NSTI BioNano 2011

Wafer level packaging solutions for hermetic sealing, temperature control and vibration isolation.

Jay  Mitchell

Jay Mitchell

President & Co-Founder

Pack, Inc.

Jay Mitchell is president and co-founder of ePack Inc., a company which uses state of the art wafer-level bonding and feedthrough technologies to provide packaging solutions for MEMS and other micro-devices. In January of 2008 he finished his Ph.D. at the University of Michigan in mechanical engineering. In his research he developed several state of the art packaging techniques along with other Michigan researchers. In 2000 and 2001, he worked for Movaz Networks in the testing and design of micromirrors for telecommunications applications. He received his B.S. and M.S. from Case Western Reserve University in 1999 and 2000, respectively.

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