Microtech2010 2010
electronics & systems

Advanced Packaging & Electronics

electronics & systems  

Symposia & Topics

Advanced Packaging — 3D Integration: Interconnects, 3D packages, system-on-a-chip, wafer-level packaging, flexible circuits
Compound Semiconductors: RFICs, CMOS, circuits, fabrication, design, testing, packagina, systems, optoelectronics
Nano Electronics & Photonics: Nano Electronics, Photonics, Devices, Optoelectronics, Modeling, Memory
Photovoltaics: Novel Materials & Devices, CIGS, II-VI, Thin Film, Concentrators, Space
 

Track Sessions

Tuesday June 22

10:30 Microtech Commecialization & Applications
10:30 Nano Electronics I
10:30 Keynotes: Solar - Novel Materials for PV
1:30 Atomic Force Microscopy: Innovations and Applications
1:30 Microtech Commecialization & Applications
1:30 Nano Electronics II
2:15 TechConnect IP Partnering: Electronics & Semiconductors
3:00 Carbon Capture and Power Generation
4:00 Poster Session and TechConnect Expo (4:00 - 6:00)
 Nano Electronics, Compound Semiconductors & Photonics

Wednesday June 23

8:30 Nano & Micro Electronics, Systems and Materials - Keynotes
8:30 Government & Alternative Commercialization Funding - DOD, NASA, DOE, SBIR & RIC
10:00 Networking Coffee Break
10:30 Nano Electronics IV
10:30 Advanced Packaging Technologies
10:30 TechConnect Corporate Partnering
2:00 Nano Electronics V
3:30 TechConnect Corporate Partnering
4:00 Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo Hall
6:00 TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor

Thursday June 24

8:30 Keynotes: Transformational Nanotech
8:30 MEMS-Based Systems Solutions and Integration Approaches
10:00 TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor
10:30 Electronic Applications of Carbon Nanotubes
10:30 MEMS-Based Systems Solutions and Integration Approaches
1:30 Electronic & Sensor Applications of Carbon Nanotubes II
1:00 MEMS-Based Systems Solutions and Integration Approaches
3:00 MEMS-Based Systems Solutions and Integration Approaches
4:00 Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective
5:00 TechConnect Investment Networking Reception - Second Floor

