Microtech2010 2010

A Multiscale Modeling Approach for Microelectronic Packaging Applications

N. Iwamoto, O. Hölck, S. Noijen, B. Wunderle, S. Todd
Honeywell Specialty Materials, US

Keywords: multiscale modeling, packaging reliability, interfacial reliability, metal-polymer interface, molecular modeling, atomistic modeling, mesoscale modeling, coarse grain modeling, contiuum modeling, finite element modeling


With increasing complexity of the systems and ongoing miniaturization, structural dimensions cross over from the micro- to the nanoscale. At this scale, conventional simulation methods are overtaxed: On the one hand, the continuum approach fails because material properties change as the ratio of surface to volume becomes large and the impact of molecular properties and structure increases. On the other hand the systems are too large to be modeled in atomistic detail or even coarse grained models. The key for a simulation assisted reliability assessment lies therefore in a combination of all three approaches, feeding properties calculated in atomistic detail to coarse grained and continuum models, combining the size effects with complex geometries as is required for a comprehensive evaluation procedure. This paper will report on the current efforts at developing a multiscale model to describe the reliability of the metal-polymer interface important to electronic packaging reliability. The multiscale approach is being developed on all three levels (atomistic/nanoscale, mesoscale, and continuum/macroscale) by a consortium of companies and research institutions as part of the NanoInterface project (http://www.nanointerface.eu/ ) supported by the European Framework Program 7.
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