Microtech2010 2010

A Critical Review of Thermal Management Schemes for MEMS and Electronics Cooling

N. Tiliakos, G. Papadopoulos, D. Modroukas
ATK GASL, US

Keywords: MEMS devices, MEMS designs, MEMS applications

Abstract:

The field of consumer and military electronics is surging ahead with more sophisticated and powerful devices that are smaller and more portable than ever before. Such technological advances also come with the challenge of cooling these power hungry devices, in an efficient manner with ever-increasing constraints/requirements (eg lower weight, volume, cost, noise, better COP). This paper will review and compare various innovative air cooling thermal management methods for electronics cooling as well as present the challenges of current thermal management solutions. Some of these solutions are MEMS based and some are macro-scale schemes, depending on the required heat dissipation. Performance metrics, such as heat dissipation, Coefficient of Performance (COP), thermal resistance and efficiency will be used to compare the various cooling technologies.
 
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