Track Program

Tuesday June 22

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10:30Microtech Commecialization & ApplicationsRoom 205 AB
Session chair: Jeff Perkins, Yole Inc., US
10:30MEMS Market Overview
J. Perkins, Yole Inc., US
11:00What it Takes to Develop New MEMS Products: Reality Check
A.M. Fitzgerald, AM Fitzgerald, US
11:30Ultra low cost monolithic CMOS motion sensors for mass-market consumption
J. Montanyà i Silvestre, Baolab, ES
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10:30Nano Electronics IRoom 210 A
Session chair: Bob Doering, Texas Instruments, US
10:30Nano-Electronics and Nano-Spintronics (invited presentation)
D. Wang, University of California San Diego, US
10:55Carbon Nanotube Nanoelectronics and Macroelectronics (invited presentation)
C. Zhou, University of Southern California, US
11:20Graphene for Beyond CMOS (invited presentation)
L. Colombo, Texas Instruments, US
11:45Nanoscale Amorphous Silicon Devices for a Neuro-inspired Architecture (invited presentation)
E. Vogel, University of Texas at Dallas, US
12:10Nano-Electronics and Nano-Spintronics (invited presentation)
K.L. Wang, University of California Los Angeles, US
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10:30Keynotes: Solar - Novel Materials for PVRoom 204 C
Session chair: Matt Law, UC Irvine, US
10:30Thin film photovoltaics from solution-deposited semiconductor nanocrystals (overview presentation)
M. Law, University of California, Irvine, US
10:55Next-Generation Photovoltaics Research at the Colorado School of Mines (invited presentation)
K.R. Williams, Colorado School of Mines, US
11:20Nanostructured and Nanoparticles-based Solar Cells
Q. Song, IBM Almaden Research Center, US
11:45Nanowire Network Transparent Electrodes for Photovoltaics (invited presentation)
J.D. Bergeson, National Renewable Energy Laboratory, US
12:10OPV materials development and module manufacturing
Y. Wu, Solarmer, US
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1:30Atomic Force Microscopy: Innovations and ApplicationsRoom 210 C
Session chair: Greg Haugstad, University of Minnesota, US
1:30Singing in Harmony: Multifrequency AFM for Polymer Materials
R. Proksch, Asylum Research, US
2:00Material property characterization of polymeric surfaces with scanning probe microscopy
D. Yablon, ExxonMobil Research and Engineering, US
2:30Expanding Atomic Force Microscopy Applications with Multifrequency Measurements
S. Magonov, Agilent Technologies, US
3:00ScanAsyst and Peak Force QNM: Designed for Scientific Productivity, Atomic Force Microscope, Scanning Probe Microscope, SPM
S.C. Minne, Veeco Instruments, US
3:20Advanced nanoscale elastic property measurement by contact-resonance atomic force microscopy
G. Stan, R.F. Cook, National Institute of Standards and Technology, US
3:40Nanoscale Chemical Spectroscopy with the Atomic Force Microscope
C.B. Prater, D. Cook, R. Shetty, K. Kjoller, Anasys Instruments, US
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1:30Microtech Commecialization & ApplicationsRoom 205 AB
Session chair: Jeff Perkins, Yole Inc., US
1:30It’s not just about the MEMS
D. Buckley, Micralyne, CA
2:00MEMS-based Silicon Timing: Semiconductor Economics and Benefits Drive Rapid Growth
P. Sevalia, SiTime, US
2:30MEMS Applications - Oscillators
M. Crowley, Sand9, US
3:00MEMS Applications - MEMS ribbons for projectors
M. Bellis, Seikowave, JP
3:30MEMS Applications - RF MEMS Switches
J. Hilbert, wiSpry, Inc., US
4:00MEMS Applications - fluidic transport for consumer applications
F. Bartles, Bartels Mikrotechnik, DE
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1:30Nano Electronics IIRoom 210 A
Session chair: Frank Register, University of Texas, US
1:30Wafer-Scale Fabrication of Separated Carbon Nanotube Thin-Film Transistors for Display Applications and Transparent Electronics
C. Wang, J. Zhang, C. Zhou, University of Southern California, US
1:50Backside Nanoscale Texturing to Improve IR Response of Silicon Photodetectors
L. Forbes, M.Y. Louie, Oregon State University, US
2:10Control of Conducting Path in Resistive Memory Utilizing Ferritin Protein with Metal Nano Dot
M. Uenuma, B. Zheng, K. Kawano, M. Horita, S. Yoshii, I. Yamashita, Y. Uraoka, Nara Institute of Science and Technology, JP
