Microtech2010 2010

Yole Développement Special Symposia on Technology Commercialization

Symposia Sponsor

Symposia Chair

Yole Développement;
Jeff Perkins Jeffrey N. Perkins
Yole, Inc., USA

Confirmed Speakers

Jeffrey Hilbert Jeffrey Hilbert
President, wiSpry, Inc.
Paul Magill Paul A. Magill
VP Marketing & Sales
Piyush	Sevalia Piyush Sevalia
VP, Marketing
Buckley David Buckley
Vice President, Sales, Marketing and Product Line Management, Micralyne
Bellis Matt Bellis
President, Seikowave
Mats Reimark Mats Reimark
TranSiC AB
Josep Montanyŗ i Silvestre Josep Montanyà i Silvestre
Baolab Microsystems, S.L.
Frank Bartels Frank Bartels
Managing Director
Bartels Mikrotechnik
Matt Crowley Matthew Crowley
VP Corporate Development
Sand 9
Alissa M. Fitzgerald
Founder and Managing Member
AM Fitzgerald

Track Sessions

Tuesday June 22

10:30 Microtech Commecialization & Applications
1:30 Microtech Commecialization & Applications

Wednesday June 23

10:00 Networking Coffee Break
6:00 TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor

Thursday June 24

5:00 TechConnect Investment Networking Reception - Second Floor

Track Program

Tuesday June 22

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10:30Microtech Commecialization & ApplicationsRoom 205 AB
Session chair: Jeff Perkins, Yole Inc., US
10:30MEMS Market Overview
J. Perkins, Yole Inc., US
11:00What it Takes to Develop New MEMS Products: Reality Check
A.M. Fitzgerald, AM Fitzgerald, US
11:30Ultra low cost monolithic CMOS motion sensors for mass-market consumption
J. Montanyŗ i Silvestre, Baolab, ES
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1:30Microtech Commecialization & ApplicationsRoom 205 AB
Session chair: Jeff Perkins, Yole Inc., US
1:30Itís not just about the MEMS
D. Buckley, Micralyne, CA
2:00MEMS-based Silicon Timing: Semiconductor Economics and Benefits Drive Rapid Growth
P. Sevalia, SiTime, US
2:30MEMS Applications - Oscillators
M. Crowley, Sand9, US
3:00MEMS Applications - MEMS ribbons for projectors
M. Bellis, Seikowave, JP
3:30MEMS Applications - RF MEMS Switches
J. Hilbert, wiSpry, Inc., US
4:00MEMS Applications - fluidic transport for consumer applications
F. Bartles, Bartels Mikrotechnik, DE

Wednesday June 23

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10:00Networking Coffee BreakFoyer 2nd Floor
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6:00TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd FloorBallroom BC

Thursday June 24

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5:00TechConnect Investment Networking Reception - Second FloorFoyer 2nd Floor
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To continue the TechConnect theme of building the connection between technical design, applications and markets, Yole Développement will be developing a series of application and market oriented conference sessions covering a mix of established, emerging and rapidly evolving applications in the fields of MEMS, Advanced Packaging, Power Electronics and Compound Semiconductors. These sessions will touch on all hot areas of development from wireless consumer markets to LED lighting to electric vehicles and photovoltaic.

MEMS Design and Foundries

As MEMS has grown main stream, so has the supply chain. In the early days if you wanted MEMS you had to make it yourself. As the business has matured and roles have been sorted out along key competencies, a viable supply chain has emerged. As that evolution occurred, the “fabless” business model has proven very successful. Presented with viable “make or buy” options, more and more companies are trying to sort through their options. The sessions under this track will present MEMS design and fabrication issues, choices and challenges.

MEMS for Consumer Products / Gaming / Telecom

Very clearly inertial sensors in the form of accelerometers have established their place in consumer apps. As MEMS devices continue to demonstrate their critical function and revenue generating capabilities, strong market pull is creating enormous demand for low cost IMU’s, pico projectors, oscillators, RF switches and more. These sessions will explore this exciting market.

Advanced Packaging — 3D Integration

Advanced packaging needs are driving an incredible convergence across a host of industries. IC is looking to MEMS for guidance, LED is looking to IC and PV is looking at all three… The sessions under this track will focus on developments specifically related to 3D integration and packaging. As designers sort out the path forward, the application will be the ultimate arbiter for solutions and as such these sessions seek to highlight shared opportunities and differentiate unique challenges at the application level.

Power Electronics & Compound Semiconductor Applications

Two sets of conference sessions will explore developments in Compound Semiconductors and the related Power Electronics. Driven by rapidly growing demands for performance in general and energy savings in particular, power electronics are undergoing dramatic changes. Will SiC finally come to the front of the pack? What about GaN? Or will Si manage to find a way to deliver the best cost/performance trade-off? On a broader front, will performance demands in wireless devices, Hybrid and electric vehicles, LED lighting and photovoltaic energy conversion drive the entire industry to some new common ground? The sessions under these two tracks will provide a well rounded view of developments, applications and markets.
Watch this space for announcements as we develop the programs. If you want to be part of these important new events please contact Jeff Perkins .
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