Microtech2010 2010

Program Committee

Technical Program Co-Chairs

Matthew Laudon, NSTI, USA
Bart Romanowicz, NSTI, USA
 

Special thanks to the Microtech 2010 Founding Advisors.

Stephen F. Bart, Analog Devices, Inc., USA
Bernard Courtois, TIMA-CMP, FR
Mark da Silva, Analog Devices, Inc., USA
Elena Gaura, Coventry Univ., UK
Roger Grace, Roger Grace Associates, USA
Srinivas Iyer, Los Alamos National Laboratory, USA
Chris Menzel, Dimatix, Inc., USA
Jeff Perkins, Yole, Inc., USA

Microtech 2010 Symposia Chairs

Wade Adams, Rice University, USA
Daniel Attinger, Columbia Univ., USA
Stephen F. Bart, Analog Devices, Inc., USA
Bernard Courtois, TIMA-CMP, FR
Guy A. DeRose, California Inst. of Technology, USA
Bob Doering, Texas Instruments, USA
Edward P. Furlani, Eastman Kodak Company, USA
Elena Gaura, Coventry Univ. UK
Kieth Glassford, Nanostellar, Inc.
Roger Grace, Roger Grace Associates, USA
Jason Haaheim, NanoInk, Inc., USA
Srinivas Iyer, Los Alamos National Laboratory, USA
Jurgen Keller, AMIC GmbH, Germany
Chris Menzel, Dimatix, Inc., USA
Michael Makowski, PPG Industries, US
Bernd Michel, Fraunhofer IZM & ENAS, Germany
Matt Law, Univ. of California, Irvine
Hang Lu, Georgia Institute of Technology, USA
Jeff Perkins, Yole, Inc., USA
Frank Register, Univ. of Texas, USA
Paul M. Richardson, Biotechnology Consultant, USA
Howard Schmidt, Rice Univ., USA
Aaron Stein, Brookhaven National Laboratory, USA
Loucas Tsakalakos, General Electric, USA
Xing Zhou, Nanyang Technical Univ. SG

Microsystems Committee

Narayan R. Aluru, Univ. of Illinois Urbana-Champaign, USA
Daniel Attinger, Columbia Univ., USA
Supriyo Bandyopadhyay, Virginia Commonwealth Univ., USA
Stephen F. Bart, Analog Devices, Inc., USA
Bum-Kyoo Choi, Sogang Univ., KR
Bernard Courtois, TIMA-CMP, FR
Peter Cousseau, Honeywell, USA
Mark da Silva, Analog Devices, Inc., USA
Robert W. Dutton, Stanford Univ., USA
Gary K. Fedder, Carnegie Mellon Univ., USA
Edward P. Furlani, Eastman Kodak Company, USA
Elena Gaura, Coventry Univ., UK
Steffen Hardt, Leibniz Universität Hannover, DE
Eberhard P. Hofer, Univ. of Ulm, DE
Michael Judy, Analog Devices, USA
Yozo Kanda, Kojundo Chemical Laboratory Co. LTD, JP
Jan G. Korvink, Univ. of Freiburg, DE
Mark E. Law, Univ. of Florida, USA
Mary-Ann Maher, SoftMEMS, USA
Kazunori Matsuda, Tokushima Bunri Univ., JP
Tamal Mukherjee, Carnegie Mellon Univ., USA
Andrzej Napieralski, Technical Univ. of Lodz, PL
Ruth Pachter, Air Force Research Laboratory, USA
Marcel D. Profirescu, Technical Univ. of Bucharest, RO
Marta Rencz, Technical Univ. of Budapest, HU
Siegfried Selberherr, Technical Univ. of Vienna, AT
Sudhama Shastri, California Micro Devices, USA
Armin Sulzmann, Daimler-Chrysler, DE
Dragica Vasilesca, Arizona State Univ., USA
Gerhard Wachutka, Technical Univ. of Münich, DE
Jacob White, Massachusetts Inst. of Technology, USA
Thomas Wiegele, Goodrich, USA
Andreas Wild, Freescale Semiconductor, FR
Cy Wilson, North American Space Agency, USA
Xing Zhou, Nanyang Technological Univ., SG