2:30Stable Light Emiting Electrochemical Cells Based in Supramolecular Interactions
R.D. Costa, M. Lenes, E. Ortí, H.J. Bolink, S. Graber, E.C. Constable, University of Valencia, ES
2:50Optical properties of silicon nanoparticles: Influence of etching, surface oxidation and surface functionalization
A. Gupta, S. Kluge, C. Schulz, H. Wiggers, Universität Duisburg-Essen, DE
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2:15TechConnect IP Partnering: Electronics & SemiconductorsRoom 207 A
Session chair: Kenichi Mori, Fuji Electric, US
2:15Cooling electronics by liquid submersion and heat exchanger
C. Hanson, Venture Isles, LLC, US
2:25A Novel MOCVD Technology in LED and Solar Cell Applications
C. Byun, KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY(KITECH), US
2:35Multilayer Heterostructures for Application in OLEDs and Photovoltaic Devices
T. Chong, National Universtiy of Singapore, SG
2:45Low-voltage field emission scanning electron microscope
T. Kirk, Swiss federal institute of technology, Zurich (ETH Zurich), CH
2:55AFM Method for Fast Mapping of Materials Properties
L. Besemann, University of Minnesota, US
3:05SimpleSilence: Method and apparatus for controlling tonal noise from subsonic fans
F. DesRosiers, SOCPRA, CA
3:15Barium titanate nanopowder
A. Ragulya, Frantsevich Institute for Problems in Materials Science, UA
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3:00Carbon Capture and Power GenerationRoom 202 A
Session chair: Daniel Laird, Sandia National Lab, US
3:00State-of-the-Art Clean Coal Power and Technology Options for CO2 Capture
S. Wu, Hitachi Power Systems America, Ltd., US
3:20Nanostructured Photocatalytic Approach to CO2 Conversion
G. Corti, T. Cantrell, M. Beaux, T. Prakash, D.N. McIlroy, M.G. Norton, GoNano Technologies, US
3:40Economic and Job Impacts of Increased Efficiency in Existing Coal-Fired Power Plants
R.H. Bezdek, R.M. Wendling, MISI, US
4:00Development of a New Experimental Tool To Identify CO2 Absorption Parameters in Aqueous Amine Solutions
C. Wylock, S. Dehaeck, E. Boulay, P. Colinet, B. Haut, Université Libre de Bruxelles, BE
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4:00Poster Session and TechConnect Expo (4:00 - 6:00)Expo Hall
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Nano Electronics, Compound Semiconductors & PhotonicsExpo Hall
-Characteristic Optimization of Single- and Double-Gate Tunneling Field Effect Transistors
K-F Lee, M-H Han, I-S Lo, C-Y Yiu, Y. Li, National Chiao Tung University, TW
-The Effects of Gamma rays on p-channel MOSFET
M.A. Iqbal, U. Firdous, PUNJAB UNIVERSITY, PK
-Effect of temperature and γ rays radiation on the electrical and optical characteristics of Quantum well structure based laser diode
M.A. Iqbal, S. Ghani, PUNJAB UNIVERSITY, PK
-Semiconductor nanoparticles in Photocatalysis: The Emerging Art and Perspectives
A. Sharma, A. Sharma, R. Sharma, AKG College of Engineering, UPTU, IN
-An Architecture for Designing Noise-Tolerant QCA Nanocircuits
S.C. Lee, L.R. Hook IV, University of Oklahoma, US
-A New QCA Architecture for the Future of Nano-Scale Computing
L.R. Hook IV, S.C. Lee, University of Oklahoma, US
-A Fan-in Bounded Low Delay Adder for Nanotechnology
Y. Sun, M.D. Wagh, Lehigh University, US
-Electrical characteristics of self-assembled Ge nanocrystals embedded in SiO2
E.S.M. Goh, T.P. Chen, C.Q. Sun, M. Yang, Y.C. Liu, Nanyang Technological University, SG
-The Effects of Gamma rays on P-channel MOSFET
M.A. Iqbal, U. Firdous, Punjab University, PK
-Advanced Nanocomposite Materials Tailored to Solid-State Lighting Applications
J.L. Davis, K. Guzan, K. Mills, L. Han, RTI International, US
-Luminescence Properties of Tm3+-Doped YVO4 Phosphors
S.S. Yi, Silla University, KR
-Luminescence Properties of Tm3+-Doped YVO4 Phosphors
R. Balakrishnaiah, D.W. Kim, S.S. Yi, S.H. Kim, K. Jang, H.S. Lee, B.K. Moon, J.H. Jeong, Silla University, KR
-Enhanced Photoluminescence Properties of Li/Al-doped YPO4:Eu phosphors
R. Balakrishnaiah, D.W. Kim, S.S. Yi, S.H. Kim, K. Jang, H.S. Lee, B.K. Moon, J.H. Jeong, Silla University, KR
-Enhanced Photoluminescence Properties of Li/Al-doped YPO4:Eu phosphors
S.S. Yi, Silla University, KR

