Purification & Alternative FuelsRoom 207 A
Session chair: Armin Volkel, PARC, US
4:00Solegria Solutions, LLC
J. Black, Solegria Solutions, LLC, US
4:10EnerGreenCo
S.P. Sims, EnerGreenCo, US
4:20FlexEnergy LLC
P. Fukumoto, FlexEnergy LLC, US
4:30Natural State Research, Inc
M. Sarker, Natural State Research, Inc., US
4:40Power Ecalene Fuels, Inc
G. Jackson, Power Ecalene Fuels, Inc., US
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5:00TechConnect Investment Networking Reception - Second FloorFoyer 2nd Floor
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