Repeated Duplication in EHD Line Patterning on a Non-Conductive Substrate Based on Controlling the Polarity of Applied Voltages

S. Son, S. Lee, J. Choi
Sungkyunkwan University, KR

Keywords: inkjet, EHD, printing


This paper addresses the EHD printing of a high aspect ratio of metal lines as a means of forming a high conductivity of metal lines. As stated earlier, EHD printing is advantageous over conventional inkjet printing as it allows a high viscosity of ink to be used for increasing the thickness of printed lines. However, in practice, forming a high thickness of metal lines by EHD printing may not solely be from a higher viscosity of ink, but, probably be from a combination of the higher viscosity of ink and the duplication in printing. Despite the necessity of duplicated printing, there has been little study on how to make effective duplication for EHD printing. Although we demonstrated how to increase the thickness of EHD printed metal lines by duplication, we found that the repeated duplication of EHD printing of metal lines on a non-conductive substrate causes the scattering of droplets around the patterned lines due to the effect of accumulated charges. This paper presents an effective method of repeated duplications in EHD printing for forming a high aspect ratio of metal lines on a non-conductive substrate based on controlling of the polarity of the applied pulse voltages.