Wednesday June 23

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8:30Nano & Micro Electronics, Systems and Materials - KeynotesRoom 210 A
Session chair: Bob Doering, Texas Instruments, US
8:30The Post-CMOS Switch: Surveying Our Options as Scaling Fades Away (keynote)
N. Lu, IBM T.J. Watson Research Center, US
9:00Innovative Processing Solutions for 3-D Device Fabrication
T. Flaim, Brewer Science, CTO, US
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8:30Government & Alternative Commercialization Funding - DOD, NASA, DOE, SBIR & RICRoom 207 D
Session chair: Kelly Carnes, TechVision21, US
8:30DOE SBIR Funding Opportunities
D. Goodwin, US Department of Energy, US
8:50DOD Commercialization Funding Opportunities
F. Barros, US Department of Homeland Security, US
9:10NASA Commercialization Funding Opportunities
R. Pisarski, NASA/Ames, US
9:30Renewable Energy Commercialization
J. Croce, Nevada Institute for Renewable Energy Commercialization, US
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10:00Networking Coffee BreakFoyer 2nd Floor
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10:30Nano Electronics IVRoom 210 A
Session chair: Bob Doering, Texas Instruments, US
10:30Jet-printed Si nanowires for flexible backplane applications
W.S. Wong, S. Raychaudhuri, S. Sambandan, R. Lujan, R.A. Street, Palo Alto Research Center, US
10:50Self – Heating Effects in Nanowire Transistors
A. Hossain, K. Raleva, D. Vasileska, S.M. Goodnick, Arizona State University, US
11:10Neighbouring Levels Statistic and Shape of Quantum Dots: Si/Sio2
I. Filikhin, S.G. Matinyan, B. Vlahovic, North Carolina Central University, US
11:30Enhancement of Defect Tolerance in the QCA-based Programmable Logic Array (PLA)
T. Notsu, K. Miura, K. Nakamae, Osaka University, JP
11:50Critical currents in graphene ribbon Josephson junctions
P.G. Gabrielli, ENEA, IT
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10:30Advanced Packaging TechnologiesRoom 206 A
Session chair: Jeff Perkins, Yole Inc., US
10:30Advanced Packaging - Industry Overview
J. Perkins, Yole, Inc., US
11:00Application of YAG Laser Micro-Welding in MEMS Packaging
P. Bozorgi, University of California, Santa Barbara, US
11:20Silicon lid for hermetic encapsulation of electronics on implantable systems
P. Tathireddy, L. Rieth, A. Sharma, M. Wilke, M. Toepper, F. Solzbacher, University of Utah, US
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10:30TechConnect Corporate PartneringRoom 207 D
Session chair: Saeed Bagheri, University of Waterloo, CA
10:30Kodak TechConnect Partnering
B. Johnston, Eastman Kodak, US
10:50Toray Industries TechConnect Partnering
T. Yamashiki, Toray Industries America, US
11:10Fuji Electric TechConnect Partnering
K. Mori, Fuji Electric, US
11:30Sanyo TechConnect Partnering
S. Tanimoto, Sanyo, US
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2:00Nano Electronics VRoom 210 A
Session chair: Frank Register, University of Texas, US
2:00Atomistic Simulations of Electronic Structure in Realistically-Sized Wurtzite InN/GaN Quantum Dots
K. Yalavarthi, V. Gaddipati, S. Ahmed, Southern Illinois University at Carbondale, US
2:20Growth and investigations on Fe/MgO/Fe magnetic tunnel junctions fabricated by dual ion beam sputtering technique
B. Singh, P. Gupta, S. Chaudhary, D.K. Pandya, S.C. Kashyap, Inidan Institute of Technology Delhi, IN
2:40Thermal management in GaN HEMTs via heterogeneous integration using micro-transfer printing with advanced thin film diamond thermal materials
D. Hickey, Advanced Diamond Technologies, Inc., US
3:00Comprehensive Examination of Intrinsic-Parameter-Induced Characteristic Fluctuations in 16-nm-Gate CMOS Devices
M-H Han, Y. Li, National Chiao Tung University, TW
3:203-state Quantum Dot Gate FETs in Designing High Sampling Rate ADCs
S. Karmakar, J.A. Chandy, F.C. Jain, University of Connecticut, US
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3:30TechConnect Corporate PartneringRoom 207 D
Session chair: Michael Pottenger, University of California Los Angeles, US
3:30Dow TechConnect Partnering
P. Ansems, Dow, US
3:50Omron TechConnect Partnering
D. Uchida, Omron, US
4:10Chevron TechConnect Partnering
T. Unneland, Chevron, US
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4:00Poster Session and TechConnect Expo Reception (4:00 - 6:00) - Expo HallExpo Hall
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6:00TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd FloorBallroom BC

