Microtech2010 2010

Yole Développement Special Symposia on Technology Commercialization

Symposia Sponsor

Symposia Chair

Yole Développement;
Jeff Perkins Jeffrey N. Perkins
Yole, Inc., USA

Late News Abstracts Due: March 19th (POSTER Presentation Only)

Synopsis

To continue the TechConnect theme of building the connection between technical design, applications and markets, Yole Développement will be developing a series of application and market oriented conference sessions covering a mix of established, emerging and rapidly evolving applications in the fields of MEMS, Advanced Packaging, Power Electronics and Compound Semiconductors. These sessions will touch on all hot areas of development from wireless consumer markets to LED lighting to electric vehicles and photovoltaic.

MEMS Design and Foundries

As MEMS has grown main stream, so has the supply chain. In the early days if you wanted MEMS you had to make it yourself. As the business has matured and roles have been sorted out along key competencies, a viable supply chain has emerged. As that evolution occurred, the “fabless” business model has proven very successful. Presented with viable “make or buy” options, more and more companies are trying to sort through their options. The sessions under this track will present MEMS design and fabrication issues, choices and challenges.
 

MEMS for Consumer Products / Gaming / Telecom

Very clearly inertial sensors in the form of accelerometers have established their place in consumer apps. As MEMS devices continue to demonstrate their critical function and revenue generating capabilities, strong market pull is creating enormous demand for low cost IMU’s, pico projectors, oscillators, RF switches and more. These sessions will explore this exciting market.
 

Advanced Packaging — 3D Integration

Advanced packaging needs are driving an incredible convergence across a host of industries. IC is looking to MEMS for guidance, LED is looking to IC and PV is looking at all three… The sessions under this track will focus on developments specifically related to 3D integration and packaging. As designers sort out the path forward, the application will be the ultimate arbiter for solutions and as such these sessions seek to highlight shared opportunities and differentiate unique challenges at the application level.
 

Power Electronics & Compound Semiconductor Applications

Two sets of conference sessions will explore developments in Compound Semiconductors and the related Power Electronics. Driven by rapidly growing demands for performance in general and energy savings in particular, power electronics are undergoing dramatic changes. Will SiC finally come to the front of the pack? What about GaN? Or will Si manage to find a way to deliver the best cost/performance trade-off? On a broader front, will performance demands in wireless devices, Hybrid and electric vehicles, LED lighting and photovoltaic energy conversion drive the entire industry to some new common ground? The sessions under these two tracks will provide a well rounded view of developments, applications and markets.
 
Watch this space for announcements as we develop the programs. If you want to be part of these important new events please contact Jeff Perkins .
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