Fabrication Committee

Adekunle Adeyeye, National Univ. of Singapore, SG
Ronald S. Besser, Stevens Inst. of Technology, USA
Gregory R. Bogart, Symphony Acoustics, USA
Charles Kin P. Cheung, NIST, USA
Zheng Cui, Rutherford Appleton Laboratory, UK
Seth B. Darling, Argonne National Laboratory, USA
Guy A. DeRose, California Inst. of Technology, USA
Majeed Foad, Applied Materials, USA
Zhixiong Guo, Rutgers Univ., USA
Takamaro Kikkawa, Hiroshima Univ., JP
Jungsang Kim, Duke Univ., USA
Uma Krishnamoorthy, Sandia National Laboratory, USA
Andres H. La Rosa, Portland State Univ., USA
Warren Y.C. Lai, New Jersey Institute of Technology, USA
Pawitter Mangat, Motorola, USA
Vivian Ng, National Univ. of Singapore, SG
Leonidas E. Ocola, Argonne National Laboratory, USA
Sang Hyun Oh, Univ. of Minnesota, USA
Nag Patibandla, Applied Materials, USA
Stanley Pau, Univ. of Arizona, USA
John A. Rogers, Univ. of Illinois at Urbana-Champaign, USA
Nicolaas F. de Rooij, Université de Neuchâtel, CH
Aaron Stein, Brookhaven National Laboratory, USA
Rajesh Swaminathan, Applied Materials, USA
Vijay R. Tirumala, Cabot Corporation, USA
Gary Wiederrecht, Argonne National Laboratory, USA
Eric Witherspoon, Applied Materials, USA

Life Sciences Committee

Mansoor M. Amiji, Northeastern Univ., USA
Stephen H. Bryant, National Inst. of Health, USA
Fred Cohen, Univ. of California, San Francisco, USA
Tejal Desai, Univ. of California, San Francisco, USA
Robert S. Eisenberg, Rush Medical Center, Chicago, USA
Mauro Ferrari, Univ. of Texas Health Science Center at Houston, USA
Andreas Hieke, GEMIO Technologies, Inc., USA
Sorin Istrail, Brown Univ., USA
Srinivas Iyer, Los Alamos National Laboratory, USA
Brian Korgel, Univ. of Texas-Austin, USA
Jeff Lockwood, Novartis, USA
Hang Lu, Georgia Inst. of Technology, USA
Atul Parikh, Univ. of California, Davis, USA
Andrzej Przekwas, CFD Research Corporation, USA
Don Reed, Ecos Corporation, AU
George Robillard, BioMade Corporation, NL
Rafal Romanowicz, NSTI, CH
Gabriel A. Silva, Univ. of California, San Diego, USA
Srinivas Sridhar, Northeastern Univ., USA
Sarah Tao, The Charles Stark Draper Laboratory, Inc., USA
Tom Terwilliger, Los Alamos National Laboratory, USA
Vladimir Torchilin, Northeastern Univ., USA
Thomas J. Webster, Brown Univ., USA
Steven T. Wereley, Purdue Univ., USA

