Microtech2010 2010

Future requirements on electronics reliability for extended application and technology fields

W. Wondrak, R. Dudek
Daimler AG, DE

Keywords: automotive application, qualification methods, interconnects, lifetime simulation

Abstract:

The paper will highlight some of the automotive application areas from table 1 with regard to the associated reliability issues. The first part will focus on reliability aspects of miniaturized devices and interconnections, the second part will give an outlook on further application potential in future cars, where nanotechnology may provide substantial improvement due to tailored material properties.
 
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