Thursday June 24

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8:30Keynotes: Transformational NanotechRoom 303 CD
Session chair: Clayton Teague, NNCO, US
8:30Nanotechnology: Path Toward Commercialization at GE
M. Butts, General Electric, US
9:00Getting the Memristor to Market
S. Williams, Hewlett Packard, US
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8:30MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
8:30Welcome and Introduction
R. Grace, Roger Grace Associates, US
8:40Micro Analytical Instruments: A Systems Approach (keynote)
J. Mueller, University of Technology Hamburg, DE
9:10MEMS-Based Systems Solutions: Introduction and Overview with Selected Case Studies of Current and Future High Volume Applications
R. Grace, Roger Grace Associates, US
9:30Smart System Integration Trends in Europe: The perspective of a European Technology Platform
H. Metras, CEA-Leti, FR
9:50MEMS-Based Photonic Systems: Hardware Synergy for Maximized User Benefits (invited)
H. Gruger, M. Scholles, H. Schenk, Fraunhofer Institute for Photonic Microsystems, DE
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10:00TechConnect Innovation Showcase Coffee Break - Ballroom 3rd FloorBallroom BC
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10:30Electronic Applications of Carbon NanotubesRoom 303 C
Session chair: Philip G. Collins, University of California, Irvine, Us
10:30Review of Carbon Nanostructure Applications for Supercapacitors (invited presentation)
S. Arepalli, Sungkyunkwan University, KR
11:00Carbon Nanotube Light Weight Electrical Conductors (invited presentation)
D.S. Lashmore, B. White, C. Lombard, Nanocomp, US
11:30Carbon-based nanocomposite EDLC supercapacitors
C. Lei, C. Lekakou, University of Surrey, UK
11:50Carbon Nanotube Field Effect Transistors using Printed Semiconducting Tubes
N. Rouhi, D. Jain, K. Zand, P.J. Burke, University of California, Irvine, US
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10:30MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
10:30A Critical Review of Thermal Management Schemes for MEMS and Electronics Cooling
N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US
10:50Co-Design of MEMS, Electronics and Packaging: Putting the “Design” Back in “Design Tools”
M. Maher, SoftMEMS, US
11:10Microfluidic System Integration (invited)
D. Sparks, Integrated Sensing Systems, US
11:30Motion MEMS: Think Outside the Box and Beyond the Chip
F. Pasolini, ST Microelectronics, IT
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1:30Electronic & Sensor Applications of Carbon Nanotubes IIRoom 303 C
Session chair: Wolfgang Bacsa, CEMES, Univ. of Toulouse, FR
1:30Biosensor circuits from single molecule electronics (invited presentation)
P.G. Collins, University of California, Irvine, US
1:50An Amplification Strategy to Label Free Opiate Drug Detection using Liquid-Gated Carbon Nanotubes Transistor
J.N. Tey, I.P.M. Wijaya, J. Wei, I. Rodriguez, S.G. Maisalkar, Singapore Institute of Manufacturing Technology, SG
2:10RNA Functionalized Carbon Nanotube for Chemical Sensing
M. Chen, S.A. Datta, S.M. Khamis, J.E. Fischer, A.T. Johnson Jr., Simmons College, US
2:30Incorporation of plasma modified multi-walled carbon nanotubes into TiO2 photoanode for dye-sensitized solar cells (DSSC)
Y.F. Chan, National Cheng Kung University, TW
2:50Aligned Carbon Nanotubes for Beyond-CMOS Electronics
C. Wang, K. Ryu, A. Badmaev, C. Zhou, University of Southern California, US
3:10Parylene-C Packaged Single-Walled Carbon Nanotube Thin film Transistors
S. Selvarasah, X. Li, A. Busnaina, M.R. Dokmeci, Northeastern University, US
3:30Selective gas sensors based on carbon nanotube mats transistor obtained using automatic air-brush machine
P. Bondavalli, L. Gorintin, P. Legagneux, Thales Research and Technology, FR
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1:00MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
1:00Welcome and Introduction
R. Grace, Roger Grace Associates, US
1:10Research Trajectories of Microsystems for Health-Care and Environmental Sensing (keynote)
Y. Gianchandani, University of Michigan Wireless Integrated Microsystems Center, US
1:40Recent Progress in MEMS Process Integration for Optical and Microfluidic Applications
P. Lin, Touch Micro-system Technology, TW
2:00Systems Approach to Inertial Motion Tracking
C. Lucien, Hillcrest Laboratories, US
2:20Overcoming the Challenges of Using Gyroscopes for Motion Sensing in Pointing Device Applications
T. Kelliher, Movea, US
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3:00MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
3:00Wafer Bonding as a Key Technology for 3D Integration of MEMS and Electronics (invited)
M. Wiemer, J. Braeuer, D. Wuensch, T. Gessner, Fraunhofer Research Institution for Electronic NanoSystems, DE
3:20Wafer-Level Testing of MEMS Devices in Controlled Vacuum Environment
A. Rumiantsev, S. Giessmann, F.-M. Werner, F. Coccetti, L. Bary, Cascade Microtech and MEMUNITY, DE
3:40Challenges and New Strategies for Inertial MEMS Testing
L. Zana, M. Tschirky, Acutronic, US
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4:00Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test PerspectiveRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
-J. Brown, MEMS and Nano Exchange, US
-K. Lightman, MEMS Industry Group, US
-W. McCulley, InterMEMS, US
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5:00TechConnect Investment Networking Reception - Second FloorFoyer 2nd Floor
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