MEMS-Based Systems Solutions and Integration Approaches
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Track Sessions | ||
Tuesday June 22 | ||
Wednesday June 23 | ||
| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | |
Thursday June 24 | ||
| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | |
| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | |
| 1:00 | MEMS-Based Systems Solutions and Integration Approaches | |
| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | |
| 4:00 | Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective | |
| 5:00 | TechConnect Investment Networking Reception - Second Floor | |
Track Program | ||
Wednesday June 23 | ||
| Back to Top | ||
| 6:00 | TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor | Ballroom BC |
Thursday June 24 | ||
| Back to Top | ||
| 8:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 8:30 | Welcome and Introduction R. Grace, Roger Grace Associates, US | |
| 8:40 | Micro Analytical Instruments: A Systems Approach (keynote) J. Mueller, University of Technology Hamburg, DE | |
| 9:10 | MEMS-Based Systems Solutions: Introduction and Overview with Selected Case Studies of Current and Future High Volume Applications R. Grace, Roger Grace Associates, US | |
| 9:30 | Smart System Integration Trends in Europe: The perspective of a European Technology Platform H. Metras, CEA-Leti, FR | |
| 9:50 | MEMS-Based Photonic Systems: Hardware Synergy for Maximized User Benefits (invited) H. Gruger, M. Scholles, H. Schenk, Fraunhofer Institute for Photonic Microsystems, DE | |
| Back to Top | ||
| 10:00 | TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor | Ballroom BC |
| Back to Top | ||
| 10:30 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 10:30 | A Critical Review of Thermal Management Schemes for MEMS and Electronics Cooling N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US | |
| 10:50 | Co-Design of MEMS, Electronics and Packaging: Putting the “Design” Back in “Design Tools” M. Maher, SoftMEMS, US | |
| 11:10 | Microfluidic System Integration (invited) D. Sparks, Integrated Sensing Systems, US | |
| 11:30 | Motion MEMS: Think Outside the Box and Beyond the Chip F. Pasolini, ST Microelectronics, IT | |
| Back to Top | ||
| 1:00 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 1:00 | Welcome and Introduction R. Grace, Roger Grace Associates, US | |
| 1:10 | Research Trajectories of Microsystems for Health-Care and Environmental Sensing (keynote) Y. Gianchandani, University of Michigan Wireless Integrated Microsystems Center, US | |
| 1:40 | Recent Progress in MEMS Process Integration for Optical and Microfluidic Applications P. Lin, Touch Micro-system Technology, TW | |
| 2:00 | Systems Approach to Inertial Motion Tracking C. Lucien, Hillcrest Laboratories, US | |
| 2:20 | Overcoming the Challenges of Using Gyroscopes for Motion Sensing in Pointing Device Applications T. Kelliher, Movea, US | |
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| 3:00 | MEMS-Based Systems Solutions and Integration Approaches | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| 3:00 | Wafer Bonding as a Key Technology for 3D Integration of MEMS and Electronics (invited) M. Wiemer, J. Braeuer, D. Wuensch, T. Gessner, Fraunhofer Research Institution for Electronic NanoSystems, DE | |
| 3:20 | Wafer-Level Testing of MEMS Devices in Controlled Vacuum Environment A. Rumiantsev, S. Giessmann, F.-M. Werner, F. Coccetti, L. Bary, Cascade Microtech and MEMUNITY, DE | |
| 3:40 | Challenges and New Strategies for Inertial MEMS Testing L. Zana, M. Tschirky, Acutronic, US | |
| Back to Top | ||
| 4:00 | Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective | Room 205 AB |
| Session chair: Roger Grace, Roger Grace Associates, US | ||
| - | J. Brown, MEMS and Nano Exchange, US | |
| - | K. Lightman, MEMS Industry Group, US | |
| - | W. McCulley, InterMEMS, US | |
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| 5:00 | TechConnect Investment Networking Reception - Second Floor | Foyer 2nd Floor |
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Session Description
This all-day session will address, from a global perspective, current and future applications and major issues associated with the creation of a MEMS-based system and its design and manufacturing/testing. The focus will be upon the system elements which compliment the MEMS sensor/actuator e.g. signal conditioning circuits, microcontrollers, embedded intelligence, networking circuits and their interaction with the MEMS device. System element connectivity and device/system packaging will be addressed. The session will begin with an overview of market and technology trends and the technology infrastructure to support the systems approach. World-renowned researchers from national laboratories and academia review some of their more significant current activities that are expected to form the basis of many innovative products scheduled for near-term commercialization. Technical staffers from major manufacturers and exciting new startups will present information on their technology approaches to systems solutions for current and future applications. A panel discussion will conclude the event.
Topics of interest include:
| Accelerometers | Humidity Sensors | Signal Conditioning/ASICs | RF MEMS |
| Actuators | “Smart” Systems | Design for Manufacturing/Test | System Tradeoffs |
| Chemical/Bio Sensors | Microassembly | Packaging/Connectivity | Structures |
| Design Tools/CAD | Microintegration | Photonic Sensors | Switches/Relays |
| Gyros/Rate Sensors | Nanomanufacturing | Pressure Sensors | Embedded Software |
Companies supporting these technologies will discuss recent developments in interface circuits, packaging/connectivity, MEMS software design tools, high-volume testing and specialized manufacturing equipment that are expected to play a major role in the successful commercialization of these technologies. A panel of industry experts will discuss a number of technical and commercialization issues. Audience participation is encouraged.