Physical Sciences Committee

Wade Adams, Rice Univ., USA
M.P. Anantram, NASA Ames Research Center, USA
Phaedon Avouris, IBM, USA
Wolfgang S. Bacsa, Univ. of Toulouse, FR
Gregory S. Blackman, DuPont, USA
Alexander M. Bratkovsky, Hewlett-Packard, USA
Roberto Car, Princeton Univ., USA
Fiona Case, Case Scientific, USA
Seth B. Darling, Argonne National Laboratory, USA
Alex Demkov, Univ. of Texas at Austin, USA
David K. Ferry, Arizona State Univ., USA
Toshio Fukuda, Nagoya Univ., JP
Sharon Glotzer, Univ. of Michigan, USA
William Goddard, California Inst. of Technology, USA
Gerhard Goldbeck-Wood, Accelrys, Inc., UK
Jay T. Groves, Univ. of California at Berkeley, USA
James R. Heath, California Inst. of Technology, USA
Christian Joachim, CEMES-CNRS, FR
Hannes Jonsson, Univ. of Washington, USA
Jürgen Keller, Fraunhofer Institut, Berlin, DE
Anantha Krishnan, Lawrence Livermore National Lab, USA
Shenggao Liu, ChevronTexaco, USA
Lutz Mädler, Univ. of California, Los Angeles, USA
Chris Menzel, FUJIFILM Dimatix, USA
Meyya Meyyappan, National Aeronautics and Space Agency, USA
Martin Michel, Nestlé, CH
Tinh Nguyen, NIST, USA
Sokrates Pantelides, Vanderbilt Univ., USA
Philip Pincus, Univ. of California at Santa Barbara, USA
Joachim Piprek, NUSOD Inst., USA
Sotiris E. Pratsinis, ETH Zürich, CH
Serge Prudhomme, Univ. of Texas at Austin, USA
Nick Quirke, Univ. College Dublin, Ireland
PVM Rao, IIT Delhi, India
Mark Reed, Yale Univ., USA
Philippe Renaud, Swiss Federal Inst. of Technology of Lausanne, CH
Doug Resnick, Molecular Imprints, USA
Mihail Roco, National Science Foundation, USA
Robert Rudd, Lawrence Livermore National Laboratory, USA
Brent Segal, Nantero, USA
Douglas Smith, Univ. of San Diego, USA
Donald C. Sundberg, Univ. of New Hampshire, USA
Clayton Teague, National Nanotechnology Coordination Office, USA
Loucas Tsakalakos, GE Global Research, USA
Wolfgang Windl, Ohio State Univ., USA
Xiaoguang Zhang, Oakridge National Laboratory, USA

Soft Nanotechnology Conference Committee

Fiona Case, Case Scientific, USA
Greg Haugstad, Univ. of Minnesota, USA
Pierre Panine, European Synchrotron Radiation Facility, FR
Peter Schurtenberger, Univ. of Fribourg, CH
Patrick Spicer, The Procter & Gamble Company, USA
Jan Sumerel, Dimatix, Inc., USA
Donald C. Sundberg, Univ. of New Hampshire, USA
Krassimir Velikov, Unilever Research Vlaardingen, NL

Conference Operations Manager

Sarah Wenning, NSTI & TechConnect Group, USA
 

Business & Investment Board

  • Air Products & Chemicals
  • Arrowhead Research
  • ASML
  • Atomic Venture Partners
  • BASF
  • Battery Ventures
  • Boston University
  • Buchanan Ingersoll & Rooney
  • Cabot Corporation
  • Cargill Investments
  • CMEA Ventures
  • Council of Scientific Research, India
  • Dow Chemical
  • DuPont Ventures
  • Eastman Kodak Company
  • Emerald Technology Ventures
  • ETH-Zurich
  • ExxonMobil
  • Ford Motor Company
  • Garage Ventures
  • GE Healthcare
  • General Catalyst Partners
  • General Electric
  • Genzyme
  • Georgia Tech
  • Goodrich
  • Greenberg Traurig
  • Harris and Harris Group
  • Honda
  • Honeywell
  • IBM
  • iNovia Capital
  • In-Q-Tel
  • IncTANK
  • Intel
  • Johns Hopkins University
  • Massachusetts Tech Transfer Center
  • Massachusetts Technology Development Corporation (MTDC)
  • Medtronic
  • Merck
  • Mohr, Davidow Ventures
  • Motorola
  • NanoDimension AG
  • Navigator Technology Ventures
  • New York University
  • Northwestern University
  • Novartis
  • Oklahoma State University
  • Omron
  • Palo Alto Research Center (PARC)
  • Pfizer
  • Philips
  • Procter & Gamble
  • Quantum Insight
  • Rice University
  • Samsung
  • Sanyo
  • Simon Fraser University
  • SUNY Albany
  • Texas A&M University
  • TIAX LLC
  • Tufts University
  • UBS
  • UCD, Ireland
  • UniQuest-Australia
  • Univalor LP
  • University of California-Los Angeles
  • University of California-San Diego
  • University of Florida
  • University of Geneva, CH
  • University of Minnesota
  • University of North Carolina-Chapel Hill
  • University of Notre Dame
  • University of Pittsburgh
  • University of Texas Medical Branch-Galveston
  • University of Texas Health Science Center
  • University of Waterloo, Canada
  • University of Washington
  • University of Wisconsin-Madison
  • X Seed Capital
  • Yale University
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