Advanced Packaging & Electronics
Late News Abstracts Due: March 19th (POSTER Presentation Only)
Symposia & Topics
| Advanced Packaging — 3D Integration: | Interconnects, 3D packages, system-on-a-chip, wafer-level packaging, flexible circuits |
| Compound Semiconductors: | RFICs, CMOS, circuits, fabrication, design, testing, packagina, systems, optoelectronics |
| Nano Electronics & Photonics: | Nano Electronics, Photonics, Devices, Optoelectronics, Modeling, Memory |
| Photovoltaics: | Novel Materials & Devices, CIGS, II-VI, Thin Film, Concentrators, Space |