Microtech2010 2010

MEMS-Based Systems Solutions and Integration Approaches

systems integration
   

Symposia Sponsor

Symposia Chair

Roger Grace Associates
Roger Grace Roger Grace
President
Roger Grace Associates

Confirmed Speakers Include

Fabio Pasolini Fabio Pasolini
STMicroelectonics, Italy
Chad Lucien Chad Lucien
Vice President
Freespace® Products
Mary Ann Maher Mary Ann Maher
Chief Executive Officer
SoftMEMS, US

Larry Zana Larry Zana
Vice President, Marketing & Business Development
Acutronic, US
Nicholas Tiliakos Nicholas Tiliakos
Senior Engineer, ATK GASL, US

Prakash Krishnan Prakash Krishnan
Director of Marketing , SVTC Technologies, US

Darron Collins Darron Collins
Sensonor, NO

  Jörg Müller
University of Technology Hamburg, DE
(presentation slides - 7.3 MB PDF)
  Heinrich Grueger
Fraunhofer, Fraunhofer Institute for Photonic Microsystems, DE

  Frank-Michael Werner,
Cascade Microtech, DE

Doug Sparks Doug Sparks
Executive Vice President
Integrated Sensing Systems (ISSYS)
(presentation slides - 2.1 MB PDF)
Karen Lightman Karen Lightman
Managing Director
MEMS Industry Group, US
(presentation slides - 606 KB PDF)
Yogesh B. Gianchandani Yogesh B. Gianchandani
Professor
University of Michigan, US

Tim Kelliher Tim Kelliher
Senior Director, Engineering and Business Development, Movea Inc.

Corey Barrows Corey Barrows
ASIC North, Inc.

Joe Mallon Joe Mallon
CEO, Axept, US

  James C. Kemerling
Co-Founder and Chief Technology Officer
Triad Semiconductor, US

  Pinyen Lin
Touch Micro-system Technology, TW


  Maik Wiemer
Fraunhofer Research Institution for Electronic NanoSystems, DE

Track Sessions

Tuesday June 22

Wednesday June 23

6:00 TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd Floor

Thursday June 24

8:30 MEMS-Based Systems Solutions and Integration Approaches
10:00 TechConnect Innovation Showcase Coffee Break - Ballroom 3rd Floor
10:30 MEMS-Based Systems Solutions and Integration Approaches
1:00 MEMS-Based Systems Solutions and Integration Approaches
3:00 MEMS-Based Systems Solutions and Integration Approaches
4:00 Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test Perspective
5:00 TechConnect Investment Networking Reception - Second Floor

Track Program

Wednesday June 23

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6:00TechConnect Innovation Showcase Reception (6:00 - 8:00) - Ballroom 3rd FloorBallroom BC

Thursday June 24

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8:30MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
8:30Welcome and Introduction
R. Grace, Roger Grace Associates, US
8:40Micro Analytical Instruments: A Systems Approach (keynote)
J. Mueller, University of Technology Hamburg, DE
9:10MEMS-Based Systems Solutions: Introduction and Overview with Selected Case Studies of Current and Future High Volume Applications
R. Grace, Roger Grace Associates, US
9:30Smart System Integration Trends in Europe: The perspective of a European Technology Platform
H. Metras, CEA-Leti, FR
9:50MEMS-Based Photonic Systems: Hardware Synergy for Maximized User Benefits (invited)
H. Gruger, M. Scholles, H. Schenk, Fraunhofer Institute for Photonic Microsystems, DE
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10:00TechConnect Innovation Showcase Coffee Break - Ballroom 3rd FloorBallroom BC
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10:30MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
10:30A Critical Review of Thermal Management Schemes for MEMS and Electronics Cooling
N. Tiliakos, G. Papadopoulos, D. Modroukas, ATK GASL, US
10:50Co-Design of MEMS, Electronics and Packaging: Putting the “Design” Back in “Design Tools”
M. Maher, SoftMEMS, US
11:10Microfluidic System Integration (invited)
D. Sparks, Integrated Sensing Systems, US
11:30Motion MEMS: Think Outside the Box and Beyond the Chip
F. Pasolini, ST Microelectronics, IT
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1:00MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
1:00Welcome and Introduction
R. Grace, Roger Grace Associates, US
1:10Research Trajectories of Microsystems for Health-Care and Environmental Sensing (keynote)
Y. Gianchandani, University of Michigan Wireless Integrated Microsystems Center, US
1:40Recent Progress in MEMS Process Integration for Optical and Microfluidic Applications
P. Lin, Touch Micro-system Technology, TW
2:00Systems Approach to Inertial Motion Tracking
C. Lucien, Hillcrest Laboratories, US
2:20Overcoming the Challenges of Using Gyroscopes for Motion Sensing in Pointing Device Applications
T. Kelliher, Movea, US
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3:00MEMS-Based Systems Solutions and Integration ApproachesRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
3:00Wafer Bonding as a Key Technology for 3D Integration of MEMS and Electronics (invited)
M. Wiemer, J. Braeuer, D. Wuensch, T. Gessner, Fraunhofer Research Institution for Electronic NanoSystems, DE
3:20Wafer-Level Testing of MEMS Devices in Controlled Vacuum Environment
A. Rumiantsev, S. Giessmann, F.-M. Werner, F. Coccetti, L. Bary, Cascade Microtech and MEMUNITY, DE
3:40Challenges and New Strategies for Inertial MEMS Testing
L. Zana, M. Tschirky, Acutronic, US
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4:00Panel Discussion - Integration and Disintegration from a Design for Manufacturing and Test PerspectiveRoom 205 AB
Session chair: Roger Grace, Roger Grace Associates, US
-J. Brown, MEMS and Nano Exchange, US
-K. Lightman, MEMS Industry Group, US
-W. McCulley, InterMEMS, US
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5:00TechConnect Investment Networking Reception - Second FloorFoyer 2nd Floor
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Session Description

This all-day session will address, from a global perspective, current and future applications and major issues associated with the creation of a MEMS-based system and its design and manufacturing/testing. The focus will be upon the system elements which compliment the MEMS sensor/actuator e.g. signal conditioning circuits, microcontrollers, embedded intelligence, networking circuits and their interaction with the MEMS device.  System element connectivity and device/system packaging will be addressed.  The session will begin with an overview of market and technology trends and the technology infrastructure to support the systems approach. World-renowned researchers from national laboratories and academia review some of their more significant current activities that are expected to form the basis of many innovative products scheduled for near-term commercialization. Technical staffers from major manufacturers and exciting new startups will present information on their technology approaches to systems solutions for current and future applications.  A panel discussion will conclude the event.

Topics of interest include:

Accelerometers Humidity Sensors Signal Conditioning/ASICs RF MEMS
Actuators “Smart” Systems Design for Manufacturing/Test System Tradeoffs
Chemical/Bio Sensors Microassembly Packaging/Connectivity Structures
Design Tools/CAD Microintegration Photonic Sensors Switches/Relays
Gyros/Rate Sensors Nanomanufacturing Pressure Sensors Embedded Software

Companies supporting these technologies will discuss recent developments in interface circuits, packaging/connectivity, MEMS software design tools, high-volume testing and specialized manufacturing equipment that are expected to play a major role in the successful commercialization of these technologies. A panel of industry experts will discuss a number of technical and commercialization issues.  Audience participation is encouraged.

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